-
公开(公告)号：US11249246B2
公开(公告)日：2022-02-15
申请号：US17107298
申请日：2020-11-30
Applicant: Cisco Technology, Inc.
Inventor： Tao Ling , Yi Ho Lee , Ravi S. Tummidi , Mark A. Webster
IPC: G02B6/02 , G02B6/12 , G02B6/293 , H04J14/02 , H04B10/50 , H04B10/60 , H04B10/66 , H04B10/67 , H04J14/00 , H04B10/40
Abstract: Aspects described herein include an optical apparatus comprising a multiple-stage arrangement of two-mode Bragg gratings comprising: at least a first Bragg grating of a first stage. The first Bragg grating is configured to transmit a first two wavelengths and to reflect a second two wavelengths of a received optical signal. The optical apparatus further comprises a second Bragg grating of a second stage. The second Bragg grating is configured to transmit one of the first two wavelengths and to reflect an other of the first two wavelengths. The optical apparatus further comprises a third Bragg grating of the second stage. The third Bragg grating is configured to transmit one of the second two wavelengths and to reflect an other of the second two wavelengths.
-
公开(公告)号：US12092863B2
公开(公告)日：2024-09-17
申请号：US17451247
申请日：2021-10-18
Applicant: Cisco Technology, Inc.
Inventor： Yi Ho Lee , Tao Ling , Ravi S. Tummidi , Mark A. Webster , Prakash B. Gothoskar
CPC classification number: G02B6/12007 , H04L1/0071 , G02B2006/12107 , G02B2006/12164 , G02B6/29352 , G02B6/29386
Abstract: Fabrication-tolerant on-chip multiplexers and demultiplexers are provides via a lattice filter interleaver configured to receive an input signal including a plurality of individual signals and to produce a first interleaved signal with a first subset of the plurality of individual signals and a second interleaved signal with a second subset of the plurality of individual signals; a first Bragg interleaver configured to receive the first interleaved signal and produce a first output signal including a first individual signal of the plurality of individual signals and a second output signal including a second individual signal of the plurality of individual signals; and a second Bragg interleaver configured to receive the second interleaved signal and produce a third output signal including a third individual signal of the plurality of individual signals and a fourth output signal including a fourth individual signal of the plurality of individual signals.
-
公开(公告)号：US11693200B2
公开(公告)日：2023-07-04
申请号：US17305986
申请日：2021-07-19
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar K. Patel , Ravi S. Tummidi , Mark A. Webster
CPC classification number: G02B6/43 , G02B6/425 , G02B6/4236 , G02B6/4274 , G02B6/4204
Abstract: Embodiments herein describe using a double wafer bonding process to form a photonic device. In one embodiment, during the bonding process, an optical element (e.g., a high precision optical element) is optically coupled to an optical device in an active surface layer. In one example, the optical element comprises a nitride layer which can be patterned to form a nitride waveguide, passive optical multiplexer or demultiplexer, or an optical coupler.
-
公开(公告)号：US11523192B2
公开(公告)日：2022-12-06
申请号：US17305287
申请日：2021-07-02
Applicant: Cisco Technology, Inc.
Inventor： Tao Ling , Ravi S. Tummidi , Yi Ho Lee , Mark A. Webster
Abstract: Process margin relaxation is provided in relation to a compensated-for process via a first optical device, fabricated to satisfy an operational specification when a compensated-for process is within a first tolerance range; a second optical device, fabricated to satisfy the operational specification when the compensated-for process is within second tolerance range, different than the first tolerance range; a first optical switch connected to an input and configured to output an optical signal received from the input to one of the first optical device and the second optical device; and a second optical switch configured to combine outputs from the first optical device and the second optical device.
-
公开(公告)号：US11513375B2
公开(公告)日：2022-11-29
申请号：US16716139
申请日：2019-12-16
Applicant: Cisco Technology, Inc.
Inventor： Ming Gai Stanley Lo , Vipulkumar K. Patel , Mark A. Webster , Prakash B. Gothoskar
Abstract: A thermo-optic phase shifter comprises an optical waveguide comprising a P-type region comprising a first contact, an N-type region comprising a second contact, and a waveguide region disposed between the P-type region and the N-type region and having a raised portion. The thermo-optic phase shifter further comprises one or more heating elements. The one or more heating elements include one or more discrete resistive heating elements or the P-type and N-type regions driven as resistive heating elements.
