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公开(公告)号：US09500822B2
公开(公告)日：2016-11-22
申请号：US14591197
申请日：2015-01-07
申请人： SONY CORPORATION
CPC分类号： G02B6/4273 , G02B6/4257 , G02B6/426 , G02B6/4262 , G02B6/428 , G02B6/43 , H04B10/25
摘要： There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.
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公开(公告)号：US20160105241A1
公开(公告)日：2016-04-14
申请号：US14893965
申请日：2013-05-29
申请人： FCI ASIA PTE. LTD.
发明人： Ulrich KEIL
CPC分类号： H04B10/40 , G02B6/4272 , G02B6/4273 , H01L31/16 , H01S5/02469 , H01S5/183 , H05K1/0204 , H05K1/115 , H05K1/181
摘要： An electrical component assembly includes a substrate and first and second electrical components attached to the substrate and operably connected with each other via the substrate. In use the first electrical component generates a first amount of heat and the second component generates a second amount of heat. The first component is thermally connected with a heat sink along a first heat path and the second component is connected with the heat sink along a second, different, heat path, such that the thermal conductivity between the first and second components is lower than the thermal conductivity of the first heat path and of the second heat path.
摘要翻译： 电气部件组件包括基板和附接到基板的第一和第二电气部件，并经由基板彼此可操作地连接。 在使用中，第一电气部件产生第一量的热量，而第二部件产生第二量的热量。 第一部件沿着第一热路与散热器热连接，第二部件沿着第二不同的热路径与散热器连接，使得第一和第二部件之间的热导率低于热 第一热路和第二热路的导电性。
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3.发明授权Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components 有权具有热隔离区域的插入器配置，用于温度敏感的光电子部件公开(公告)号：US09031107B2
公开(公告)日：2015-05-12
申请号：US14510654
申请日：2014-10-09
发明人： Kalpendu Shastri , Soham Pathak , Vipulkumar Patel , Bipin Dama , Kishor Desai
CPC分类号： H01S5/02415 , G02B6/42 , G02B6/4273 , H01S5/005 , H01S5/0064 , H01S5/02248 , H01S5/024 , H01S5/02469 , H01S5/4025
摘要： An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.
摘要翻译： 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。
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公开(公告)号：US09025916B2
公开(公告)日：2015-05-05
申请号：US14102517
申请日：2013-12-11
发明人： Kuo-Fong Tseng
CPC分类号： G02B6/4214 , G02B6/4273
摘要： An optical communication apparatus includes a PCB, a photoelectric element, a driver chip, and a light waveguide. The PCB defines a groove in a surface thereof. The groove includes a bottom surface and a side surface connected to the bottom surface. The PCB includes a reflecting layer coated on the side surface. The photoelectric element includes an optical portion for emitting/receiving light carrying optical signals. An optical signal emitting/receiving direction of the photoelectric element is substantially perpendicular to the surface of the PCB. The side surface passes through a projection area of the optical portion along a direction substantially perpendicular to the surface of the PCB. An end of the light waveguide is positioned on the bottom surface of the groove and is out of the projection area of the optical portion. The reflecting layer couples optical signals between the photoelectric element and the light waveguide.
摘要翻译： 光通信装置包括PCB，光电元件，驱动芯片和光波导。 PCB在其表面中限定凹槽。 凹槽包括底表面和连接到底表面的侧表面。 PCB包括涂覆在侧表面上的反射层。 光电元件包括用于发射/接收携带光信号的光的光学部分。 光电元件的光信号发射/接收方向基本上垂直于PCB的表面。 侧表面沿着基本上垂直于PCB的表面的方向穿过光学部分的投影区域。 光波导的端部位于凹槽的底表面上，并且位于光学部分的投影区域之外。 反射层在光电元件和光波导之间耦合光信号。
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公开(公告)号：US08983302B2
公开(公告)日：2015-03-17
申请号：US12612968
申请日：2009-11-05
申请人： Eric Yuen-Jun Chan
发明人： Eric Yuen-Jun Chan
IPC分类号： H04B10/00 , H04B10/06 , H01L31/0232 , G02B6/42 , H01L31/108 , H04B10/40
CPC分类号： H01L31/02325 , G02B6/4201 , G02B6/4215 , G02B6/4246 , G02B6/4251 , G02B6/4259 , G02B6/4263 , G02B6/4273 , G02B6/428 , H01L31/108 , H04B10/40
摘要： An apparatus comprises an optical transmitter; an optical detector configured to receive optical signals from an optical fiber; an optical splitter having a first port, a second port coupled to the optical detector by the optical fiber, and a third port coupled to the optical transmitter; and a two stage amplifier system connected to an output of the optical detector. An input surface of the optical detector may have a diameter that is substantially equal to a diameter of a core in the optical fiber. The diameter of the input surface of the optical detector reduces capacitance and reduces signal distortion. The optical splitter may be configured to receive a first optical signal at the first port. The optical splitter may be configured to send the first optical signal to the second port and send a second optical signal received at the third port to the first port.
