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公开(公告)号：US20190223802A1
公开(公告)日：2019-07-25
申请号：US16369873
申请日：2019-03-29
Applicant: Apple Inc.
Inventor： Tyler S. Bushnell , Steven J. Martisauskas , Erik G. de Jong , Andrzej T. Baranski , Serhan O. Isikman , Steven J. Banaska , Todd K. Whitehurst , Ming L. Sartee
Abstract: A wearable electronic device includes a body, a housing component, a band operable to attach the body to a body part of a user, and a force sensor coupled to the housing component. The force sensor is operable to produce a force signal based on a force exerted between the body part of the user and the housing component. A processing unit of the wearable electronic device receives the force signal from the force sensor and determines the force exerted on the housing component based thereon. The processing unit may use that force to determine a tightness of the band, determine health information for the user, adjust determined force exerted on a cover glass, and/or to perform various other actions.
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22.发明申请公开(公告)号：US20190074724A1
公开(公告)日：2019-03-07
申请号：US16122799
申请日：2018-09-05
Applicant: Apple Inc.
Inventor： Michael B. Wittenberg , Makiko K. Brzezinski , Stefan A. Kowalski , Christopher S. Graham , Morgan T. McClure , Erik G. de Jong , Trevor J. Ness , Peter J. Kardassakis , Jayesh Nath , Adam T. Clavelle , Rex Tyler Ehman
Abstract: Embodiments disclosed herein describe a wireless power receiving system for an electronic device includes: a first inductor coil configured to receive power primarily at a first frequency and from magnetic fields propagating in a first direction; and a second inductor coil configured to receive power primarily at a second frequency and from magnetic fields propagating in a second direction, wherein the first frequency is different than the second frequency.
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公开(公告)号：US10108231B2
公开(公告)日：2018-10-23
申请号：US15264544
申请日：2016-09-13
Applicant: Apple Inc.
Inventor： Erik G. de Jong , Ryan C. Perkins , Trevor J. Ness
Abstract: An elastomeric gasket is disclosed for use in a portable electronic device. The gasket encapsulates flexible circuits which are used to measure force exerted on a cover glass of the device. The gasket reduces the number of layers of material and thus reduces the risk that outside contaminants and liquids may penetrate the gasket layers and enter the portable electronic device and thereby damage the components of the device.
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公开(公告)号：US20180284843A1
公开(公告)日：2018-10-04
申请号：US15975522
申请日：2018-05-09
Applicant: Apple Inc.
Inventor： Jeffrey C. Mylvaganam , Erik G. de Jong , Dele N. Memering , Xiao Bing Cai , Palaniappan Chinnakaruppan , Jong Kong Lee , Srikanth Kamireddi , Sawako Kamei , Feng Min , Jing Zhang , Xiang Du , Sai Feng Liu
IPC: G06F1/16 , B24B37/04 , B05D1/02 , B23K26/402 , G04B39/00 , G04B37/00 , B24C11/00 , B24C1/08 , B23K26/364 , B24B29/00 , B24B7/22 , B23K103/00 , H01Q1/24
Abstract: A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.
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公开(公告)号：US20180017995A1
公开(公告)日：2018-01-18
申请号：US15212029
申请日：2016-07-15
Applicant: Apple Inc.
Inventor： Brian M. Gable , Carlo Di Nallo , Colin M. Ely , Craig A. Horton , Erik G. de Jong , Fletcher R. Rothkopf , Henry B. Wettersten , Hoishun Li , Jason C. Sauers , Jayesh Nath , Mario Martinis , Mattia Pascolini , Michael P. Coleman , Rex T. Ehman , Zheyu Wang
CPC classification number: G06F1/1656 , B29L2031/3481 , G06F1/163 , G06F1/1637 , H01Q1/22 , H01Q1/243 , H01Q21/28 , H04B1/3888 , H04M1/0202 , H04M1/0249 , H04M1/18 , H05K5/0013 , H05K5/04
Abstract: A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
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Patent Agency Ranking
公开(公告)号：US20170316657A1
公开(公告)日：2017-11-02
申请号：US15650906
申请日：2017-07-15
Applicant: Apple Inc.
Inventor： Erik G. de Jong , Fletcher R. Rothkopf , Trevor J. Ness
CPC classification number: A45C11/00 , A45C2011/002 , A45C2011/003 , G06F1/1628 , G06F1/1677 , G06K7/1413 , G08B5/22 , H04M1/04
Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.
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公开(公告)号：US09685690B2
公开(公告)日：2017-06-20
申请号：US15090781
申请日：2016-04-05
Applicant: Apple Inc.
