公开(公告)号：US20140291818A1

公开(公告)日：2014-10-02

申请号：US13850827

申请日：2013-03-26

Applicant: BROADCOM CORPORATION

Inventor： Sam Ziqun ZHAO ,  Rezaur Rahman Khan

IPC: H01L23/552 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/1815 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In embodiments described herein, an integrated circuit (IC) package is provided. The IC package can include a substrate having opposing first and second surfaces, an IC die coupled to the first surface of the substrate, a first plurality of conductive elements coupled to conductive regions on the first surface of the substrate, an interposer having opposing first and second surfaces, and a second plurality of conductive elements coupled to conductive regions on the first surface of the interposer. The second surface of the substrate is configured be coupled to at least one device. Each of the first plurality of conductive elements is electrically coupled to a respective one of the second plurality of conductive elements. The interposer is configured to be attached to a printed circuit board (PCB).

Abstract translation: 在这里描述的实施例中，提供了集成电路（IC）封装。 IC封装可以包括具有相对的第一和第二表面的衬底，耦合到衬底的第一表面的IC管芯，耦合到衬底的第一表面上的导电区域的第一多个导电元件，具有相对的第一和第二表面的插入件 第二表面和耦合到插入件的第一表面上的导电区域的第二多个导电元件。 衬底的第二表面被配置为耦合到至少一个器件。 第一多个导电元件中的每一个电耦合到第二多个导电元件中的相应一个。 插入器被配置为附接到印刷电路板（PCB）。