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公开(公告)号：US20210296394A1
公开(公告)日：2021-09-23
申请号：US17264036
申请日：2020-06-15
发明人： Ke MENG , Qiangwei CUI , Chao LIU , Lili WANG , Chuhang WANG , Yutian CHU , Linhui GONG
摘要： An array substrate and a manufacturing method thereof, a display panel, and a display device are provided. The array substrate includes a bonding region and a non-bonding region, and further includes: a rigid substrate, in the non-bonding region, a driving circuit layer, in the non-bonding region; a light-emitting diode layer, on a side of the driving circuit layer away from the rigid substrate; a flexible base layer, m the bonding region and on the same side of the rigid substrate as the driving circuit layer; and a bonding wire layer, on a side of the flexible base layer away from the rigid substrate. The bonding wire layer and the flexible base layer is capable of being bent along an edge of the rigid substrate to a side of the rigid substrate away from the driving circuit layer.
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公开(公告)号：US20210167045A1
公开(公告)日：2021-06-03
申请号：US16862934
申请日：2020-04-30
发明人： Ke MENG , Chao LIU , Qiangwei CUI , Chuhang WANG , Lili WANG , Linhui GONG , Yutian CHU , Fan YANG
IPC分类号： H01L25/075 , H01L27/12 , H01L33/62
摘要： A driving substrate includes a base substrate. The base substrate has a display region and a peripheral region, and the peripheral region includes a bonding region between the display region and a first side face of the base substrate. The driving substrate further includes a plurality of first pads spaced apart from each other, which are disposed in the bonding region of the base substrate. A first side face of each first pad is flush with the first side face of the base substrate. A thickness of the first pad is approximately in a range from 0.5 microns to 2 microns.
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公开(公告)号：US20230369352A1
公开(公告)日：2023-11-16
申请号：US18361375
申请日：2023-07-28
发明人： Linhui GONG , Chao LIU
CPC分类号： H01L27/1244 , H01L27/1259 , H01L25/167 , H01L27/1248
摘要： A display substrate, a method for manufacturing a display substrate and a display device are provided, and the display substrate includes: a base having a first surface, a second surface and a side surface, the base includes a display area and an epitaxial area; a driving functional layer in the display area and first binding electrodes in the epitaxial area on the first surface, the first binding electrodes are coupled with the driving functional layer; second binding electrodes located on the second surface and coupled with the first binding electrodes through side wirings; a portion of each side wiring is located on the side surface; a blocking wall on the first surface and in the epitaxial area, an orthographic projection of the blocking wall on the base at least passes through spacing regions between every two adjacent first binding electrodes along an arrangement direction of the first binding electrodes.
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4.发明申请公开(公告)号：US20220302362A1
公开(公告)日：2022-09-22
申请号：US17556224
申请日：2021-12-20
发明人： Linhui GONG , Liang SUN , Chao LIU , Sha FENG
摘要： The present disclosure provides a display panel and a manufacturing method thereof, a display apparatus and a splicing display apparatus. The display panel includes: a back plate, at least one connection lead and a first protection layer. Each of the at least one connection lead includes a main conductive layer. The first protection layer includes a first portion on two sides of the main conductive layer of the connection lead in a width direction thereof.
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5.发明公开公开(公告)号：US20230207733A1
公开(公告)日：2023-06-29
申请号：US17926791
申请日：2021-08-06
发明人： Linhui GONG , Chao LIU , Haiwei SUN , Chuhang WANG , Lili WANG , Chaoyang WANG , Xue DONG
CPC分类号： H01L33/382 , H01L25/0753 , H01L33/62 , H01L33/005 , G09F9/3026 , G09F9/33 , H01L2933/0016 , H01L2933/0066
摘要： A display panel includes a backplane, a plurality of light-emitting devices, a plurality of first electrodes, and a plurality of connection leads. The backplane includes a first main surface a second main surface and a plurality of side surfaces, and at least one side surface is a selected side surface. The plurality of light-emitting devices and the plurality of first electrodes are disposed on the second main surface. The plurality of connection leads are disposed at least on the first main surface and the selected side surface. Each connection lead includes a first portion on the first main surface and a second portion on the selected side surface, and a ratio of a thickness of the first portion to a thickness of the second portion is range in a range of 0.6 and 1.6. Each connection lead is electrically connected to a first electrode.
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公开(公告)号：US20210159208A1
公开(公告)日：2021-05-27
申请号：US16830834
申请日：2020-03-26
发明人： Lili WANG , Haiwei SUN , Zhenxing TANG , Feng QU , Jing LIU , Chao LIU , Chuhang WANG , Qiangwei CUI , Ke MENG , Linhui GONG
摘要： A chip bonding method and a bonding device. The chip bonding method is used for bonding a chip to a display module, the display module includes a substrate and a functional layer on the substrate, the substrate includes a first substrate portion and a second substrate portion, the functional layer is on the first substrate portion, and an electrode is on an upper side of the second substrate portion. The chip bonding method includes: forming a light absorbing film layer on a side of the second substrate portion facing away from the electrode; coating a conductive adhesive film on the electrode, and placing the chip on the conductive adhesive film; and irradiating, by using a laser beam, a side of the second substrate portion facing away from the electrode.
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7.发明公开公开(公告)号：US20240170497A1
公开(公告)日：2024-05-23
申请号：US17787985
申请日：2021-05-25
发明人： Linhui GONG , Chen LI , Chao LIU , Jiacheng QI
CPC分类号： H01L27/124 , H01L25/167 , H01L27/1292 , H01L33/60 , H01L2933/0058
摘要： A display panel includes: a backplane, a plurality of light-emitting devices, a plurality of connecting leads, a first protective layer and a reflective layer. The backplane includes a first main surface, a second main surface, and a plurality of side surfaces. At least one side surface is as a selected side surface. The plurality of light-emitting devices are disposed on the second main surface and are electrically connected to the plurality of connecting leads. The plurality of connecting leads are disposed on the first main surface, the selected side surface and the second main surface, and each connecting lead sequentially passes through the selected side surface and the second main surface from the first main surface. The first protective layer covers the plurality of connecting leads. The reflective layer includes at least a first portion covering a portion of the first protective layer on the selected side surface.
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公开(公告)号：US20220013398A1
公开(公告)日：2022-01-13
申请号：US17295036
申请日：2020-05-09
发明人： Lili WANG , Chuhang WANG , Chao LIU , Qiangwei CUI , Ke MENG , Linhui GONG
IPC分类号： H01L21/683 , H01L25/075 , H01L33/62
摘要： A micro-LED transfer method, including: moving a passing substrate to a position above a donor substrate and moving the pasting substrate in a direction approaching the donor substrate to paste up LED grains so that the LED grains are separated from the bearing substrate; moving the pasting substrate with the LED grains to a position above a target substrate with the LED grains being closer to the target substrate than the pasting substrate, and conducting an alignment so that the LED grains are directly opposite to positions on the target substrate where the LED grains are to be arranged; and heating the pasting substrate with the LED grains to a first temperature greater than or equal to a melting temperature of the hot melt adhesive film to melt the hot melt adhesive film, so that the LED grains are separated from the pasting substrate and transferred to the target substrate.
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