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公开(公告)号：US06506097B1
公开(公告)日：2003-01-14
申请号：US09764733
申请日：2001-01-16
申请人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
发明人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
IPC分类号： B24B100
CPC分类号： B24B37/013 , B24B37/042 , B24B49/04 , B24B49/12 , H01L21/30625
摘要： An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
摘要翻译： 一种用于两步抛光工艺的光学监视系统，其为多个径向区域中的每一个产生反射迹线。 当任何反射迹线表示金属层的初始间隙时，CMP设备可以从高选择性浆料切换到低选择性浆料，并且当所有反射迹线表示氧化物层已经完全暴露时，抛光可能停止。
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公开(公告)号：US07101251B2
公开(公告)日：2006-09-05
申请号：US11166022
申请日：2005-06-23
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer program product for process control in chemical mechanical polishing is described. The product includes instructions to cause a processor to receive a measurement of an initial pre-polishing thickness of a layer of a substrate from a metrology station, determine a value for a parameter of an endpoint algorithm from the initial thickness of the substrate, receive a monitoring signal generated from monitoring in-situ polishing of the substrate, process the monitoring signal to detect a signal feature indicating a final or intermediate endpoint and send instructions to stop polishing when an endpoint criterion is detected using the endpoint algorithm with the determined value for the parameter.
摘要翻译： 描述了用于化学机械抛光中的过程控制的计算机程序产品。 该产品包括使得处理器从测量站接收基底层的初始预抛光厚度的测量的指令，从衬底的初始厚度确定端点算法的参数的值，接收 通过监测衬底的原位抛光产生的监测信号，处理监控信号以检测指示最终或中间端点的信号特征，并且当使用具有确定的值的端点算法检测到端点标准时，发送指令停止抛光 参数。
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公开(公告)号：US07074109B1
公开(公告)日：2006-07-11
申请号：US10920701
申请日：2004-08-17
IPC分类号： B24B49/00
CPC分类号： H01L21/3212 , B24B37/013 , B24B49/00 , H01L22/26
摘要： A system, method, and computer program product for chemical mechanical polishing a substrate in which initially a plurality of predetermined pressures are applied to a plurality of regions of the substrate. A plurality of portions of the substrate are monitored during polishing with an in-situ monitoring system. If the difference in thickness between two portions of the substrate exceeds a predetermined threshold, a plurality of adjusted pressures are calculated in a closed-loop control system, and the plurality of adjusted pressures are applied to the plurality of regions of the substrate. The predetermined threshold includes an initial threshold for the start of the polishing process and a second threshold for a period of polishing after the start of the polishing process.
摘要翻译： 一种用于化学机械抛光衬底的系统，方法和计算机程序产品，其中最初将多个预定压力施加到衬底的多个区域。 在用原位监测系统进行抛光时监测基板的多个部分。 如果基板的两个部分之间的厚度差超过预定阈值，则在闭环控制系统中计算多个调节压力，并且将多个调节压力施加到基板的多个区域。 预定阈值包括用于开始抛光处理的初始阈值和在抛光过程开始之后的抛光周期的第二阈值。
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公开(公告)号：US20130231032A1
公开(公告)日：2013-09-05
申请号：US13748456
申请日：2013-01-23
IPC分类号： B24B37/20
CPC分类号： B24B37/26 , B24B37/013 , B24B37/205 , B24B49/02 , B24B49/10 , B24B49/105 , B24B49/12 , B24D11/02 , G01B7/105
摘要： A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
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公开(公告)号：US08460057B2
公开(公告)日：2013-06-11
申请号：US13089189
申请日：2011-04-18
CPC分类号： B24B37/013 , B24B37/042 , B24B49/12 , B24B51/00 , H01L22/26
摘要： A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing stops when an endpoint criterion is detected using the endpoint algorithm.
