公开(公告)号：US08469246B2

公开(公告)日：2013-06-25

申请号：US12938127

申请日：2010-11-02

Applicant: Young Ju Lee ,  Cheol Soo Choi ,  Dong-Jin Park

Inventor： Young Ju Lee ,  Cheol Soo Choi ,  Dong-Jin Park

IPC: B60N3/10

CPC classification number: B60N3/102

Abstract: A cup holder apparatus for a vehicle may include an accommodating tray provided inside a vehicle compartment and having an accommodation space for accommodating a cup therein, a cup support member rotatably provided around a rotating shaft (Z axis) against the accommodating tray and including a bottom portion for safe-placing the cup in the accommodation space and a support portion formed in a stand from the bottom portion to support an outer periphery of the cup, and a release prevention member prepared separately from the cup support member and connected to the bottom portion of the cup support member, while being rotatably coupled to the accommodating tray, to prevent release of the cup support member from the accommodating tray, wherein the release of the release prevention member from the accommodating tray is hindered by an upper stopper formed on the accommodating tray while the cup support member is rotatably coupled to the upper stopper and is rotated around the rotating shaft.

Abstract translation: 一种用于车辆的杯架装置可以包括设置在车厢内部并且具有用于容纳杯子的容置空间的容纳盘，可旋转地设置在旋转轴（Z轴）周围的杯支撑构件抵靠容纳盘，并且包括底部 用于将杯安全地放置在容纳空间中的部分和从底部形成在支架中的支撑部分以支撑杯的外周的部分，以及与杯支撑构件分开设置并连接到底部的防脱部件 的杯支撑构件，同时可旋转地联接到容纳盘，以防止杯支撑构件从容纳盘释放，其中防止释放构件从容纳盘释放受到形成在容纳盘上的上止动器的阻碍 托盘，同时杯支撑构件可旋转地联接到上止动件并围绕旋转轴旋转 。

公开(公告)号：US20100096691A1

公开(公告)日：2010-04-22

申请号：US12491565

申请日：2009-06-25

Applicant: Jong Han SHIN ,  Hyung Soon PARK ,  Jum Yong PARK ,  Sung Jun KIM ,  Young Ju LEE

Inventor： Jong Han SHIN ,  Hyung Soon PARK ,  Jum Yong PARK ,  Sung Jun KIM ,  Young Ju LEE

IPC: H01L29/78 ,  H01L21/8234

CPC classification number: H01L21/823487 ,  H01L29/66666

Abstract: A semiconductor device having vertically aligned transistors made from pillar structures that have flat side surfaces is presented. The semiconductor device includes a semiconductor substrate, spacers, and gates. The semiconductor substrate has lo pillar structures that have flat side surfaces. The spacers are on sidewalls only on the upper portions of the pillar structures. The gates surround lower portions of the pillar structures.

Abstract translation: 提出了具有由具有平坦侧表面的柱结构制成的垂直排列的晶体管的半导体器件。 半导体器件包括半导体衬底，间隔物和栅极。 半导体衬底具有平坦的侧表面的柱状结构。 间隔物仅在支柱结构的上部的侧壁上。 门围绕柱结构的下部。

公开(公告)号：USRE41255E1

公开(公告)日：2010-04-20

申请号：US10972112

申请日：2004-10-22

Applicant: Young Ju Lee ,  Jong Goon Choi

Inventor： Young Ju Lee ,  Jong Goon Choi

IPC: G06F1/32

CPC classification number: G06F1/3203 ,  G06F1/263

Abstract: The present invention supports power management modes which includes (1) a maximum power performance mode, (2) a battery-optimized mode, and (3) a performance/optimization cycling mode for performing the maximum performance mode and the battery-optimized mode alternately within a prescribed period of time. The cycling mode allows flexibility in power management and faster charging of the battery.

Abstract translation: 本发明支持电源管理模式，其包括（1）最大功率性能模式，（2）电池优化模式，以及（3）用于执行最大性能模式和电池优化模式的性能/优化循环模式 在规定的时间内。 循环模式允许电源管理的灵活性和电池的更快充电。

公开(公告)号：US08927512B2

公开(公告)日：2015-01-06

申请号：US13241259

申请日：2011-09-23

Applicant: Seong-Wook Lee ,  Young-Ju Lee ,  Jin-Sook Jeong

Inventor： Seong-Wook Lee ,  Young-Ju Lee ,  Jin-Sook Jeong

IPC: A61K48/00 ,  C12Q1/68 ,  C12N15/115 ,  A61K47/48 ,  A61K31/7105

CPC classification number: C12N15/115 ,  A61K31/7105 ,  A61K47/543 ,  A61K47/554 ,  A61K47/60 ,  C12N2310/16 ,  C12N2310/3515 ,  C12Q1/6886 ,  C12Q2600/118

Abstract: Provided are RNA aptamer specifically binding to cancer metastasis-inducing domain of CEA (Carcinoembryonic antigen), a composition for prevention and/or inhibition and/or diagnosis of cancer metastasis containing the same as an active ingredient, and a method of prevention and/or inhibition and/or diagnosis of cancer metastasis using the same.

