公开(公告)号：US07990719B2

公开(公告)日：2011-08-02

申请号：US12610388

申请日：2009-11-02

申请人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Guo Chen ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20 ,  G06F1/20

CPC分类号： H05K7/20154

摘要： A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

摘要翻译： 散热装置用于散发电子系统中安装在印刷电路板上的电子元件产生的热量。 电子元件具有不同的高度。 所述散热装置包括连接板，安装在所述连接板上的至少两个弹性部件和散热器，所述散热器具有安装在所述连接板上且位于所述电子部件之一上方的基板。 多个接合构件延伸穿过印刷电路板并与衬底接合以将衬底附着在印刷电路板上的一个电子部件上。 基板和连接板之间的距离可通过调节连接部件来调节，以使基板与一个电子部件紧密接触。

公开(公告)号：US07866375B2

公开(公告)日：2011-01-11

申请号：US11566003

申请日：2006-12-01

申请人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Bao-Chun Chen

发明人： Shi-Wen Zhou ,  Chun-Chi Chen ,  Bao-Chun Chen

IPC分类号： F28D15/00 ,  F28F7/00 ,  H01L23/24 ,  H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0275 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.

摘要翻译： 一种散热装置，包括底座（10），多个翅片（20），第一和第二热管（30），（40），风扇架（50）和固定到风扇架的风扇（60）。 第一热管包括受热部（32）和两个散热部（34）。 第二热管包括蒸发部分（42）和两个冷凝部分（44）。 第二热管的冷凝部分延伸到翅片中并且与每个翅片的相对端相邻设置。 一个放热部分在翅片中延伸并且设置在冷凝部分之间，从而允许从基座吸收的热量通过散热部分和冷凝部分均匀分布在整个翅片上。

公开(公告)号：US20100155023A1

公开(公告)日：2010-06-24

申请号：US12423816

申请日：2009-04-15

申请人： Shi-Wen Zhou ,  Jun Cao ,  Qing-Song Xu ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Jun Cao ,  Qing-Song Xu ,  Chun-Chi Chen

IPC分类号： F28F7/00 ,  F28D15/00

CPC分类号： F28D15/0233 ,  F28D15/0266 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan.

摘要翻译： 散热装置包括底座，基座上的散热器，热连接底座和散热器的两个热管和安装在散热器中的风扇。 散热器包括放置在基座上的第一翅片组和位于第一翅片组上的第二翅片组。 每个热管包括连接到基座的蒸发部分，冷凝部分和互连蒸发部分和冷凝部分的绝热部分。 热管的冷凝部分夹在第一和第二翅片组之间并围绕风扇。

公开(公告)号：US07493940B2

公开(公告)日：2009-02-24

申请号：US11309841

申请日：2006-10-10

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Guo Chen ,  Li He ,  Peng Liu

IPC分类号： F24H3/02 ,  F28F9/00 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L23/4006 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (100) includes a heat sink (10) having a plurality of fins (14) and a plurality of mounting brackets (20) buckled with the fins of the heat sink. Each of the mounting brackets includes a mounting plate (22) mounted on a top of the heat sink and a baffle plate (26) extending from one side of the mounting plate to a bottom of the heat sink. The baffle plate terminates with a retaining plate (28). A plurality of fasteners (50) extends through the retaining plates to mount the heat dissipation device onto a printed circuit board. Self-tapping screws (40) are used to extend through the fan and the mounting plates of the mounting brackets and threadedly engage with the fins thereby mounting the fan on the heat sink.

摘要翻译： 散热装置（100）包括散热片（10），散热片（10）具有多个散热片（14）和多个与散热片的翅片相互扣合的安装支架（20）。 每个安装支架包括安装在散热器顶部的安装板（22）和从安装板的一侧延伸到散热器底部的挡板（26）。 挡板终止于保持板（28）。 多个紧固件（50）延伸穿过保持板以将散热装置安装到印刷电路板上。 自攻螺钉（40）用于延伸通过风扇和安装支架的安装板，并与翅片螺纹接合，从而将风扇安装在散热器上。

公开(公告)号：US07382047B2

公开(公告)日：2008-06-03

申请号：US11306412

申请日：2005-12-27

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H01L23/10 ,  B23P6/00 ,  F28F27/00 ,  H01B7/42

CPC分类号： F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and a cooling member (30). The heat sink includes a base, a plurality of fins extending from the base and at least one heat pipe thermally connecting the base and the fins. The cooling member is provided with a fin assembly thereon and includes a cold surface attached to one side of the fins and a condensing portion of the at least one heat pipe to make the one side of the fins and the condensing portion have a lower temperature.

