Abstract:
An electronic assembly includes a printed circuit board (PCB), an electronic component coupled to the PCB, an electrically conductive fence coupled to the PCB and surrounding a perimeter of the electronic component, and a fan assembly. The fan assembly includes a housing coupled to the fence and disposed over the electronic component and a plurality of fan blades configured to rotate within the housing.
Abstract:
A head mountable display can include a structural frame, an optical bracket coupled to the structural frame, an optical assembly adjustably secured to the optical bracket, the optical assembly including a display screen, and a stop mechanism extending from the structural frame. The optical assembly can move back-and-forth between the optical bracket and the stop.
Abstract:
An electronic device may have a display cover layer provided with an infrared-transparent antireflection coating. A pixel array may emit visible light through the cover layer and the coating. An infrared emitter may emit infrared light and an infrared sensor may receive infrared light through the coating and the cover layer. The coating may include a stack of thin-film interference layers. The stack may include alternating lower and higher refractive index layers. The layers may have thicknesses and materials that configure the coating to exhibit an infrared transmittance of greater than 94% from 920 nm to 960 nm and a photopic reflectance of less than 1.5%. The coating may reflect visible light to prevent displayed images from being obscured by visible reflections. At the same time, some photopic reflectance of the coating may be sacrificed to maximize infrared transmittance and accommodate operation by the infrared emitter and sensor.
Abstract:
A three-dimensional feature is formed in a surface of a component. Material is removed from the component by rotating an abrading tool about a first axis. While the abrading tool is rotated, the component (and/or a shaft coupled to the abrading tool) is rotated on a second axis. The second axis may be transverse to the first axis and may run through a center of the three-dimensional feature. The abrading tool may correspond to the three-dimensional feature. For example, the abrading tool may be configured to contact an entirety of an exterior of the three-dimensional feature during the removal operation, fill the three-dimensional feature during the removal operation, and/or have a shape that corresponds to the shape of the three-dimensional feature in two planes that are normal to each other.
Abstract:
A method of forming an overmolded plastic structure on a metallic plate includes first bonding a component to the metallic plate. The component is bonded with an adhesive that adheres it to the metallic plate. A plastic structure is formed over at least a portion of the component and the metallic plate and the plastic structure primarily adheres to the component. The component can be a set of metallic signal conductors that are used to route electrical signals across the metallic plate and the adhesive can be used to electrically insulate the signal conductors from the metallic plate.
Abstract:
Transparent articles for use as outer surfaces of electronic devices and methods therefor are disclosed. A transparent cover can be provided over a display of portable electronic device to provide a protective outer cover over the display. The transparent cover can include material to mark, mask or color a portion of the transparent cover, such portion thereupon becoming opaque. The material can be provided in a recessed portion of an inner surface of the transparent cover, such portion being a portion of the transparent cover that is not over a usable portion of the display. The electronic device can, for example, be a portable electronic device.
Abstract:
A head-mountable display device can include a structural frame, where a first mounting bracket can be coupled to a first side of the structural frame. In some examples, the first mounting structure can include a cantilever arm. A second mounting bracket can be coupled to a second side of the structural frame opposite the first side, where the second mounting bracket can include a mounting arm, a sensor coupled to the cantilever arm, and a display assemble slidably coupled to the mounting arm.
Abstract:
An electronic assembly includes a printed circuit board (PCB), an electronic component coupled to the PCB, an electrically conductive fence coupled to the PCB and surrounding a perimeter of the electronic component, and a fan assembly. The fan assembly includes a housing coupled to the fence and disposed over the electronic component and a plurality of fan blades configured to rotate within the housing.