公开(公告)号：US20170073221A1

公开(公告)日：2017-03-16

申请号：US14855684

申请日：2015-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.

Abstract translation: 半导体器件封装包括载体，设置在载体的顶表面上的壁，盖和传感器元件。 所述盖包括从所述盖的底表面突出的部分，其中所述盖的突出部分接触所述壁的顶表面以限定空间。 传感器元件位于空间中。

公开(公告)号：US11296025B2

公开(公告)日：2022-04-05

申请号：US16514962

申请日：2019-07-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan ,  Shih-Chieh Tang

IPC: H01L23/528 ,  H05K1/18

Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.

公开(公告)号：US11276806B2

公开(公告)日：2022-03-15

申请号：US16734046

申请日：2020-01-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Kuang-Hsiung Chen ,  Lu-Ming Lai ,  Hsun-Wei Chan ,  Hsin-Ying Ho ,  Shih-Chieh Tang

IPC: H01L33/54 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/58 ,  H01L33/62 ,  H01L31/0232

Abstract: A semiconductor device package includes a carrier, a die, an encapsulation layer and a thickness controlling component. The die is disposed on the carrier, wherein the die includes a first surface. The encapsulation layer is disposed on the carrier, and encapsulates a portion of the first surface of the die. The encapsulation layer defines a space exposing another portion of the first surface of the die. The thickness controlling component is disposed in the space.

公开(公告)号：US10862014B2

公开(公告)日：2020-12-08

申请号：US14939331

申请日：2015-11-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Shih-Chieh Tang

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/46 ,  H01L33/48 ,  H01L33/62

Abstract: In an aspect, an optical device includes a substrate, a light source mounted on a top surface of the substrate, and a lid attached to the top surface of the substrate, the lid defining a reflective cup positioned over the light source. In another aspect, an optical device includes a substrate, a light source disposed on the substrate, and a lid disposed on the substrate. The lid defines a reflective cup for concentrating and passing light from the light source. The optical device further includes a film formed on an inner sidewall of the reflective cup for reflecting the light from the light source. The film includes a primer layer, a reflecting layer and a protective layer.

公开(公告)号：US10804173B2

公开(公告)日：2020-10-13

申请号：US15294598

申请日：2016-10-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun-Han Chen ,  Hsun-Wei Chan ,  Mei-Yi Wu

IPC: H01L23/10 ,  H01L23/04 ,  H01L25/065 ,  H01L23/00

Abstract: The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

公开(公告)号：US10526200B2

公开(公告)日：2020-01-07

申请号：US15815432

申请日：2017-11-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ching-Han Huang ,  Hsun-Wei Chan ,  Yu-Hsuan Tsai

IPC: H01L31/0232 ,  B81B7/00 ,  B81C1/00 ,  H01L31/0203

Abstract: A semiconductor device package includes: (1) a carrier; (2) a sensor element disposed on or within the carrier; and (3) a cover including a top surface, a bottom surface and an inner sidewall, the inner sidewall defining a penetrating hole extending from the top surface to the bottom surface, and the penetrating hole exposing the sensor element. The semiconductor device package is characterized such that (i) the inner sidewall is divided into an upper portion and a lower portion, the upper portion is substantially perpendicular to the top surface, and the lower portion is tilted; or (ii) the entire inner sidewall is tilted. The lower portion of the inner sidewall or the entire inner sidewall is tilted at an angle of between about 10° to less than about 90°, relative to the top surface.

公开(公告)号：US10436635B2

公开(公告)日：2019-10-08

申请号：US15267028

申请日：2016-09-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi Wen Chiang ,  Hsin-Ying Ho ,  Hsun-Wei Chan ,  Lu-Ming Lai

IPC: G01J1/04 ,  H01L31/0203 ,  H01L33/54 ,  H01L33/58 ,  H01L31/0232 ,  H01L25/16 ,  G01J1/42

Abstract: An optical device includes an active optical component including an optical area, an encapsulant covering the active optical component, and a passive optical component adhered to the encapsulant above the active optical component. The passive optical component has an optical axis, and the optical axis is substantially aligned with a center of the optical area.

公开(公告)号：US10424566B2

公开(公告)日：2019-09-24

申请号：US15396079

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chung-Wei Hsu ,  Hsin-Ying Ho ,  Hsun-Wei Chan

IPC: H01L25/16 ,  H01L31/0216 ,  G01S17/06 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/167

Abstract: An electronic device comprises a carrier, an emitter, a detector, a separation wall and a light shielding layer. The emitter is disposed on a first portion of the top surface of the carrier. The detector is disposed on a second portion of the top surface of the carrier. The separation wall is disposed on the top surface of the carrier between the emitter and the detector. The light shielding layer disposed adjacent to the top surface of the carrier and extends from the separation wall to the second portion of the carrier.

公开(公告)号：US10347570B2

公开(公告)日：2019-07-09

申请号：US15396087

申请日：2016-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsun-Wei Chan

IPC: H01L23/495 ,  H01L23/06 ,  H01L25/065

Abstract: An electronic device comprises a carrier, a leadframe, a package body and a plurality of electronic components. The carrier has an open top surface, a closed bottom surface and sidewalls extending between the closed bottom surface and the open top surface. The carrier has a circular cavity in its open top surface extending toward the closed bottom surface. The carrier includes a leadframe including a die pad and a plurality of leads. The leads are physically isolated from the die pad by at least one gap. The package body partially encapsulates the leadframe such that a portion of an upper surface of the die pad and a portion of each of the leads are exposed from the package body. The exposed portions of the leads are arranged radially along the die pad. The electronic components are disposed on the die pad.