CHIP BONDING METHOD AND BONDING DEVICE

    公开(公告)号:US20210159208A1

    公开(公告)日:2021-05-27

    申请号:US16830834

    申请日:2020-03-26

    Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.

    ANTENNA AND COMMUNICATION SYSTEM
    24.
    发明申请

    公开(公告)号:US20250118896A1

    公开(公告)日:2025-04-10

    申请号:US18919377

    申请日:2024-10-17

    Abstract: An antenna includes a first substrate, the first substrate includes: a first base substrate; at least one first radiation unit on a side of the first base substrate; a first electrode layer on a side of the first base substrate away from the at least one first radiation unit; and at least one second radiation unit on a side of the at least one first radiation unit away from the first electrode layer; wherein an orthographic projection of each second radiation unit on the first base substrate at least partially overlaps an orthographic projection of one first radiation unit on the first base substrate; and an 10 orthographic projection of the at least one first radiation unit on the first base substrate is within an orthographic projection of the first electrode layer on the first base substrate, wherein the antenna further includes a first feeding unit.

    DUAL-POLARIZED MAGNETOELECTRIC DIPOLE ANTENNA AND ELECTRONIC DEVICE

    公开(公告)号:US20250087896A1

    公开(公告)日:2025-03-13

    申请号:US18579334

    申请日:2022-12-26

    Abstract: A dual-polarized magnetoelectric dipole antenna, including a reflection plate, electric and magnetic dipoles, where the electric dipole includes four first electrodes; the magnetic dipole includes four second electrodes; the second electrodes are in one-to-one correspondence with the first electrodes, and each second electrode is connected between a corresponding first electrode and the reflection plate; each first electrode includes first and second sides connected to each other; the first side of the first electrode is adjacent to the first side of one adjacent first electrode, and the second side of the first electrode is adjacent to the second side of other one adjacent first electrode; each second electrode includes two sub-electrodes connected to the first and second sides of a corresponding first electrode, respectively; the sub-electrode has a slit opening therein, and an extending direction of the slit opening is parallel to a plane where the reflection plate is located.

    Humidity Sensor, Manufacturing Method Therefor and Electronic Device

    公开(公告)号:US20250076241A1

    公开(公告)日:2025-03-06

    申请号:US18557964

    申请日:2023-02-23

    Abstract: A humidity sensor, a manufacturing method therefor and an electronic device are provided, and the humidity sensor includes: a base substrate, and at least one sensor unit arranged on the base substrate; the sensor unit includes: a first electrode and a support structure arranged on the base substrate, the support structure is located on at least one side of the first electrode; a second electrode located on a side of the first electrode away from the base substrate, an orthographic projection of the second electrode on the base substrate is overlapped with an orthographic projection of the first electrode on the base substrate, a space is arranged between the second electrode and the first electrode, and at least one end of the second electrode is fixed with the support structure; and an adsorption layer arranged on a side of the second electrode away from the base substrate.

    LEAKY-WAVE ANTENNA, ANTENNA ARRAY, AND ELECTRONIC DEVICE

    公开(公告)号:US20250047005A1

    公开(公告)日:2025-02-06

    申请号:US18280124

    申请日:2022-11-25

    Abstract: A leaky-wave antenna includes: first and second substrates opposite to each other; and an adjustable dielectric layer between the first and second substrates; the first substrate includes a first dielectric substrate, and first and second transmission lines on a side of the first dielectric substrate close to the adjustable dielectric layer; the first transmission line includes a first trunk line and at least one first main branch connected thereto, and a first auxiliary branch connected to the first main branch; the second transmission line includes a second trunk line and at least one second main branch connected thereto, and a second auxiliary branch connected to the second main branch; the first trunk line and the second trunk line are arranged side by side, with a first gap therebetween; the second substrate includes a second dielectric substrate and a reference electrode layer on the second dielectric substrate.

    MEMS DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS

    公开(公告)号:US20250019224A1

    公开(公告)日:2025-01-16

    申请号:US18280724

    申请日:2022-10-27

    Abstract: A MEMS device includes: a dielectric substrate; a driving electrode, first and second reference electrodes on the dielectric substrate; a first dielectric layer covering the driving electrode; and a membrane bridge on a side of the first dielectric layer away from the dielectric substrate, where a first gap is between the first reference electrode and the driving electrode; a second gap is between the second reference electrode and the driving electrode; and a thickness of a part of the first dielectric layer at each of the first and second gaps is greater than a thickness of the driving electrode; and/or, a second dielectric layer is on a side of a bridge deck of the membrane bridge close to the dielectric substrate, and an orthographic projection of the second dielectric layer on the dielectric substrate covers at least an orthographic projection of the driving electrode on the dielectric substrate.

Patent Agency Ranking