公开(公告)号：US10725240B2

公开(公告)日：2020-07-28

申请号：US16132109

申请日：2018-09-14

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Matthew J. Traverso

IPC: G02B6/12 ,  H01S5/026 ,  H04B10/25

Abstract: A method comprises receiving, at a plurality of optical distributors of a photonic chip, optical energy from a plurality of primary laser sources. Each of the optical distributors receives optical energy from a respective primary laser source at a respective first input. The method further comprises detecting a failed primary laser source of the primary laser sources using control circuitry of a sparing system. The sparing system further comprises one or more secondary laser sources configured to provide optical energy to respective second inputs of the optical distributors. A first one of the secondary laser sources is optically coupled with at least two of the optical distributors. The method further comprises controlling, using the control circuitry, a first one of the secondary laser sources to selectively provide optical energy to the optical distributor whose first input is optically coupled with the failed primary laser source.

公开(公告)号：US12191910B2

公开(公告)日：2025-01-07

申请号：US17814431

申请日：2022-07-22

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington ,  Mark C. Nowell

IPC: H04B10/50 ,  H04B10/40 ,  H04B10/61

Abstract: An optical module includes an optical source, a first polarization splitter-rotator, a second polarization splitter-rotator, a first port, a second port, a third port, and a fourth port. The optical source produces an optical signal. The first polarization splitter-rotator generates a first source optical signal based at least in part on the optical signal. The second polarization splitter-rotator generates a second source optical signal based at least in part on the optical signal. The first port transmits, to a first device, the first source optical signal and receives, from the first device, a first modulated optical signal. The first polarization splitter-rotator produces a second modulated optical signal. The second port transmits, to a second device, the second source optical signal and receives, from the second device, a third modulated optical signal. The second polarization splitter-rotator produces a fourth modulated optical signal.

公开(公告)号：US12044884B2

公开(公告)日：2024-07-23

申请号：US17653195

申请日：2022-03-02

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Jock T. Bovington ,  Ashley J. M. Erickson

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/30 ,  G02B6/42

CPC classification number: G02B6/13 ,  G02B6/12004 ,  G02B6/30 ,  G02B6/4212

Abstract: Solder reflow compatible connections between optical components are provided by use of reflow compatible epoxies to bond optical components and remain bonded between the optical components at temperatures of at least 260 degrees Celsius for at least five minutes. In some embodiments, the reflow compatible epoxy is index matched to the optical channels in the optical components and is disposed in the light path therebetween. In some embodiments, a light path is defined between the optical channels through at least a portion of an air gap between the optical components.

公开(公告)号：US11960154B2

公开(公告)日：2024-04-16

申请号：US17821067

申请日：2022-08-19

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: G02F1/01 ,  G02B6/138 ,  G02B6/12

CPC classification number: G02F1/0147 ,  G02B6/138 ,  G02B2006/121

Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.

公开(公告)号：US11695254B2

公开(公告)日：2023-07-04

申请号：US18053993

申请日：2022-11-09

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Jock T. Bovington ,  Matthew J. Traverso

IPC: H01S5/22 ,  H01S5/02 ,  H01S5/028

CPC classification number: H01S5/2206 ,  H01S5/021 ,  H01S5/028

Abstract: An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.

公开(公告)号：US11668886B2

公开(公告)日：2023-06-06

申请号：US17454918

申请日：2021-11-15

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4245 ,  G02B6/42 ,  G02B2006/12121

Abstract: Embodiments herein describe optical assemblies that use a spacer element to attach and align a laser to a waveguide in a photonic chip. Once aligned, the laser can transfer optical signals into the photonic chip which can then perform an optical function such as modulation, filtering, amplification, and the like. In one embodiment, the spacer element is a separate part (e.g., a glass or semiconductor block) that is attached between the photonic chip and a submount on which the laser is mounted. The spacer establishes a separation distance between the photonic chip and the submount which in turn aligns the laser with the waveguide in the photonic chip. In another embodiment, rather than the spacer element being a separate part, the spacer element may be integrated into the submount.

公开(公告)号：US11539189B2

公开(公告)日：2022-12-27

申请号：US16242984

申请日：2019-01-08

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Jock T. Bovington ,  Matthew J. Traverso

IPC: H01S5/22 ,  H01S5/02 ,  H01S5/028

Abstract: An optical apparatus comprises a semiconductor substrate and a slab-coupled optical waveguide (SCOW) emitter disposed on the semiconductor substrate. The SCOW emitter comprises an optical waveguide comprising: a first region doped with a first conductivity type; a second region doped with a different, second conductivity type; and an optically active region disposed between the first region and the second region. The optically active region comprises a plurality of quantum dots.

公开(公告)号：US11467434B2

公开(公告)日：2022-10-11

申请号：US17302905

申请日：2021-05-14

Applicant: Cisco Technology, Inc.

Inventor： Jock T. Bovington

IPC: G02F1/01 ,  G02B6/138 ,  G02B6/12

Abstract: Thermal isolation elements are provided in wafer-bonded silicon photonics that include a photonic platform, including a heating element and an optical waveguide that are disposed between a first surface and a second surface (opposite to the first surface) of the photonic platform; a substrate, including a third surface and a fourth surface (opposite to the third surface); wherein the first surface of the photonic platform is bonded to the third surface of the substrate; and wherein a cavity is defined by a trench in one or more of: the first surface and extending towards, but not reaching, the second surface, and the third surface and extending towards, but not reaching, the fourth surface; wherein the cavity is filled with a gas of a known composition at a predefined pressure; and wherein the cavity is aligned with the optical waveguide and the heating element.

公开(公告)号：US10996405B2

公开(公告)日：2021-05-04

申请号：US15946930

申请日：2018-04-06

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Kumar Satya Harinadh Potluri ,  Jock T. Bovington ,  Ashley J. Maker

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25 ,  B23K1/005 ,  B23K103/00

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.

公开(公告)号：US10962719B2

公开(公告)日：2021-03-30

申请号：US16260622

申请日：2019-01-29

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Jock T. Bovington ,  Matthew J. Traverso

IPC: G02B6/30

Abstract: Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.