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49 条记录 (耗时 0.034 秒)

    Thermal management for handheld projectors
    23.
    发明授权
    Thermal management for handheld projectors 有权
    手持投影机的热管理

    公开(公告)号：US08955983B2

    公开(公告)日：2015-02-17

    申请号：US13581006

    申请日：2011-02-28

    申请人： Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

    发明人： Bradley E. Reis ,  Robert A. Reynolds, III ,  Yin Xiong ,  Greg P. Kramer ,  Robert J. Umpleby

    IPC分类号： G03B21/16 ,  H05K7/20 ,  H01L23/34 ,  F21V29/00 ,  H05K1/02 ,  H04N9/31

    CPC分类号： G03B21/16 ,  F21V29/00 ,  F21V29/85 ,  F21V29/86 ,  F21V29/89 ,  H04N9/31 ,  H04N9/3144 ,  H05K1/02 ,  H05K1/0201 ,  H05K1/0203 ,  H05K7/20445

    摘要： A handheld device (10), including a projector module (20) which includes a light source having a laser or at least one light emitting diode; a thermal management system which includes a heat collector (30) formed of a material having a thermo-mechanical design constant of at least 10 mm-W/m*K and having a non-planar shape, the heat collector in thermal contact with the light source; a heat spreader (40) having a surface area at least 1.5 times that of the surface area of the heat collector and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader positioned in thermal contact with the heat collector, wherein thermo-mechanical design constant of a material is defined by thermal conductivity of the material multiplied by its average thickness.

    摘要翻译： 一种手持式设备（10），包括投影仪模块（20），其包括具有激光或至少一个发光二极管的光源; 一种热管理系统，其包括由具有至少10mm-W / m×K的热机械设计常数且具有非平面形状的材料形成的集热器（30），所述集热器与所述热收集器 光源; 具有至少1.5倍于热收集器表面面积的表面积的散热器（40）和热机械设计常数至少为10mm-W / m×K，散热器定位成与 热收集器，其中材料的热机械设计常数由材料的热导率乘以其平均厚度限定。

    Heat Dissipation For Low Profile Devices
    24.
    发明申请
    Heat Dissipation For Low Profile Devices 审中-公开
    薄型设备的散热

    公开(公告)号：US20100009174A1

    公开(公告)日：2010-01-14

    申请号：US12170772

    申请日：2008-07-10

    申请人： Bradley E. Reis

    发明人： Bradley E. Reis

    IPC分类号： B32B3/30 ,  B32B5/02 ,  F28F13/00

    CPC分类号： F28F13/00 ,  B32B3/26 ,  B32B3/266 ,  B32B5/16 ,  B32B15/16 ,  B32B15/18 ,  B32B15/20 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2457/00 ,  B32B2457/12 ,  Y10T428/26 ,  Y10T428/30

    摘要： A heat spreader for an electronic device including a first layer formed of at least one sheet of compressed particles of exfoliated graphite having two major surfaces; and a second layer formed of a metal foil having two major surfaces, a first major surface of the metal foil having surface structures thereon, wherein a first major surface of the graphite layer and a second major surface of the metal foil layer are in thermal connection with each other, the surface structures on the first major surface of the metal foil which create airflow turbulence, increase heat dissipation surface area, or both.

    摘要翻译： 一种用于电子设备的散热器，包括由至少一片压缩颗粒形成的具有两个主表面的剥离石墨的第一层; 以及由具有两个主表面的金属箔形成的第二层，所述金属箔的第一主表面上具有表面结构，其中所述石墨层的第一主表面和所述金属箔层的第二主表面处于热连接 彼此之间，金属箔的第一主表面上的表面结构产生气流紊流，增加散热表面积或两者。

    Lid assembly for shielding electronic components from EMI/RFI interferences
    25.
    发明授权
    Lid assembly for shielding electronic components from EMI/RFI interferences 失效
    用于屏蔽电子元件免受EMI / RFI干扰的盖组件

    公开(公告)号：US5763824A

    公开(公告)日：1998-06-09

    申请号：US735838

    申请日：1996-10-23

    申请人： David Robert King ,  Bradley E. Reis ,  Joseph C. Rowan

    发明人： David Robert King ,  Bradley E. Reis ,  Joseph C. Rowan

    IPC分类号： H01L23/552 ,  H05K3/32 ,  H05K9/00

    CPC分类号： H05K9/0026 ,  H01L23/552 ,  H05K3/323 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K2201/10371

    摘要： A cover or lid assembly is provided for EMI/RFI shielding. The cover or lid is used in combination with an electrical assembly having an electrical ground, at least one electronic component electrically connected to the assembly, a conductive frame, disposed about the electronic component. The conductive frame is electrically connected to the ground. An electrically conductive adhesive is disposed continuously between the frame and the lid to mount the lid to the conductive frame to shield the electronic component from electromagnetic and radio frequency interference.

    摘要翻译： 为EMI / RFI屏蔽提供盖子或盖子组件。 盖或盖与具有电接地的电气组件，电连接到组件的至少一个电子部件，围绕电子部件设置的导电框架组合使用。 导电框架电连接到地面。 导电粘合剂连续地设置在框架和盖之间，以将盖安装到导电框架上，以屏蔽电子部件免受电磁和射频干扰。

    Faraday cage
    26.
    发明授权
    Faraday cage 失效
    法拉第笼

    公开(公告)号：US5761053A

    公开(公告)日：1998-06-02

    申请号：US643292

    申请日：1996-05-08

    申请人： David Robert King ,  Joseph C. Rowan ,  Daniel D. Johnson ,  Bradley E. Reis

    发明人： David Robert King ,  Joseph C. Rowan ,  Daniel D. Johnson ,  Bradley E. Reis

    IPC分类号： H01L23/552 ,  H05K3/32 ,  H05K9/00

    CPC分类号： H05K9/0026 ,  H01L23/552 ,  H05K3/323 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K2201/10371

    摘要： A Faraday cage is provided for EMI/RFI shielding which includes a substrate having an electrical ground; at least one electronic component electrically connected to the substrate; a conductive housing; and an electrically conductive adhesive. The electrically conductive adhesive may be defined by a substrate having numerous passageways through the substrate. The passageways are defined by a plurality of walls of the material making up the substrate. The walls are covered with a layer of conductive metal. The passageways are filled with a non-conductive adhesive resin. The conductive housing is adhesively electrically mounted to the electrical ground of the substrate, over the electronic component, to shield electromagnetic and radio frequency interference.

    摘要翻译： 为法拉第笼提供EMI / RFI屏蔽，其包括具有电接地的基板; 电连接到所述基板的至少一个电子部件; 导电外壳; 和导电粘合剂。 导电粘合剂可以由具有穿过基底的多个通道的基底限定。 通道由构成基底的材料的多个壁限定。 墙壁上覆盖着一层导电金属。 通道填充有非导电粘合剂树脂。 导电壳体通过电子元件粘合地电气地安装到基板的电接地，以屏蔽电磁和射频干扰。