公开(公告)号：US09583472B2

公开(公告)日：2017-02-28

申请号：US14637109

申请日：2015-03-03

Applicant: Apple Inc.

Inventor： Chih-Ming Chung ,  Jun Zhai ,  Yizhang Yang

IPC: H01L25/18 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/34 ,  H01L23/552 ,  H01L25/16

CPC classification number: H01L25/18 ,  H01L21/565 ,  H01L21/568 ,  H01L21/768 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/14 ,  H01L24/19 ,  H01L24/32 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/82031 ,  H01L2224/82039 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92225 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2224/81

Abstract: Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die between the first and second RDLs, and conductive pillars extending between the RDLs. A molding compound may encapsulate the stacked die and conductive pillars between the first and second RDLs.

Abstract translation: 描述了包装和形成方法。 在一个实施例中，封装系统（SiP）包括第一和第二再分配层（RDL），第一和第二RDL之间的堆叠管芯，以及在RDL之间延伸的导电柱。 模塑料可以将堆叠的管芯和导电柱塞在第一和第二RDL之间。

公开(公告)号：US20240088032A1

公开(公告)日：2024-03-14

申请号：US17932182

申请日：2022-09-14

Applicant: Apple Inc.

Inventor： Vidhya Ramachandran ,  Chi Nung Ni ,  Chueh-An Hsieh ,  Rekha Govindaraj ,  Jun Zhai ,  Long Huang ,  Rohan U. Mandrekar ,  Saumya K. Gandhi ,  Zhuo Yan ,  Yizhang Yang ,  Saurabh P. Sinha ,  Antonietta Oliva

IPC: H01L23/528 ,  H01L23/00 ,  H01L23/48 ,  H01L23/522 ,  H01L49/02

CPC classification number: H01L23/5283 ,  H01L23/481 ,  H01L23/5226 ,  H01L24/08 ,  H01L24/16 ,  H01L28/40 ,  H01L2224/08265 ,  H01L2224/16225

Abstract: Microelectronic modules are described. In an embodiment, a microelectronic module includes a module substrate, a chip mounted onto the module substrate, and a semiconductor-based integrated passive device between the chip and the module substrate. The semiconductor-based integrated passive device may include an upper RDL stack-up with thicker wiring layers than a lower BEOL stack-up. The semiconductor-based integrated passive device may be further solder bonded or hybrid bonded with the chip.

公开(公告)号：US20230031415A1

公开(公告)日：2023-02-02

申请号：US17387376

申请日：2021-07-28

Applicant: Apple Inc.

Inventor： Doron Rajwan ,  Tal Kuzi ,  Keith Cox ,  Yizhang Yang

IPC: G06F1/20 ,  G06F1/08 ,  G06F11/30

Abstract: A temperature control apparatus is disclosed. An integrated circuit (IC) includes a plurality of temperature sensors, a first thermal control loop, and a second thermal control loop. The first thermal control loop is configured to control temperature of the IC by reducing a frequency of a clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a first temperature threshold. The second thermal control loop is configured to control temperature of the IC by dithering the clock signal provided to the IC in response to a temperature at one of the plurality of temperature sensors reaching a second temperature threshold that is greater than the first temperature threshold.

公开(公告)号：US11430606B2

公开(公告)日：2022-08-30

申请号：US16335075

申请日：2017-08-24

Applicant: Apple Inc.

Inventor： David P. Cappabianca ,  Joseph T. DiBene, II ,  Shawn Searles ,  Le Wang ,  Yizhang Yang ,  Sean Cian O'Mathuna ,  Santosh Kulkarni ,  Paul McCloskey ,  Zoran Pavlovic ,  William Lawton ,  Graeme Maxwell ,  Joseph O'Brien ,  Hugh Charles Smiddy

IPC: H01F27/28 ,  H01F41/34 ,  H01F17/00 ,  H01L49/02 ,  H01F19/00

Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

公开(公告)号：US20220254410A1

公开(公告)日：2022-08-11

申请号：US17687107

申请日：2022-03-04

Applicant: Apple Inc.

Inventor： Liang Deng ,  Norman J. Rohrer ,  Yizhang Yang ,  Arpit Mittal

IPC: G11C11/406 ,  G11C11/4074 ,  G11C11/4091

Abstract: In an embodiment, a memory controller in an integrated circuit may generate refreshes for one or more DRAMs coupled to the integrated circuit according to a refresh rate. The integrated circuit may include one or more temperature sensors. A rate of change of the temperature may be determined from the temperature sensors. If the rate is greater than a threshold, the memory controller may generate refreshes according to a refresh rate specified by the DRAMs. If the rate is less than the threshold, the memory controller may generate refreshes at a reduced refresh rate.

公开(公告)号：US20220406522A1

公开(公告)日：2022-12-22

申请号：US17823017

申请日：2022-08-29

Applicant: Apple Inc.

Inventor： David P. Cappabianca ,  Joseph T. DiBene, II ,  Shawn Searles ,  Le Wang ,  Yizhang Yang ,  Sean Cian O'Mathuna ,  Santosh Kulkarni ,  Paul McCloskey ,  Zoran Pavlovic ,  William Lawton ,  Graeme Maxwell ,  Joseph O'Brien ,  Hugh Charles Smiddy

IPC: H01F41/34 ,  H01F17/00 ,  H01L49/02 ,  H01F19/00 ,  H01F27/28

Abstract: An inductor is disclosed, including a first wire, a non-conductive material, and a shell. The non-conductive material may cover the first wire, with a portion of each end of the first wire uncovered. The shell may include a top portion and a bottom portion and include at least one magnetized layer and at least one gap between the first portion and the second portion. The shell may also surround a portion of the non-conductive material.