Abstract translation: 提供了特异性结合CEA（癌胚抗原）的癌转移诱导结构域的RNA适体，用于预防和/或抑制和/或诊断含有与活性成分相同的癌症转移的组合物，以及预防和/或 使用其抑制和/或诊断癌转移。

公开(公告)号：US20130334290A1

公开(公告)日：2013-12-19

申请号：US13592051

申请日：2012-08-22

Applicant: Young Ju LEE ,  Yun Bog KIM ,  Seon Young MYOUNG ,  Suk Jin HAM ,  Seong Chan PARK ,  Hyun Jung LEE

Inventor： Young Ju LEE ,  Yun Bog KIM ,  Seon Young MYOUNG ,  Suk Jin HAM ,  Seong Chan PARK ,  Hyun Jung LEE

IPC: B23K3/053 ,  B23K1/00

CPC classification number: B23K3/0623

Abstract: Disclosed herein is a solder paste droplet ejection apparatus including: a nozzle cap forming an appearance and including a heating electric wire provided inside thereof; a nozzle unit formed inside the nozzle cap, spaced apart from the nozzle cap, and surrounded by the nozzle cap; an ejection probe formed inside the nozzle unit, spaced apart from the nozzle unit, and surrounded by the nozzle unit; and a transfer unit formed in a top portion of the nozzle cap and used for a minute movement, wherein a solder paste supplied in a space between the nozzle unit and the ejection probe is ejected in a droplet shape along the ejection probe.

Abstract translation: 这里公开了一种焊锡膏液滴喷射装置，其包括形成外观的喷嘴帽，并且包括设置在其内部的加热电线; 喷嘴单元，其形成在所述喷嘴盖的内部，与所述喷嘴帽间隔开并且被所述喷嘴盖包围; 形成在喷嘴单元内的喷嘴，与喷嘴单元间隔开并被喷嘴单元包围; 以及形成在所述喷嘴帽的顶部并用于微小移动的转印单元，其中在所述喷嘴单元和所述喷射探针之间的空间中供应的焊膏沿着所述喷射探针以液滴形式喷射。

公开(公告)号：US20130292457A1

公开(公告)日：2013-11-07

申请号：US13554006

申请日：2012-07-20

Applicant: Hyun Jung Lee ,  Young Ju Lee ,  Yun Bog Kim ,  Seon Young Myoung ,  Suk Jin Ham ,  Seong Chan Park

Inventor： Hyun Jung Lee ,  Young Ju Lee ,  Yun Bog Kim ,  Seon Young Myoung ,  Suk Jin Ham ,  Seong Chan Park

IPC: B23K35/02 ,  B23K1/00

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  B23K3/08 ,  B23K3/087 ,  B23K35/0222 ,  B23K35/0227 ,  Y10T428/24174

Abstract: Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability.

Abstract translation: 这里公开了一种焊料片和使用其的焊接方法。 焊料片包括：多个焊料棒，其布置成具有均匀的高度h和面积密度N; 以及具有在其一个表面上形成的粘合剂并且支撑多个焊料棒的支撑件，使得多个焊料棒中的每一个的一端附接成垂直于其上形成有粘合剂的表面。 可以通过在没有掩模的情况下通过单个工艺使用焊料片而在基板的焊接部分上形成焊料凸块，因此可以简化工艺，可以降低成本，并且可以降低缺陷率，从而提高可靠性。

公开(公告)号：US08536612B2

公开(公告)日：2013-09-17

申请号：US13152566

申请日：2011-06-03

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/18 ,  H01L23/48 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US08227272B2

公开(公告)日：2012-07-24

申请号：US12481998

申请日：2009-06-10

Applicant: Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon Lee ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L21/44 ,  H01L33/00 ,  H01L29/18 ,  H01L21/00

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US20120091478A1

公开(公告)日：2012-04-19

申请号：US13239132

申请日：2011-09-21

Applicant: Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

Inventor： Chung Hoon LEE ,  Lacroix YVES ,  Hyung Soo YOON ,  Young Ju LEE

IPC: H01L33/50

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 从发光单元产生的热可以容易地消散，从而可以减少发光器件上的热负荷。 由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。

公开(公告)号：US20090272971A1

公开(公告)日：2009-11-05

申请号：US12481998

申请日：2009-06-10

Applicant: Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

Inventor： Chung Hoon LEE ,  Lacroix Yves ,  Hyung Soo Yoon ,  Young Ju Lee

IPC: H01L29/10 ,  H01L33/00 ,  H01L21/00 ,  H01L29/15

CPC classification number: H01L27/153 ,  H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a light emitting device having a plurality of light emitting cells and a package having the same mounted thereon. The light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on a portion of the N-type semiconductor layer. The plurality of light emitting cells are bonded to a submount substrate. Accordingly, heat generated from the light emitting cells can be easily dissipated, so that a thermal load on the light emitting device can be reduced. Meanwhile, since the plurality of light emitting cells are electrically connected using connection electrodes or electrode layers formed on the submount substrate, it is possible to provide light emitting cell arrays connected to each other in series. Further, it is possible to provide a light emitting device capable of being directly driven by an AC power source by connecting the serially connected light emitting cell arrays in reverse parallel to each other.

Abstract translation: 公开了一种发光器件，其具有多个发光单元及其上安装有该发光单元的封装。 发光装置包括形成在基板上的多个发光单元，每个发光单元具有位于N型半导体层的一部分上的N型半导体层和P型半导体层。 多个发光单元被接合到副安装座基板。 因此，可以容易地消散从发光单元产生的热量，从而可以减少发光器件上的热负荷。 同时，由于使用形成在副安装座基板上的连接电极或电极层使多个发光单元电连接，所以可以提供串联连接的发光单元阵列。 此外，可以提供一种能够由AC电源直接驱动的发光器件，通过将串联连接的发光单元阵列反向并联连接。