Abstract:
A thin film transistor array substrate and a repairing method thereof are provided. The thin film transistor array substrate comprises a substrate, plural scan lines, plural data lines, plural common lines, and plural pixels. The scan lines and the data lines are disposed over the substrate and define plural pixel areas. Each pixel is disposed in one of the pixel areas corresponding thereto. Each pixel comprises a thin film transistor, a pixel electrode, a top electrode, and a conductive line. In each pixel, the thin film transistor is coupled to the corresponding scan line and the corresponding data line, and the pixel electrode is disposed over the corresponding common line. Furthermore, the top electrode is disposed between the corresponding pixel electrode and common line, and the conductive line is disposed out of the corresponding common line and coupled between the corresponding top electrode and pixel electrode.
Abstract:
A portable computer and a shock absorber assembly thereof. The portable computer includes a body, a hard disc drive, a supporting member, an isolator, a frame, and a damper. The hard disc drive is disposed in the body. The supporting member is disposed on the hard disc drive. The isolator is disposed on the supporting member. The frame is disposed on the hard disc drive. The damper is disposed on the frame. Thus, the hard disc drive is connected to the body by the isolator, and connected to the frame by the damper. As a result, the vibration generated by the hard disc drive is isolated to avoid affecting the other portions of the portable computer.
Abstract:
An electronic apparatus. A pedestal includes a guiding member. A main body is detachably connected to the guiding member and includes a guiding groove in which the guiding member relatively slides. A positioning mechanism is movably disposed in the guiding member and guiding groove, controlling the sliding position of the guiding member with respect to the guiding groove.
Abstract:
A shielding structure for suppressing electromagnetic interference in a printed circuit board has at least a pad. A chip is disposed on the printed circuit board and a heat sink is disposed on the chip. The shielding structure includes a main body and a sidewall. In this case, the main body has a contacting portion and an opening. The contacting portion is in contact with the heat sink and one part of the heat sink protrudes from the main body via the opening. The sidewall is encircled around the main body. The sidewall is connected to the main body, has a connecting portion electrically connected to the pad. The main body, the sidewall, and the printed circuit board form a containing space, and the chip is disposed in the containing space.
Abstract:
A speaker includes a sound box, a base installed below the sound box for supporting the sound box, and a cushioning component installed between the sound box and the base for absorbing vibration generated by a speaker unit. A stand is installed below the base for supporting the sound box above the ground.
Abstract:
An adjustable connector is electrically connected with corresponding signal contacts on a circuit board by a multiple of leaf springs. As a result of the flexibility of the leaf springs, the adjustable connector can move within a small range in relation to the circuit board while keeping in electrical connection with the circuit board so as to adjust the position of the adjustable connector on the circuit board.
Abstract:
A pixel structure including an active device, a pixel electrode connected with the active device, a bottom electrode disposed under the pixel electrode, upper electrodes disposed between the pixel electrode and the bottom electrode and connected with the pixel electrode, a first dielectric layer disposed between the bottom electrode and the upper electrodes and a second dielectric layer disposed between the upper electrodes and the pixel electrode is provided. The total area of the upper electrodes overlapping with the bottom electrode is A, and the overlapping portion of the pixel electrode and each upper electrode includes a contact region and a reserved region having total area B. The dielectric constant and thickness of the first dielectric layer is ∈1 and d1; and for second dielectric layer ∈2 and d2, wherein 0.5
Abstract:
A projection apparatus. A support pedestal is slidably disposed on a base. An optical engine is disposed on the support pedestal. An alignment mechanism is disposed on the base and connected to the support pedestal, adjusting the position of the optical engine with respect to the base. The alignment mechanism includes a fixed pedestal, an adjustment screw, a nut, and a resilient member. The fixed pedestal is fixed to the base. The nut is connected to the support pedestal and slidably disposed on the base. The adjustment screw is rotatably disposed in the fixed pedestal and nut and engages the nut. The resilient member is disposed between the fixed pedestal and the nut to provide resilience to the fixed pedestal and nut, such that the adjustment screw abuts the nut.
Abstract:
A fan fasten device is for fixing at least one fan. The fan fasten device includes a chassis and a fastener. At least one fixing portion is set on the chassis, and at least one end of the fastener is connected with the fixing portion.
Abstract:
A method and apparatus for improving a uniformity of a thermally grown silicon dioxide layer including thermally growing a layer over the exposed silicon portions including silicon dioxide according to a thermal oxide growing process; exposing the gas reactant feed lines to reactant gases during at least one of the step of thermally growing a layer and a cleaning process following the step of thermally growing a layer; and, purging the gas flow pathways to bypass the reactor chamber with at least one purge gas source including an inert gas to remove residual reactant gas contaminants to improve a subsequently thermally grown silicon dioxide layer.