公开(公告)号：US10978136B2

公开(公告)日：2021-04-13

申请号：US16515351

申请日：2019-07-18

Applicant: Apple Inc.

Inventor： Liang Deng ,  Norman J. Rohrer ,  Yizhang Yang ,  Arpit Mittal

IPC: G11C7/04 ,  G11C11/406 ,  G11C11/4091 ,  G11C11/4074

Abstract: In an embodiment, a memory controller in an integrated circuit may generate refreshes for one or more DRAMs coupled to the integrated circuit according to a refresh rate. The integrated circuit may include one or more temperature sensors. A rate of change of the temperature may be determined from the temperature sensors. If the rate is greater than a threshold, the memory controller may generate refreshes according to a refresh rate specified by the DRAMs. If the rate is less than the threshold, the memory controller may generate refreshes at a reduced refresh rate.

公开(公告)号：US10001800B1

公开(公告)日：2018-06-19

申请号：US14850495

申请日：2015-09-10

Applicant: Apple Inc.

Inventor： Toshinari Takayanagi ,  Yizhang Yang

IPC: G06F1/32 ,  H01L35/00 ,  G05D23/00 ,  G05F3/02

CPC classification number: G05F3/02 ,  G06F1/206 ,  G06F1/3243 ,  G06F1/3296

Abstract: Techniques are disclosed relating to power management of an integrated circuit. In one embodiment, an integrated circuit includes a plurality of temperature sensors configured to measure a plurality of temperatures at different locations in the integrated circuit. The integrated circuit further includes a power management circuit configured to determine a set of guard bands based on a temperature difference determined using the plurality of temperatures. The power management circuit is configured to adjust, using the set of guard bands, a particular one of the plurality of temperatures, and to use the adjusted particular temperature to manage power consumption of the integrated circuit. In some embodiments, the power management circuit is configured to manage the power consumption by adjusting a voltage supplied to the integrated circuit, the adjusted voltage being based on the adjusted particular temperature.

公开(公告)号：US09442025B2

公开(公告)日：2016-09-13

申请号：US14066942

申请日：2013-10-30

Applicant: Apple Inc.

Inventor： Yizhang Yang ,  Jun Zhai

IPC: G01K15/00 ,  G01K3/04 ,  G01K7/01

CPC classification number: G01K15/005 ,  G01K7/01

Abstract: In some embodiments, a method may be provided for calibrating integrated circuit temperature sensors. The method may include sensing a first temperature using a first temperature sensor and a second temperature using a second temperature sensor. The first temperature sensor may be calibrated and is external to a package of the integrated circuit. The second temperature sensor may be included in the integrated circuit. The method may include increasing a temperature of the integrated circuit. The method may include allowing the integrated circuit and the package to thermally equilibrate over a first period of time. The method may include sensing a first slope of a temperature decay by the first temperature sensor. The method may include sensing a second slope of a temperature decay by the second temperature sensor. The method may include calibrating the second temperature sensor responsive to a difference between the first and second temperatures and the first and second slopes.

Abstract translation: 在一些实施例中，可以提供用于校准集成电路温度传感器的方法。 该方法可以包括使用第一温度传感器感测第一温度，并且使用第二温度传感器来感测第二温度。 第一温度传感器可以被校准，并且在集成电路的封装外部。 第二温度传感器可以包括在集成电路中。 该方法可以包括增加集成电路的温度。 该方法可以包括允许集成电路和封装在第一时间段内热平衡。 该方法可以包括感测第一温度传感器的温度衰减的第一斜率。 该方法可以包括感测第二温度传感器的温度衰减的第二斜率。 该方法可以包括响应于第一和第二温度与第一和第二斜率之间的差异来校准第二温度传感器。

公开(公告)号：US20150117486A1

公开(公告)日：2015-04-30

申请号：US14066942

申请日：2013-10-30

Applicant: Apple Inc.

Inventor： Yizhang Yang ,  Jun Zhai

IPC: G01K15/00 ,  G01K7/01

CPC classification number: G01K15/005 ,  G01K7/01

Abstract: In some embodiments, a method may be provided for calibrating integrated circuit temperature sensors. The method may include sensing a first temperature using a first temperature sensor and a second temperature using a second temperature sensor. The first temperature sensor may be calibrated and is external to a package of the integrated circuit. The second temperature sensor may be included in the integrated circuit. The method may include increasing a temperature of the integrated circuit. The method may include allowing the integrated circuit and the package to thermally equilibrate over a first period of time. The method may include sensing a first slope of a temperature decay by the first temperature sensor. The method may include sensing a second slope of a temperature decay by the second temperature sensor. The method may include calibrating the second temperature sensor responsive to a difference between the first and second temperatures and the first and second slopes.

Abstract translation: 在一些实施例中，可以提供用于校准集成电路温度传感器的方法。 该方法可以包括使用第一温度传感器感测第一温度，并且使用第二温度传感器来感测第二温度。 第一温度传感器可以被校准，并且在集成电路的封装外部。 第二温度传感器可以包括在集成电路中。 该方法可以包括增加集成电路的温度。 该方法可以包括允许集成电路和封装在第一时间段内热平衡。 该方法可以包括感测第一温度传感器的温度衰减的第一斜率。 该方法可以包括感测第二温度传感器的温度衰减的第二斜率。 该方法可以包括响应于第一和第二温度与第一和第二斜率之间的差异来校准第二温度传感器。