公开(公告)号：US09494748B2

公开(公告)日：2016-11-15

申请号：US14991816

申请日：2016-01-08

Applicant: Acacia Communications, Inc.

Inventor： Long Chen ,  Christopher Doerr ,  Diedrik Vermeulen

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/30 ,  G02B6/28 ,  G02B6/122 ,  G02B6/34

CPC classification number: G02B6/4225 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/1228 ,  G02B6/2852 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4227 ,  G02B2006/12109 ,  G02B2006/12126

Abstract: A photonic integrated circuit (PIC) may be optically aligned to a plurality of optical components (e.g., an optical fiber array). Optical alignment may be facilitated by the use of an optical impedance element coupled between a first input/output (I/O) optical waveguide and a second I/O optical waveguide of the PIC. The optical impedance element me be configured to be transmissive during optical alignment and to be non-transmissive during the regular operation of the PIC.

Abstract translation: 光子集成电路（PIC）可以与多个光学部件（例如，光纤阵列）光学对准。 可以通过使用耦合在PIC的第一输入/输出（I / O）光波导和第二I / O光波导之间的光阻抗元件来促进光学对准。 光阻抗元件被配置为在光学对准期间是透射的，并且在PIC的常规操作期间是不透射的。

公开(公告)号：US11409059B1

公开(公告)日：2022-08-09

申请号：US17080742

申请日：2020-10-26

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen ,  Christopher Doerr

IPC: G02B6/42 ,  G02B6/125 ,  G02B6/12

Abstract: Structures and methods for passively aligning a photonic die with a receiving substrate are described. Three alignment surfaces, having dimensions greater than a desired alignment accuracy, may be formed on the photonic die and used to passively and accurately align the photonic die to a receiving substrate in six degrees of freedom. Two of the three alignment surfaces on the photonic die may be formed in a single mask-and-etch process, while the third alignment surface may require no patterning or etching. Three complementary alignment surfaces on the receiving substrate may be formed in a single mask-and-etch process.

公开(公告)号：US10535571B1

公开(公告)日：2020-01-14

申请号：US15903586

申请日：2018-02-23

Applicant: Acacia Communications, Inc.

Inventor： Diedrik Vermeulen ,  Long Chen ,  Christopher Doerr

IPC: G02B6/12 ,  H01L21/66 ,  G02B6/122 ,  G02B6/30 ,  G01M11/00 ,  G02B6/34

Abstract: Disclosed herein are methods, structures, and devices for wafer scale testing of photonic integrated circuits.

公开(公告)号：US09874688B2

公开(公告)日：2018-01-23

申请号：US13871331

申请日：2013-04-26

Applicant: Acacia Communications, Inc.

Inventor： Christopher Doerr ,  Eric Swanson ,  Diedrik Vermeulen ,  Saeid Azemati ,  Jon Stahl

IPC: G02B6/12 ,  G02B6/10 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/4269 ,  G02B6/428 ,  H01L2224/16225

Abstract: Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.

公开(公告)号：US09557478B2

公开(公告)日：2017-01-31

申请号：US14012876

申请日：2013-08-28

Applicant: ACACIA COMMUNICATIONS INC.

Inventor： Christopher Doerr ,  Eric Swanson ,  Jon Stahl ,  Diedrik Vermeulen

IPC: G02B6/12 ,  G02B6/43 ,  G02B6/42

CPC classification number: G02B6/12 ,  G02B6/12004 ,  G02B6/42 ,  G02B6/423 ,  G02B6/428 ,  G02B6/43

Abstract: Disclosed herein are co-packaging structures, devices, and methods for integrating a photonic integrated circuit (PIC), an electronic integrated circuit including drivers and transimpedance amplifiers (TIAs) and an ASIC having analog-to-digital converters and a digital signal processor positioned on a common (the same) carrier thereby resulting in a compact coherent transceiver while lowering its cost.

Abstract translation: 本文公开了用于集成光子集成电路（PIC），包括驱动器和跨阻抗放大器（TIAs）的电子集成电路和具有模数转换器的ASIC和定位的数字信号处理器的共同封装结构，器件和方法 在相同的载体上，从而导致紧凑的相干收发器，同时降低其成本。