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公开(公告)号:US20220310560A1
公开(公告)日:2022-09-29
申请号:US17429929
申请日:2020-10-27
Inventor: Zhihua SUN , Yanping LIAO , Seungmin Lee , Qiujie SU , Feng QU , Yingmeng MIAO , Xibin SHAO
IPC: H01L25/065 , H01L25/00
Abstract: A display device and a method for bonding the display device are provided. The display device includes a display panel and a plurality of chip on films. The plurality of chip on films are arranged along a first edge of the display panel, and are divided into a plurality of groups of chip on films, and each group of chip on films includes at least two chip on films, and is bonded to the display panel through a same anisotropic conductive film.
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公开(公告)号:US20220123043A1
公开(公告)日:2022-04-21
申请号:US17281293
申请日:2020-01-21
Applicant: BEIJING BOE OPTOELECTRONICS TECHNICS TECHNOLOGY CO., LTD. , BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Zhichao YANG , Jian WANG , Yong ZHANG , Yingzi WANG , Feng QU , Xianglei QIN , Jian LIN , Limin ZHANG , Zepeng SUN , Liangzhen TANG , Zhilong DUAN , Honggui JIN , Yashuai AN , Lingfang NIE
Abstract: A light emitting substrate, a wiring substrate and a display device are provided. The light emitting substrate includes light emitting units and a first electrode wire. The first electrode wire includes a first wire and a second wire. The light emitting units include first light emitting units and second light emitting units, a position of each first light emitting unit is a first light emitting unit region, a position of each second light emitting unit is is a second light emitting unit region, the first wire is connected with the first light emitting unit, passes through the first light emitting unit region and is located at an outer side of the second light emitting unit region, the second wire is connected with the second light emitting unit, passes through the second light emitting unit region and is located at an outer side of the first light emitting unit region.
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公开(公告)号:US20210159208A1
公开(公告)日:2021-05-27
申请号:US16830834
申请日:2020-03-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Lili WANG , Haiwei SUN , Zhenxing TANG , Feng QU , Jing LIU , Chao LIU , Chuhang WANG , Qiangwei CUI , Ke MENG , Linhui GONG
Abstract: A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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公开(公告)号:US20250118896A1
公开(公告)日:2025-04-10
申请号:US18919377
申请日:2024-10-17
Inventor: Chunnan FENG , Zhifeng ZHANG , Yong LI , Haoyang ZHANG , Chuncheng CHE , Jingjun DU , Jiaqiang WANG , Feng QU
Abstract: An antenna includes a first substrate, the first substrate includes: a first base substrate; at least one first radiation unit on a side of the first base substrate; a first electrode layer on a side of the first base substrate away from the at least one first radiation unit; and at least one second radiation unit on a side of the at least one first radiation unit away from the first electrode layer; wherein an orthographic projection of each second radiation unit on the first base substrate at least partially overlaps an orthographic projection of one first radiation unit on the first base substrate; and an 10 orthographic projection of the at least one first radiation unit on the first base substrate is within an orthographic projection of the first electrode layer on the first base substrate, wherein the antenna further includes a first feeding unit.
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公开(公告)号:US20250087896A1
公开(公告)日:2025-03-13
申请号:US18579334
申请日:2022-12-26
Inventor: Dongdong ZHANG , Shihua WANG , Youjian HU , Yali WANG , Feng QU , Biqi LI
Abstract: A dual-polarized magnetoelectric dipole antenna, including a reflection plate, electric and magnetic dipoles, where the electric dipole includes four first electrodes; the magnetic dipole includes four second electrodes; the second electrodes are in one-to-one correspondence with the first electrodes, and each second electrode is connected between a corresponding first electrode and the reflection plate; each first electrode includes first and second sides connected to each other; the first side of the first electrode is adjacent to the first side of one adjacent first electrode, and the second side of the first electrode is adjacent to the second side of other one adjacent first electrode; each second electrode includes two sub-electrodes connected to the first and second sides of a corresponding first electrode, respectively; the sub-electrode has a slit opening therein, and an extending direction of the slit opening is parallel to a plane where the reflection plate is located.
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公开(公告)号:US20250076241A1
公开(公告)日:2025-03-06
申请号:US18557964
申请日:2023-02-23
Applicant: BOE Technology Group Co., Ltd.
