公开(公告)号：US20190134775A1

公开(公告)日：2019-05-09

申请号：US16240576

申请日：2019-01-04

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: B24B37/013 ,  H01L21/67 ,  H01L21/321 ,  B24B49/10 ,  H01L21/66

CPC classification number: B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L21/67092 ,  H01L21/67248 ,  H01L22/14 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

公开(公告)号：US10207386B2

公开(公告)日：2019-02-19

申请号：US15046270

申请日：2016-02-17

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: B24B37/013 ,  B24B49/10 ,  H01L21/67 ,  H01L21/66 ,  H01L21/321

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

公开(公告)号：US20190035699A1

公开(公告)日：2019-01-31

申请号：US16150009

申请日：2018-10-02

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  H01L21/321 ,  B24B37/04 ,  B24B37/013

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US20170365532A1

公开(公告)日：2017-12-21

申请号：US15694632

申请日：2017-09-01

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Zhefu Wang ,  Zhihong Wang ,  Hassan G. Iravani ,  Dominic J. Benvegnu ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Wen-Chiang Tu

IPC: H01L21/66 ,  B24B37/04 ,  H01L21/321 ,  B24B37/013

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B37/04 ,  H01L21/3212 ,  H01L22/14

Abstract: In fabrication of an integrated circuit having a layer with a plurality of conductive interconnects, a layer of a substrate is polished to provide the layer of the integrated circuit. The layer of the substrate includes conductive lines to provide the conductive interconnects. The layer of the substrate includes a closed conductive loop formed of a conductive material in a trench. A depth of the conductive material in the trench is monitored using an inductive monitoring system and a signal is generated. Monitoring includes generating a magnetic field that intermittently passes through the closed conductive loop. A sequence of values over time is extracted from the signal, the sequence of values representing the depth of the conductive material over time.

公开(公告)号：US20170151647A1

公开(公告)日：2017-06-01

申请号：US15424670

申请日：2017-02-03

Applicant: Applied Materials, Inc.

Inventor： Alain Duboust ,  Wen-Chiang Tu ,  Shih-Haur Shen ,  Jimin Zhang ,  Ingemar Carlsson ,  Boguslaw A. Swedek ,  Zhihong Wang ,  Stephen Jew ,  David H. Mai ,  Huyen Tran

IPC: B24B37/013 ,  H01L21/306 ,  B24B37/04 ,  H01L21/66

Abstract: A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.

公开(公告)号：US20160158908A1

公开(公告)日：2016-06-09

申请号：US15046270

申请日：2016-02-17

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: B24B37/013 ,  B24B49/10 ,  H01L21/67

CPC classification number: B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L21/67092 ,  H01L21/67248 ,  H01L22/14 ,  H01L22/26

Abstract: A method of controlling polishing includes polishing a substrate at a first polishing station, monitoring the substrate with a first eddy current monitoring system to generate a first signal, determining an ending value of the first signal for an end of polishing of the substrate at the first polishing station, determining a first temperature at the first polishing station, polishing the substrate at a second polishing station, monitoring the substrate with a second eddy current monitoring system to generate a second signal, determining a starting value of the second signal for a start of polishing of the substrate at the second polishing station, determining a gain for the second polishing station based on the ending value, the starting value and the first temperature, and calculating a third signal based on the second signal and the gain.

公开(公告)号：US20150118765A1

公开(公告)日：2015-04-30

申请号：US14066509

申请日：2013-10-29

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Shih-Haur Shen ,  Boguslaw A. Swedek ,  Ingemar Carlsson ,  Doyle E. Bennett ,  Wen-Chiang Tu ,  Hassan G. Iravani ,  Tzu-Yu Liu

IPC: H01L21/66 ,  B24B37/013 ,  B24B49/10 ,  H01L21/321

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/3212 ,  H01L22/14

Abstract: In one aspect, a method of controlling polishing includes receiving a measurement of an initial thickness of a conductive film on a first substrate prior to polishing the first substrate from an in-line or stand-alone monitoring system, polishing one or more substrates in a polishing system, the one or more substrates including the first substrate, during polishing of the one or more substrates, monitoring the one or more substrates with an eddy current monitoring system to generate a first signal, determining a starting value of the first signal for a start of polishing of the first substrate, determining a gain based on the starting value and the measurement of the initial thickness, for at least a portion of the first signal collected during polishing of at least one substrate of the one or more substrates, and calculating a second signal based on the first signal and the gain.

Abstract translation: 一方面，一种控制抛光的方法包括：在从第一基板或独立监视系统抛光第一基板之前，在第一基板上接收导电膜的初始厚度的测量，在一个或多个基板中抛光一个或多个基板 抛光系统，所述一个或多个衬底包括第一衬底，在一个或多个衬底的抛光期间，用涡流监视系统监测该一个或多个衬底以产生第一信号，确定第一信号的起始值 开始抛光第一衬底，对于在一个或多个衬底的至少一个衬底的抛光期间收集的第一信号的至少一部分，基于起始值和初始厚度的测量来确定增益，并且计算 基于第一信号和增益的第二信号。