Inventor： Miroslav Samardzija , Yiren Wang , Yuehui Ouyang , Joseph Hakim , Qingxiang Li , Robert W. Schlub , Ruben Caballero , Siwen Yong , Erik G. de Jong
IPC: H04B5/00 , H01Q1/22 , G04R60/10 , G04G21/04 , H01Q1/27 , H01Q7/00 , G06F1/16 , H01L27/32 , H04B5/02 , H01Q1/52 , H01Q9/42 , H01Q21/28 , H05K1/02 , H05K5/00 , H05K5/03
CPC classification number: H01Q1/22 , G04G21/04 , G04R60/10 , G06F1/163 , H01L27/323 , H01Q1/273 , H01Q1/52 , H01Q1/526 , H01Q7/00 , H01Q9/0421 , H01Q9/42 , H01Q21/28 , H04B5/0025 , H04B5/0031 , H04B5/0081 , H04B5/02 , H05K1/0278 , H05K5/0017 , H05K5/03
Abstract: An electronic device may have a display. A display cover layer and a transparent inner display member may overlap a display pixel layer. The display pixel layer may have an array of display pixels for displaying images for a user. A touch sensor layer may be interposed between the display pixel layer and the transparent display member. A ferromagnetic shielding layer may be mounted below the display pixel layer. A flexible printed circuit containing coils of metal signal lines that form a near-field communications loop antenna may be interposed between the ferromagnetic shielding layer and the display pixel layer. A non-near-field antenna such as an inverted-F antenna may have a resonating element mounted on an inner surface of the display cover layer. The resonating element may be interposed between the transparent display member and the display cover layer.
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公开(公告)号：US09632537B2
公开(公告)日：2017-04-25
申请号：US14033981
申请日：2013-09-23
Applicant: Apple Inc.
Inventor： Dale N. Memering , Erik G. de Jong , Fletcher R. Rothkopf , Samuel Weiss
CPC classification number: G06F1/1637 , B32B17/06 , G06F1/16 , G06F1/1613 , G06F1/1626 , G06F1/1698 , H01Q1/1271 , H01Q1/2258 , H04M1/0202 , H04M1/026 , H04M1/0266
Abstract: A ceramic material having an electronic component embedded therein, and more particularly to a sapphire surface having an electrically energized component embedded within. In some embodiments, the sapphire surface may take the form of a portion of a housing for an electronic device. Since sapphire may be substantially transparent, it may form a cover glass for a display within or forming part of the electronic device, as one example. The cover glass may be bonded, affixed, or otherwise attached to a remainder of the housing, thereby forming an enclosure for the electronic device.
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公开(公告)号：US09620571B2
公开(公告)日：2017-04-11
申请号：US15087835
申请日：2016-03-31
Applicant: Apple Inc.
Inventor： Anna-Katrina Shedletsky , Paul S. Drzaic , Erik G. de Jong , Fletcher R. Rothkopf
CPC classification number: H01L51/5284 , G02F1/13318 , G02F2001/13312 , G06F1/1637 , H01L27/3227 , H01L27/3269 , H01L51/5012 , H01L51/5218 , H01L51/5234 , H01L51/5253 , H01L51/5271 , H01L51/5281 , H01L2251/5315
Abstract: An electronic device is provided with a display and a light sensor that receives light that passes through the display. The display includes features that increase the amount of light that passes through the display. The features may be translucency enhancement features that allow light to pass directly through the display onto a light sensor mounted behind the display or may include a light-guiding layer that guides light through the display onto a light sensor mounted along an edge of the display. The translucency enhancement features may be formed in a reflector layer or an electrode layer for the display. The translucency enhancement features may include microperforations in a reflector layer of the display, a light-filtering reflector layer of the display, or a reflector layer of the display that passes a portion of the light and reflects an additional portion of the light.
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公开(公告)号：US20160217661A1
公开(公告)日：2016-07-28
申请号：US15023931
申请日：2013-09-29
Applicant: APPLE INC.
Inventor： Erik G. de Jong , Fletcher R. Rothkopf , Trevor J. Ness
Abstract: A connectible component is connected to a housing. A sensor of the housing is utilized to detect an identity element of the at connectible component. The connectible component is identified utilizing the at least one sensor. In some implementations, identification of the connectible component may identify whether or not a connectible component is connected to the housing. In other implementations, identification of the connectible component may identify the type of connectible component that is connected. In such implementations, the housing may house an electronic device and the electronic device may be configured based on the type of connectible component that is connected.
Abstract translation: 可连接部件连接到外壳。 壳体的传感器用于检测可连接部件的识别元件。 使用至少一个传感器识别可连接部件。 在一些实现中，可连接组件的识别可以标识可连接组件是否连接到外壳。 在其他实现中，可连接组件的标识可以标识所连接的可连接组件的类型。 在这种实施方式中，壳体可以容纳电子设备，并且可以基于所连接的可连接组件的类型来配置电子设备。
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