-
Patent Agency Ranking
公开(公告)号：US08873899B2
公开(公告)日：2014-10-28
申请号：US13828455
申请日：2013-03-14
Applicant: Cisco Technology, Inc.
Inventor： Sean P. Anderson , Mark A. Webster
CPC classification number: G02B6/27 , G02B6/126 , G02B6/2706 , G02B6/2766 , G02B6/2773
Abstract: An optical waveguide structure includes a rotator having a dual-layer core. A first layer of the dual-layer core may include a tapering portion. A second layer of the dual-layer core may include a rib portion disposed on the tapering portion. The combination of the rib portion and the tapering portion may receive a pair of optical signals, one being polarized in a TE mode and the other being polarized in a TM mode, and convert them to a pair of TE mode optical signals.
Abstract translation: 光波导结构包括具有双层芯的旋转器。 双层芯的第一层可以包括锥形部分。 双层芯的第二层可以包括设置在锥形部分上的肋部分。 肋部分和锥形部分的组合可以接收一对光信号，一个在TE模式下极化，另一个在TM模式下极化，并将它们转换成一对TE模式光信号。
-
公开(公告)号：US12035082B2
公开(公告)日：2024-07-09
申请号：US18056160
申请日：2022-11-16
Applicant: Cisco Technology, Inc.
Inventor： Tao Ling , Ravi S. Tummidi , Yi Ho Lee , Mark A. Webster
CPC classification number: H04Q11/0005 , H04J14/0204 , H04J14/0205 , H04J14/0216 , H04Q2011/0007
Abstract: Process margin relaxation is provided in relation to a compensated-for process via a first optical device, fabricated to satisfy an operational specification when a compensated-for process is within a first tolerance range; a second optical device, fabricated to satisfy the operational specification when the compensated-for process is within second tolerance range, different than the first tolerance range; a first optical switch connected to an input and configured to output an optical signal received from the input to one of the first optical device and the second optical device; and a second optical switch configured to combine outputs from the first optical device and the second optical device.
-
28.发明授权公开(公告)号：US11686648B2
公开(公告)日：2023-06-27
申请号：US17443280
申请日：2021-07-23
Applicant: Cisco Technology, Inc.
Inventor： Xunyuan Zhang , Ravi S. Tummidi , Tony P. Polous , Mark A. Webster
CPC classification number: G01M11/30 , G02B6/12007 , G02B2006/12061 , G02B2006/12145 , G02B2006/12164
Abstract: Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.
-
公开(公告)号：US11227847B2
公开(公告)日：2022-01-18
申请号：US16809446
申请日：2020-03-04
Applicant: Cisco Technology, Inc.
Inventor： Vipulkumar K. Patel , Mark A. Webster , Craig S. Appel
Abstract: Embodiments herein describe providing a decoupling capacitor on a first wafer (or substrate) that is then bonded to a second wafer to form an integrated decoupling capacitor. Using wafer bonding means that the decoupling capacitor can be added to the second wafer without having to take up space in the second wafer. In one embodiment, after bonding the first and second wafers, one or more vias are formed through the second wafer to establish an electrical connection between the decoupling capacitor and bond pads on a first surface of the second wafer. An electrical IC can then be flip chipped bonded to the first surface. As part of coupling the decoupling capacitor to the electrical IC, the decoupling capacitor is connected between the rails of a power source (e.g., VDD and VSS) that provides power to the electrical IC.
-
公开(公告)号：US11073661B1
公开(公告)日：2021-07-27
申请号：US16751994
申请日：2020-01-24
Applicant: Cisco Technology, Inc.
Inventor： Dominic F. Siriani , Vipulkumar K. Patel , Matthew J. Traverso , Mark A. Webster
IPC: G02B6/293
Abstract: Aspects described herein include an optical waveguide emitter that includes a first optical waveguide and a second optical waveguide that are evanescently coupled and collectively configured to selectively propagate only a first mode of a plurality of optical modes. Each of the first optical waveguide and the second optical waveguide extend through an input waveguide section, a turning waveguide section, and an output waveguide section. One or more of the input waveguide section, the turning waveguide section, and the output waveguide section includes an optically active region. The optical waveguide emitter further includes a refractive index-increasing feature in the turning waveguide section.
-
-
-
-
-
-
-
-
-
Search Results
33
records
(took 0.016 seconds)
