LIDAR sensor system including a dual-polarization transmit and receive optical antenna

    公开(公告)号:US11927702B2

    公开(公告)日:2024-03-12

    申请号:US18099170

    申请日:2023-01-19

    CPC classification number: G01S7/499 G01S7/4816 G01S7/4863 G01S17/931

    Abstract: A light detection and ranging (LIDAR) sensor system for a vehicle includes one or more LIDAR pixels. At least one of the one or more LIDAR pixels includes a dual-polarization optical antenna, a second optical antenna, and one or more receivers. The dual-polarization optical antenna is configured to emit a transmit beam having a first polarization orientation, and detect a return beam having a second polarization orientation. The second optical antenna is offset from the dual-polarization optical antenna by a particular distance, and is configured to detect the return beam having the second polarization orientation. The one or more receivers are configured to generate one or more signals in response to detecting the second polarization orientation of the return beam.

    Silicon photonics device for LIDAR sensor and method for fabrication

    公开(公告)号:US11415673B1

    公开(公告)日:2022-08-16

    申请号:US17535013

    申请日:2021-11-24

    Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

    Optical coupler for LIDAR sensor
    28.
    发明授权

    公开(公告)号:US11906667B2

    公开(公告)日:2024-02-20

    申请号:US17890243

    申请日:2022-08-17

    CPC classification number: G01S7/4818 G01S17/34 G01S17/931 G02B6/021

    Abstract: A LIDAR device for a vehicle includes an integrated chip. The integrated chip includes a substrate layer, a cladding layer, a waveguide, a scattering array, and a reflector layer. The cladding layer is disposed on the substrate layer to form an interface with the substrate layer. The waveguide is disposed within the cladding layer and configured to route an infrared optical field. The scattering array is disposed within the cladding layer between the waveguide and the interface and perturbs the infrared optical field and scatters the infrared optical field into a first beam propagating toward a surface of the cladding layer and into a second beam propagating towards the interface. The reflector layer is disposed within the cladding layer between the waveguide and the surface of the cladding layer to reflect the first beam towards the interface.

    Silicon photonics device for LIDAR sensor and method for fabrication

    公开(公告)号:US11906661B2

    公开(公告)日:2024-02-20

    申请号:US17853674

    申请日:2022-06-29

    CPC classification number: G01S7/4813 G01S17/931

    Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

    Silicon photonics device for LIDAR sensor and method for fabrication

    公开(公告)号:US11513289B1

    公开(公告)日:2022-11-29

    申请号:US17535024

    申请日:2021-11-24

    Abstract: A structure of a silicon photonics device for LIDAR includes a first insulating structure and a second insulating structure disposed above one or more etched silicon structures overlying a substrate member. A metal layer is disposed above the first insulating structure without a prior deposition of a diffusion barrier and adhesion layer. A thin insulating structure is disposed above the second insulating structure. A first configuration of the metal layer, the first insulating structure and the one or more etched silicon structures forms a free-space coupler. A second configuration of the thin insulating structure above the second insulating structure forms an edge coupler.

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