摘要翻译： 一种装置包括光发射机; 光学检测器，被配置为从光纤接收光信号; 光分路器，具有第一端口，通过光纤耦合到光检测器的第二端口以及耦合到光发射器的第三端口; 以及连接到光学检测器的输出的两级放大器系统。 光学检测器的输入表面可以具有基本上等于光纤中的芯的直径的直径。 光学检测器的输入表面的直径减小电容并减少信号失真。 光分路器可以被配置为在第一端口处接收第一光信号。 光分路器可以被配置为将第一光信号发送到第二端口，并将在第三端口接收的第二光信号发送到第一端口。
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公开(公告)号：US08950950B2
公开(公告)日：2015-02-10
申请号：US13926346
申请日：2013-06-25
申请人： Sony Corporation
CPC分类号： G02B6/4273 , G02B6/4257 , G02B6/426 , G02B6/4262 , G02B6/428 , G02B6/43 , H04B10/25
摘要： There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.
摘要翻译： 提供了一种光电混合模块，其包括其上布置有多个光通信模块的基板，所述多个光通信模块通过光纤电缆发送或接收光信号，并且在光信号和电信号之间进行转换 信号。 覆盖光通信模块的屏蔽盒包括沿远离光纤电缆安装到每个光通信模块的位置的方向倾斜的表面。
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公开(公告)号：US20140314373A1
公开(公告)日：2014-10-23
申请号：US14102517
申请日：2013-12-11
发明人： KUO-FONG TSENG
IPC分类号： G02B6/42
CPC分类号： G02B6/4214 , G02B6/4273
摘要： An optical communication apparatus includes a PCB, a photoelectric element, a driver chip, and a light waveguide. The PCB defines a groove in a surface thereof. The groove includes a bottom surface and a side surface connected to the bottom surface. The PCB includes a reflecting layer coated on the side surface. The photoelectric element includes an optical portion for emitting/receiving light carrying optical signals. An optical signal emitting/receiving direction of the photoelectric element is substantially perpendicular to the surface of the PCB. The side surface passes through a projection area of the optical portion along a direction substantially perpendicular to the surface of the PCB. An end of the light waveguide is positioned on the bottom surface of the groove and is out of the projection area of the optical portion. The reflecting layer couples optical signals between the photoelectric element and the light waveguide.
摘要翻译： 光通信装置包括PCB，光电元件，驱动芯片和光波导。 PCB在其表面中限定凹槽。 凹槽包括底表面和连接到底表面的侧表面。 PCB包括涂覆在侧表面上的反射层。 光电元件包括用于发射/接收携带光信号的光的光学部分。 光电元件的光信号发射/接收方向基本上垂直于PCB的表面。 侧表面沿着基本上垂直于PCB的表面的方向穿过光学部分的投影区域。 光波导的端部位于凹槽的底表面上，并且位于光学部分的投影区域之外。 反射层在光电元件和光波导之间耦合光信号。
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公开(公告)号：US20140044433A1
公开(公告)日：2014-02-13
申请号：US13926346
申请日：2013-06-25
申请人： Sony Corporation
IPC分类号： H04B10/25
CPC分类号： G02B6/4273 , G02B6/4257 , G02B6/426 , G02B6/4262 , G02B6/428 , G02B6/43 , H04B10/25
摘要： There is provided an optical-electrical hybrid module including a substrate on which a plurality of optical communication modules are arranged, the plurality of optical communication modules transmitting or receiving an optical signal through an optical fiber cable and performing conversion between the optical signal and an electrical signal. A shield case covering the optical communication modules includes a surface inclined in a direction away from a position in which the optical fiber cable is mounted to each optical communication module.
