公开(公告)号：US20140084487A1

公开(公告)日：2014-03-27

申请号：US13627905

申请日：2012-09-26

Applicant: APPLE INC.

Inventor： Jie-Hua Zhao ,  Yizhang Yang ,  Jun Zhai ,  Chih-Ming Chung

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001 ,  Y02P80/30 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages.

Abstract translation: PoP（封装封装）封装包括一个耦合到顶部封装的底部封装。 底部封装顶部的端子通过位于底部封装的上表面和顶部封装的下表面之间的电绝缘材料耦合到顶部封装的底部上的端子。 底部包装和顶部包装在加工包装的过程中被联接，该过程中施加力以使包装在一起。