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    Electronic package and method of forming the same
    21.
    发明授权
    Electronic package and method of forming the same 有权

    公开(公告)号：US12283537B2

    公开(公告)日：2025-04-22

    申请号：US17396604

    申请日：2021-08-06

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： You-Lung Yen ,  Bernd Karl Appelt

    IPC: H01L23/433 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

    Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.

    Semiconductor device package
    25.
    发明授权
    Semiconductor device package 有权

    公开(公告)号：US11664301B2

    公开(公告)日：2023-05-30

    申请号：US17205967

    申请日：2021-03-18

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： You-Lung Yen ,  Bernd Karl Appelt

    IPC: H01L23/498 ,  H01L21/48

    CPC classification number: H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49827

    Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface of the substrate. The substrate has a through opening extending between the first surface of the substrate and the second surface of the substrate. The semiconductor device package also includes a conductive pad in the through opening and approximal to the second surface of the substrate. The conductive pad has a first surface and a second surface opposite to the first surface of the conductive pad. The semiconductor device package also includes a conductive pillar in contact with the first surface of the conductive pad. The second surface of the conductive pad protrudes from the second surface of the substrate. A method of manufacturing a semiconductor device package is also disclosed.

    Leadframe including conductive pillar over land of conductive layer
    26.
    发明授权
    Leadframe including conductive pillar over land of conductive layer 有权

    公开(公告)号：US11610834B2

    公开(公告)日：2023-03-21

    申请号：US16655178

    申请日：2019-10-16

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： You-Lung Yen ,  Bernd Karl Appelt

    IPC: H01L23/495 ,  H01L23/00

    Abstract: A leadframe includes a first conductive layer, a plurality of conductive pillars and a first package body. The first conductive layer has a first surface and a second surface opposite to the first surface. The plurality of conductive pillars are disposed on the first surface of the first conductive layer. The first package body is disposed on the first surface of the first conductive layer and covers the conductive pillars. The conductive pillars and the first conductive layer are integratedly formed.

    Semiconductor package and method for manufacturing a semiconductor package
    28.
    发明授权
    Semiconductor package and method for manufacturing a semiconductor package 有权

    公开(公告)号：US10229892B2

    公开(公告)日：2019-03-12

    申请号：US15636339

    申请日：2017-06-28

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Bernd Karl Appelt

    IPC: H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H01L21/683 ,  H01L21/56

    Abstract: A semiconductor package includes at least one semiconductor element, an encapsulant, a first circuitry, a second circuitry and at least one first stud bump. The encapsulant covers at least a portion of the semiconductor element. The encapsulant has a first surface and a second surface opposite to the first surface. The first circuitry is disposed adjacent to the first surface of the encapsulant. The second circuitry is disposed adjacent to the second surface of the encapsulant. The first stud bump is disposed in the encapsulant, and electrically connects the first circuitry and the second circuitry. The first stud bump contacts the second circuitry directly.

    Electronic package including a protection layer
    29.
    发明授权
    Electronic package including a protection layer 有权

    公开(公告)号：US12198999B2

    公开(公告)日：2025-01-14

    申请号：US17477238

    申请日：2021-09-16

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： You-Lung Yen ,  Bernd Karl Appelt

    IPC: H01L23/31 ,  H01L23/29

    Abstract: An electronic package includes a carrier, a protection layer and an electronic component. The carrier includes a dielectric layer and a pad in contact with the dielectric layer. The protection layer at least partially covers the pad. The electronic component is located over the protection layer and electrically connected to the pad. At least one portion of the protection layer under the electronic component is substantially conformal with a profile of the pad or with a profile of the dielectric layer.

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