Abstract:
Curable moulding, coating and adhesive compositions which contain a polyepoxide compound, for example a liquid polyglycidyl ether of bisphenol A and, as the curing agent, a 1,1''-methylenebis-(3- gamma -aminopropyl-hydantoin), for example 1,1''methylene-bis-(3- gamma -aminopropyl-5,5-dimethyl-hydantoin). The curing can take place at relatively low temperatures. The new type of curing agent bridges, in the gradation of the activity, a gap between aliphatic polyamines and cycloaliphatic polyamines. The new curing agents furthermore have the advantage, relative to the aromatic polyamines, of being nontoxic.
Abstract:
WHERE N IS A WHOLE NUMBER, AT LEAST 2, PREFERABLY 2 OR 3, R stands for a n-valent aliphatic residue which may be interrupted by oxygen atoms and A represents the residue of a glycol or of a polyglycol whose terminal hydroxyl groups have been removed, and (2) the diglycidyl ether of a glycol or polyglycol.
An epoxy resin mixture containing (1) the polyepoxide of the formula
Abstract:
HOT-CURABLE MOULDING, COATING AND ADHESIVE COMPOSITIONS WHICH ARE STORAGE-SIABLE AT ROOM TEMPERATURE AND WHICH CONTAIN A POLYEPOXIDE COMPOUND, FOR EXAMPLE A LIQUID POLYGLYCIDYL ETHER OF BISPHENOL A AND, AS A LATENT CURING AGENT, A C1-C4-ALKYLUREA, FOR EXAMPLE N-MONOMETHYLUREA, N,N''-DIMETHYLUREA OR TETRAMETHYLUREA. AS A RULE 0.20.7 MOL OF ALKYLUREA ARE USED PER EPOXIDE EQUIVALENT. IN ORDER TO OBTAIN PERFECT CASTINGS, THE CURE SHOULD BE CARRIED OUT STEPWISE BY GRADUAL WARMING, WITH THE MIXTURES BEING EXPOSED TO GRADUALLY RISING TEMPERATURES IN THE RANGE OF 100-180*C., AND THE TEMPERATURE MUST, ESPECIALLY IN THE RANGE OF 120-150*C., ONLY BE RAISED IN SMALL STEPS.