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    Capacitive sensor housing for chamber condition monitoring
    21.
    发明授权
    Capacitive sensor housing for chamber condition monitoring 有权

    公开(公告)号：US12163911B2

    公开(公告)日：2024-12-10

    申请号：US17861034

    申请日：2022-07-08

    Applicant: Applied Materials, Inc.

    Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Michael D. Willwerth ,  Daniel Thomas McCormick

    IPC: G01N27/22

    Abstract: Embodiments disclosed herein include a sensor assembly. In an embodiment, the sensor assembly comprises a sensor module and a housing assembly. In an embodiment, the sensor module comprises a substrate, a capacitor with a first electrode and a second electrode on the substrate, and a capacitive-to-digital converter (CDC) electrically coupled to the first electrode and the second electrode. In an embodiment, the housing assembly is attached to the sensor module and comprises a shaft, wherein the shaft is hollow, and a cap over a first end of the shaft, wherein the cap has an opening to expose the capacitor.

    Conductive wafer lift pin o-ring gripper with resistor
    23.
    发明授权
    Conductive wafer lift pin o-ring gripper with resistor 有权

    公开(公告)号：US11387135B2

    公开(公告)日：2022-07-12

    申请号：US15418656

    申请日：2017-01-27

    Applicant: Applied Materials, Inc.

    Inventor： Roberto Cesar Cotlear ,  Michael D. Willwerth

    IPC: H01L21/687 ,  H01L21/683 ,  H01J37/32

    Abstract: Embodiments of the present disclosure generally relate to a lift pin assembly used for de-chucking substrates. The lift pin assembly includes a base and one or more lift pin holders. Each lift pin holder includes a first portion and a second portion. The first portion is coupled to the base by a metal connector and the second portion is coupled to the first portion by a metal connector. A resistor is disposed in the first portion of the lift pin holder. The second portion includes a lift pin support for supporting a lift pin. The lift pin, the lift pin support, and the metal connectors are electrically conductive. The base is connected to a reference voltage, such as the ground, forming a path for the residual electrostatic charge in the substrate from the substrate to the reference voltage.

    CAPACITIVE SENSORS AND CAPACITIVE SENSING LOCATIONS FOR PLASMA CHAMBER CONDITION MONITORING
    25.
    发明申请
    CAPACITIVE SENSORS AND CAPACITIVE SENSING LOCATIONS FOR PLASMA CHAMBER CONDITION MONITORING 有权

    公开(公告)号：US20210280399A1

    公开(公告)日：2021-09-09

    申请号：US16812075

    申请日：2020-03-06

    Applicant: Applied Materials, Inc.

    Inventor： Yaoling Pan ,  Patrick John Tae ,  Leonard Tedeschi ,  Philip Allan Kraus ,  Michael D. Willwerth

    IPC: H01J37/32 ,  G01N27/22

    Abstract: Capacitive sensors and capacitive sensing locations for plasma chamber condition monitoring are described. In an example, a plasma processing chamber includes a chamber wall surrounding a processing region. A chamber lid is over the chamber wall and above the processing region. A chamber floor is beneath the chamber wall and below the processing region. A support pedestal is in the processing region and below the chamber lid and above the chamber floor, and the support pedestal surrounded by the chamber wall. A capacitive sensor module can be in an opening of the chamber wall. The chamber lid can include a capacitive sensor module. The chamber floor can include an evacuation port and a capacitive sensor module within or adjacent to the evacuation port. The support pedestal can include a ring structure surrounding a substrate support region, and a capacitive sensor module in an opening of the ring structure.

    COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY
    27.
    发明申请
    COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY 审中-公开

    公开(公告)号：US20190244848A1

    公开(公告)日：2019-08-08

    申请号：US15890946

    申请日：2018-02-07

    Applicant: Applied Materials, Inc.

    Inventor： Michael D. Willwerth ,  Roberto Cesar Cotlear ,  Andreas Schmid

    IPC: H01L21/683 ,  H01J37/32 ,  H01L23/467 ,  H01L23/473

    CPC classification number: H01L21/6833 ,  H01L23/467 ,  H01L23/473 ,  Y10T279/23

    Abstract: An electrostatic chuck assembly with improved thermal uniformity and stability is disclosed herein. The electrostatic chuck assembly includes a puck having a chucking electrode disposed therein and a cooling base connected to the puck. The cooling base is formed a first material and includes a top surface, a first cooling channel, a second cooling channel configured to flow coolant therethrough independent of flow through the first cooling channel, and a first thermal spreading element aligned with the first cooling channel and disposed between the first cooling channel and the puck. The first thermal spreading element is formed from a second material that has a thermal conductivity higher than a thermal conductivity of the first material.

    Gas flow for condensation reduction with a substrate processing chuck
    28.
    发明授权
    Gas flow for condensation reduction with a substrate processing chuck 有权

    公开(公告)号：US10186444B2

    公开(公告)日：2019-01-22

    申请号：US14663913

    申请日：2015-03-20

    Applicant: Applied Materials, Inc.

    Inventor： Hun Sang Kim ,  Michael D. Willwerth

    IPC: H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  C23C16/458

    Abstract: A gas flow is described to reduce condensation with a substrate processing chuck. In one example, a workpiece holder in the chamber having a puck to carry the workpiece for fabrication processes, a top plate thermally coupled to the puck, a cooling plate fastened to and thermally coupled to the top plate, the cooling plate having a cooling channel to carry a heat transfer fluid to transfer heat from the cooling plate, a base plate fastened to the cooling plate opposite the puck, and a dry gas inlet of the base plate to supply a dry gas under pressure to a space between the base plate and the cooling plate to drive ambient air from between the base plate and the cooling plate.

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