摘要翻译： 散热装置（1）包括散热器（10），风扇（20）和冷却构件（30）。 散热器包括基座，从基座延伸的多个翅片和至少一个热连接底座和翅片的热管。 冷却件在其上设置有翅片组件，并且包括附接到翅片的一侧的冷表面和至少一个热管的冷凝部分，以使翅片的一侧和冷凝部分具有较低的温度。

公开(公告)号：US07269013B2

公开(公告)日：2007-09-11

申请号：US11306700

申请日：2006-01-09

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28F2215/10 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device includes a heat dissipation body and a heat conducting body thermally combined with the heat dissipation device. The heat dissipation body includes a central portion defining a through hole therein and a plurality of fin extending from a periphery of the central portion. Each of the fins branches a plurality of portions at an end thereof. The heat conducting body includes a column thermally fitted in the through hole of the central portion of the heat dissipation body. A cavity is defined between the column and the central portion of the heat dissipation body. The cavity contains a phase-changeable medium therein, which becomes vapor once the column absorbs heat from a heat-generating electronic device.

摘要翻译： 散热装置包括散热体和与散热装置热结合的​​导热体。 散热体包括在其中限定通孔的中心部分和从中心部分的周边延伸的多个翅片。 每个翅片在其一端分支多个部分。 导热体包括热嵌合在散热体的中心部分的通孔中的柱。 在该散热体的中心部分之间限定空腔。 空腔中含有相变介质，一旦该塔从发热电子设备中吸收热量，该腔就变成蒸汽。

公开(公告)号：US20070097637A1

公开(公告)日：2007-05-03

申请号：US11163820

申请日：2005-11-01

申请人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

发明人： Chun-Chi Chen ,  Shi-Wen Zhou ,  Zhan Wu

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device (1) includes a heat sink (10), a fan (20), and an air cooling member (30). Airflow produced by the fan is led to the heat sink after passing through the air cooling member. The air cooling member can lower the temperature of the airflow below an average temperature of an atmosphere surrounding the heat dissipation device.

摘要翻译： 散热装置（1）包括散热器（10），风扇（20）和空气冷却部件（30）。 通过风扇产生的气流在通过空气冷却部件之后被引导到散热器。 空气冷却部件可以将气流的温度降低到散热装置周围的气氛的平均温度以下。

公开(公告)号：US08579019B2

公开(公告)日：2013-11-12

申请号：US12641340

申请日：2009-12-18

申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： F28D15/0233 ,  F28D15/0275 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.

摘要翻译： 示例性的散热装置包括基板，两个翅片组，芯，连接到芯的顶部的风扇支架，位于翅片组上方并由风扇支架固定的风扇和两个热管。 两个翅片组协作以在其中心形成中心孔并具有从中心孔径向向外延伸的多个翅片。 芯放置在基板上并接收在中心孔中。 每个热管包括夹在核心和基板之间的蒸发部分，夹在两个翅片组之间的弧形冷凝部分和连接蒸发部分和冷凝部分的绝热部分。

公开(公告)号：US08245765B2

公开(公告)日：2012-08-21

申请号：US12200874

申请日：2008-08-28

申请人： Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： F28D15/00 ,  H05K7/20 ,  F25D23/12

CPC分类号： H01L23/467 ,  F28D15/0233 ,  F28D15/0275 ,  F28F1/20 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.

摘要翻译： 从发热电子元件散热的散热装置包括：填充有相变工作流体的罐;密封地固定在罐顶部并与罐连通的外壳;位于罐顶部上方的风扇; 壳体，包括容纳在壳体中的驱动构件和延伸穿过驱动构件的中心的轴的叶轮。 轴具有向下延伸穿过壳体的底部的下端到罐的顶部的中心，并且上端向上延伸穿过壳体的顶部以接合风扇。 工作流体被发热电子元件加热并蒸发到壳体中以与驱动构件接合以旋转并驱动风扇同步旋转。

公开(公告)号：US07990720B2

公开(公告)日：2011-08-02

申请号：US12614452

申请日：2009-11-09

申请人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

发明人： Shou-Biao Xu ,  Shi-Wen Zhou ,  Chun-Chi Chen

IPC分类号： H05K7/20

CPC分类号： G06F1/181 ,  G06F1/20

摘要： An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

摘要翻译： 诸如计算机系统的电子系统包括限定其侧面的开口的壳体，布置在壳体中的母板，位于母板侧的硬盘和覆盖壳体的开口的散热结构。 主板包括面向壳体的开口的印刷电路板，安装在印刷电路板上并朝向开口的第一电子部件和第二电子部件。 散热结构包括与壳体接合的基部和从基部延伸到壳体外部的翅片。 底座包括接触第一和第二电子部件的第一接合部分和接触硬盘的第二接合部分。 第一接合部分和第二接合部分彼此处于不同的高度。