摘要翻译： 一种用于化学机械抛光中的过程控制的计算机实现方法，其中在计量站测量衬底的初始预抛光厚度，从衬底的初始厚度确定端点算法的参数，抛光衬底 在抛光台处，当使用端点算法检测到端点标准时抛光停止。
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公开(公告)号：US07118457B2
公开(公告)日：2006-10-10
申请号：US11031440
申请日：2005-01-07
CPC分类号： B24B37/26 , B24B37/013 , B24B37/205 , B24B49/02 , B24B49/10 , B24B49/105 , B24B49/12 , B24D11/02 , G01B7/105
摘要： A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
摘要翻译： 一种用具有研磨面和背面的研磨层形成研磨垫的方法。 在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。 与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。
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公开(公告)号：US07016795B2
公开(公告)日：2006-03-21
申请号：US10359107
申请日：2003-02-04
CPC分类号： B24B37/013 , B24B37/042 , B24B49/105 , G01N27/90 , H01L21/67253
摘要： Improved endpoint detection and/or thickness measurements may be obtained by correcting sensor data using calibration parameters and/or drift compensation parameters. Calibration parameters may include an offset and a slope, or other parameters. Drift compensation parameters may include off-wafer measurements.
摘要翻译： 可以通过使用校准参数和/或漂移补偿参数校正传感器数据来获得改进的端点检测和/或厚度测量。 校准参数可以包括偏移和斜率，或其他参数。 漂移补偿参数可能包括晶圆外测量。
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公开(公告)号：US07001242B2
公开(公告)日：2006-02-21
申请号：US10124507
申请日：2002-04-16
IPC分类号： B24B1/00
CPC分类号： B24B49/10 , B24B37/013 , B24B37/205 , B24B49/105 , B24B49/12
摘要： A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
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29.发明授权公开(公告)号：US06991516B1
公开(公告)日：2006-01-31
申请号：US10920726
申请日：2004-08-17
申请人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
发明人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
CPC分类号： B24B49/105 , B24B37/04 , B24B49/12
摘要： A plurality of portions of a substrate are monitored during polishing at a first polishing station with an in-situ monitoring system. A plurality of thicknesses are determined based on measurements by the in-situ monitoring system, and the plurality of pressures to apply to the plurality of regions of the substrate are calculated in a closed-loop control system. However, if a representative thickness of the layer is less than a threshold thickness, calculation of the plurality of pressures by the closed-loop control system is halted and a plurality of predetermined pressures are applied to the plurality of regions of the substrate.
摘要翻译： 在具有原位监测系统的第一抛光站的抛光期间，监测基板的多个部分。 基于通过原位监测系统的测量确定多个厚度，并且在闭环控制系统中计算应用于衬底的多个区域的多个压力。 然而，如果层的代表性厚度小于阈值厚度，则闭环控制系统的多个压力的计算被停止，并且多个预定压力施加到基板的多个区域。
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公开(公告)号：US20110294402A1
公开(公告)日：2011-12-01
申请号：US13207213
申请日：2011-08-10
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/105 , G01B7/10 , H01L21/67253
摘要： An eddy current monitoring system may include an elongated core. One or more coils may be coupled with the elongated core for producing an oscillating magnetic field that may couple with one or more conductive regions on a wafer. The core may be translated relative to the wafer to provide improved resolution while maintaining sufficient signal strength. An eddy current monitoring system may include a DC-coupled marginal oscillator for producing an oscillating magnetic field at a resonant frequency, where the resonant frequency may change as a result of changes to one or more conductive regions. Eddy current monitoring systems may be used to enable real-time profile control.
摘要翻译： 涡流监视系统可以包括细长的核心。 一个或多个线圈可以与细长铁芯耦合以产生可与晶片上的一个或多个导电区域耦合的振荡磁场。 芯可以相对于晶片翻转以提供改善的分辨率，同时保持足够的信号强度。 涡流监测系统可以包括用于产生谐振频率的振荡磁场的DC耦合边缘振荡器，其中谐振频率可能由于对一个或多个导电区域的改变而改变。 涡流监视系统可用于实现实时配置文件控制。
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