Abstract:
Memory systems and methods for creating the same are disclosed. The memory systems can include pairs of IC packages mounted on either side of a system substrate. Contacts formed on the IC packages can be communicatively coupled with contacts of a paired IC package using vias that extend through the system substrate. The IC packages can further communicate with a controller mounted on one side of the system substrate using the vias as well as conductive traces formed in the system substrate.
Abstract:
Systems and methods are provided for improved communications in a nonvolatile memory (“NVM”) system. The system can toggle between multiple communications channels to provide point-to-point communications between a host device and NVM dies included in the system. The host device can toggle between multiple communications channels that extend to one or more memory controllers of the system, and the memory controllers can toggle between multiple communications channels that extend to the NVM dies. Power islands may be incorporated into the system to electrically isolate system components associated with inactive communications channels.
Abstract:
Systems and methods for nonvolatile memory (“NVM”) performance throttling are disclosed. Performance of an NVM system may be throttled to achieve particular data retention requirements. In particular, because higher storage temperatures tend to reduce the amount of time that data may be reliably stored in an NVM system, performance of the NVM system may be throttled to reduce system temperatures and increase data retention time.