摘要翻译： 提供了一种光电混合模块，其包括其上布置有多个光通信模块的基板，所述多个光通信模块通过光纤电缆发送或接收光信号，并且在光信号和电信号之间进行转换 信号。 覆盖光通信模块的屏蔽盒包括沿远离光纤电缆安装到每个光通信模块的位置的方向倾斜的表面。
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公开(公告)号：US20030044131A1
公开(公告)日：2003-03-06
申请号：US10101247
申请日：2002-03-18
发明人： James Stewart , Jan Lipson
IPC分类号： G02B006/42
CPC分类号： G02B6/4292 , G02B6/4246 , G02B6/4263 , G02B6/4266 , G02B6/4271 , G02B6/4273
摘要： A temperature-controlled optoelectronic module that includes a module housing, a laser mount structure for affixing a laser package in the module housing, an optical fiber receptacle structure disposed adjacent to the laser mount structure, a thermal isolator affixed between the laser mount structure and the optical fiber receptacle structure, and a temperature controller coupled to the laser mount structure and operable to regulate temperature of the laser package is disclosed. In the absence of the thermal isolator, a nullthermal shortnull may be created between the module housing and the laser package, substantially reducing the efficiency of the temperature controller. The presence of the thermal isolator eliminates the nullthermal short,null substantially increases the effectiveness of the temperature controller and enables the miniaturization of temperature-controlled optoelectronic transceiver modules.
摘要翻译： 一种温度控制的光电子模块，包括模块壳体，用于将激光器封装固定在模块外壳中的激光器安装结构，邻近激光器安装结构设置的光纤插座结构，固定在激光安装结构和 光纤插座结构以及耦合到激光安装结构并且可操作以调节激光器封装温度的温度控制器被公开。 在没有热隔离器的情况下，可能在模块外壳和激光封装之间产生“热短路”，从而大大降低了温度控制器的效率。 热隔离器的存在消除了“热短路”，大大提高了温度控制器的有效性，并实现了温度控制的光电收发器模块的小型化。
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公开(公告)号：US06435734B2
公开(公告)日：2002-08-20
申请号：US09801665
申请日：2001-03-09
申请人： Takeshi Okada , Hiromi Nakanishi , Yoshiki Kuhara
发明人： Takeshi Okada , Hiromi Nakanishi , Yoshiki Kuhara
IPC分类号： G02B636
CPC分类号： G02B6/4239 , G02B6/4212 , G02B6/4214 , G02B6/423 , G02B6/4243 , G02B6/4253 , G02B6/4255 , G02B6/4265 , G02B6/4273 , G02B6/4286 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A triple resin layered optoelectronic module having an inner fluid or gelled resin having a refractive index which is equal to the refractive index of the fiber/waveguide at a temperature between −40° C. and +85° C. for covering the interval between the fiber/waveguide and the LD/PD chip, a medium resin with elasticity for protecting the inner resin, and an outer resin with rigidity for covering and protecting the medium resin, the substrate, the LD/PD chip and the lead frame. A cavity temporally stores the fluid inner resin for preventing the inner resin from flowing away with a help of surface tension.
摘要翻译： 三重树脂层状光电子模块，其具有内部流体或胶凝树脂，其折射率等于在-40℃至+ 85℃之间的温度下的光纤/波导的折射率，以覆盖在 纤维/波导和LD / PD芯片，具有用于保护内部树脂的弹性的中等树脂和具有用于覆盖和保护介质树脂，基板，LD / PD芯片和引线框架的刚性的外部树脂。 空腔暂时存储流体内部树脂，以防止内部树脂在表面张力的帮助下流走。
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