Inventor: Jianxing LIU , Jingwen GUO , Qianhong WU , Chunxin LI , Jianyun ZHAO , Zibo CAO , Feng QU , Biqi LI
Abstract: A humidity sensor, a manufacturing method therefor and an electronic device are provided, and the humidity sensor includes: a base substrate, and at least one sensor unit arranged on the base substrate; the sensor unit includes: a first electrode and a support structure arranged on the base substrate, the support structure is located on at least one side of the first electrode; a second electrode located on a side of the first electrode away from the base substrate, an orthographic projection of the second electrode on the base substrate is overlapped with an orthographic projection of the first electrode on the base substrate, a space is arranged between the second electrode and the first electrode, and at least one end of the second electrode is fixed with the support structure; and an adsorption layer arranged on a side of the second electrode away from the base substrate.
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公开(公告)号:US20250047005A1
公开(公告)日:2025-02-06
申请号:US18280124
申请日:2022-11-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Cheng PAN , Shiqiao ZHANG , Jia FANG , Feng QU
Abstract: A leaky-wave antenna includes: first and second substrates opposite to each other; and an adjustable dielectric layer between the first and second substrates; the first substrate includes a first dielectric substrate, and first and second transmission lines on a side of the first dielectric substrate close to the adjustable dielectric layer; the first transmission line includes a first trunk line and at least one first main branch connected thereto, and a first auxiliary branch connected to the first main branch; the second transmission line includes a second trunk line and at least one second main branch connected thereto, and a second auxiliary branch connected to the second main branch; the first trunk line and the second trunk line are arranged side by side, with a first gap therebetween; the second substrate includes a second dielectric substrate and a reference electrode layer on the second dielectric substrate.
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公开(公告)号:US20250044656A1
公开(公告)日:2025-02-06
申请号:US18922461
申请日:2024-10-22
Applicant: BOE Technology Group Co., Ltd.
Inventor: Zhao CUI , Zhonglan ZHAO , Feng ZHANG , Wenqu LIU , Zhijun LV , Liwen DONG , Detian MENG , Dongfei HOU , Yuqiao LI , Mengya SONG , Guoteng LI , Feng QU
IPC: G02F1/1368 , G02F1/1333 , H01Q3/36
Abstract: A liquid crystal phase shifter includes: a first substrate; a second substrate, provided opposite to the first substrate; a liquid crystal layer, provided between the first substrate and the second substrate; and a phase shift region, including a first electrode, a second electrode and a control circuit, where the first electrode is provided on a side of the first substrate close to the second substrate, the second electrode is provided on a side of the second substrate close to the first substrate, an orthographic projection of the second electrode on the first substrate partially overlaps with an orthographic projection of the first electrode on the first substrate, and the second electrode is grounded.
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公开(公告)号:US20250019224A1
公开(公告)日:2025-01-16
申请号:US18280724
申请日:2022-10-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Jianxing LIU , Jingwen GUO , Qianhong WU , Chunxin LI , Zibo CAO , Jianyun ZHAO , Feng QU , Biqi LI
Abstract: A MEMS device includes: a dielectric substrate; a driving electrode, first and second reference electrodes on the dielectric substrate; a first dielectric layer covering the driving electrode; and a membrane bridge on a side of the first dielectric layer away from the dielectric substrate, where a first gap is between the first reference electrode and the driving electrode; a second gap is between the second reference electrode and the driving electrode; and a thickness of a part of the first dielectric layer at each of the first and second gaps is greater than a thickness of the driving electrode; and/or, a second dielectric layer is on a side of a bridge deck of the membrane bridge close to the dielectric substrate, and an orthographic projection of the second dielectric layer on the dielectric substrate covers at least an orthographic projection of the driving electrode on the dielectric substrate.
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公开(公告)号:US20240413511A1
公开(公告)日:2024-12-12
申请号:US18696761
申请日:2022-08-26
Inventor: Yi DING , Yifeng QIN , Hailong LIAN , Haocheng JIA , Feng QU , Chuncheng CHE
Abstract: An adjustable phase shifter and a manufacturing method therefor, and an electronic device. The adjustable phase shifter includes: a first substrate and a second substrate, which are arranged opposite each other; an adjustable dielectric layer, which is arranged between the first substrate and the second substrate; a first electrode, which is located on the side of the first substrate facing the adjustable dielectric layer; and a second electrode, which is located on the side of the second substrate facing the adjustable dielectric layer, wherein an adjustable capacitor is formed in an overlap region between the first electrode and the second electrode.
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