Dimming Unit, Backlight Module Group and Display Device
    23.
    发明申请
    Dimming Unit, Backlight Module Group and Display Device 审中-公开
    调光单元,背光模块组和显示设备

    公开(公告)号:US20150301406A1

    公开(公告)日:2015-10-22

    申请号:US14317091

    申请日:2014-06-27

    CPC classification number: G02F1/133605 G02F1/133603 G02F2001/133601

    Abstract: A dimming unit, a backlight module group and a display device are disclosed in the disclosure. The dimming unit according to the disclosure includes a dimming body and a light source, a groove is provided on the dimming body, a cavity is provided on a first sidewall of the groove for accommodating the light source, and the cavity has a light outlet facing a second sidewall of the groove which is opposite to the first sidewall, so that a light ray is reflected by the second sidewall towards an opening of the groove. A backlight module group includes an optical film layer and a light source device provided on a side of a light incident surface of the optical film layer, the light source device includes the dimming unit according to the disclosure, and a light ray emitted by the dimming unit is emitted to the optical film layer.

    Abstract translation: 在本公开中公开了调光单元,背光模块组和显示装置。 根据本发明的调光单元包括调光体和光源,在调光体上设置有凹槽,在凹槽的第一侧壁上设置有用于容纳光源的空腔,并且空腔具有面向 所述凹槽的与所述第一侧壁相对的第二侧壁,使得光线被所述第二侧壁朝向所述凹槽的开口反射。 背光模块组包括设置在光学膜层的光入射面一侧的光学膜层和光源装置,该光源装置包括根据本公开的调光单元,以及通过调光发出的光线 单元被发射到光学膜层。

    Display Back Plate and Display Device
    24.
    发明公开

    公开(公告)号:US20240347543A1

    公开(公告)日:2024-10-17

    申请号:US18027131

    申请日:2022-04-29

    CPC classification number: H01L27/124 H01L25/167 H01L27/1248

    Abstract: A display back plate and a display device are provided. The display back plate includes multiple display units on a base substrate, at least one display unit includes a pixel region for displaying image and a light transmissive region allowing light to transmit; the pixel region includes a first trace layer and a second trace layer disposed in different layers along a thickness direction of the base substrate; and the pixel region further includes a first dielectric layer and a second dielectric layer between the first trace layer and the second trace layer, a ratio of a thickness of the first trace layer to that of the second trace layer is greater than 5; a sum of a thickness of the first dielectric layer and a thickness of the second dielectric layer is greater than 3 μm, and the thickness of the first dielectric layer is less than 2 μm.

    COLOR CONVERSION SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY PANEL

    公开(公告)号:US20220255030A1

    公开(公告)日:2022-08-11

    申请号:US17485304

    申请日:2021-09-24

    Abstract: The present disclosure provides a color conversion substrate and manufacturing method thereof and a display panel. The color conversion substrate includes a base substrate; a color conversion layer on the base substrate and including a bank portion and a plurality of sub-portions having different colors, the bank portion is between adjacent sub-portions to separate the adjacent sub-portions and configured to absorb incident light, and the plurality of sub-portions having different colors are configured to convert the incident light in a same color into light having different colors; an anti-color-interference pattern on a side of the color conversion layer distal to the base substrate, an orthographic projection of the anti-color-interference pattern on the base substrate is within an orthographic projection of the bank portion on the base substrate, the anti-color-interference pattern is configured such that the incident light is refracted and then is transmitted into the bank portion.

    LIGHT EMITTING DIODE CHIP, DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20220238594A1

    公开(公告)日:2022-07-28

    申请号:US17488243

    申请日:2021-09-28

    Abstract: A LED chip, including: substrate; LEDs on side of the substrate, each including first semiconductor pattern, light emission pattern, second semiconductor pattern sequentially stacked, the first semiconductor patterns of at least two LEDs being formed as single piece to constitute first semiconductor layer; at least one first electrode on side of first semiconductor layer away from the substrate and electrically coupled to first semiconductor layer; second electrodes on side of the second semiconductor patterns away from the substrate, each being electrically coupled to second semiconductor pattern of corresponding LED; pixel defining layer on side of the substrate away from LED, and having pixel openings in one-to-one correspondence with LEDs; and a color conversion pattern within at least two pixel openings, and converting light of first color emitted by the light emission pattern into light of target color other than the first color. The LED chip is Mini-LED or Micro-LED chip.

    METHODS OF DEPLOYING BIG DATA CLUSTER AND BIG DATA CLUSTER BASED DATA PROCESSING METHODS

    公开(公告)号:US20250094537A1

    公开(公告)日:2025-03-20

    申请号:US18559787

    申请日:2022-07-15

    Abstract: The present disclosure relates to a method of deploying a big data cluster. In the present disclosure, a deployment interface is provided, to provide a big data cluster deployment function through the deployment interface. The method includes: in response to a node creation operation in the deployment interface, displaying a to-be-deployed node in a temporary resource pool region in the deployment interface; in response to a drag-and-drop operation on the to-be-deployed node in the temporary resource pool region, displaying the to-be-deployed node in a physical pool in the deployment resource pool region in the deployment interface; and in response to a start deployment operation in the deployment interface, according to the physical pool where the to-be-deployed node is located, creating a container corresponding to the to-be-deployed node on a server corresponding to the physical pool, where the container is configured to provide a big data cluster service.

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