公开(公告)号：US20230296840A1

公开(公告)日：2023-09-21

申请号：US18324630

申请日：2023-05-26

Applicant: Cisco Technology, Inc.

Inventor： Norbert SCHLEPPLE ,  Vipulkumar K. PATEL

IPC: G02B6/255 ,  G02B6/12

CPC classification number: G02B6/2555 ,  G02B6/12 ,  G02B6/2551 ,  G02B6/2553 ,  G02B2006/12138 ,  G02B2006/12192

Abstract: Techniques for aligning each of a plurality of optical fibers for coupling to a photonic integrated circuit (PIC). Transmission is detected from each respective optical fiber to the PIC using a probe, and the respective optical fiber is aligned based on the detected transmission. Each of the plurality of optical fibers is coupled to the PIC using at least one of: (i) laser splicing, (ii) laser spot welding, or (iii) arc welding.

公开(公告)号：US20230060862A1

公开(公告)日：2023-03-02

申请号：US17445914

申请日：2021-08-25

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Matthew J. TRAVERSO ,  Sandeep RAZDAN ,  Aparna R. PRASAD

IPC: G02B6/42

Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

公开(公告)号：US20230030971A1

公开(公告)日：2023-02-02

申请号：US17443891

申请日：2021-07-28

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar K. PATEL ,  Ming Gai Stanley LO ,  Xunyuan ZHANG

IPC: G02F1/225 ,  G02F1/015

Abstract: Embodiments presented in this disclosure generally relate to optical signal processing. More specifically, embodiments disclosed herein are directed to a semiconductor-insulator-semiconductor capacitor (SISCAP) modulator. One embodiment includes an optical modulator having a capacitive element configured to modulate an optical signal. The capacitive element includes a single-crystal semiconductor layer, a silicon germanium layer, and a dielectric region between the single-crystal semiconductor layer and the silicon germanium layer.

公开(公告)号：US20210278615A1

公开(公告)日：2021-09-09

申请号：US17302854

申请日：2021-05-13

Applicant: Cisco Technology, Inc.

Inventor： Prakash B. GOTHOSKAR ,  Vipulkumar K. PATEL ,  Soha NAMNABAT ,  Ravi S. TUMMIDI

IPC: G02B6/42 ,  G02B6/30

Abstract: Embodiments described herein include an apparatus comprising a semiconductor-based photodiode disposed on a semiconductor layer, and an optical waveguide spaced apart from the semiconductor layer and evanescently coupled with a depletion region of the photodiode. The photodiode may be arranged as a vertical photodiode or a lateral photodiode.

公开(公告)号：US20210263351A1

公开(公告)日：2021-08-26

申请号：US17302632

申请日：2021-05-07

Applicant: Cisco Technology, Inc.

Inventor： Xunyuan ZHANG ,  Vipulkumar K. PATEL ,  Prakash B. GOTHOSKAR ,  Ming Gai Stanley LO

IPC: G02F1/025

Abstract: Embodiments provide for an optical modulator, comprising: a lower guide, comprising: a lower hub, made of monocrystalline silicon; and a lower ridge, made of monocrystalline silicon that extends in a first direction from the lower hub; an upper guide, including: an upper hub; and an upper ridge, made of monocrystalline silicon that extends in a second direction, opposite of the first direction, from the upper hub and is aligned with the lower ridge; and a gate oxide layer separating the lower ridge from the upper ridge and defining a waveguide region with the lower guide and the upper guide.

公开(公告)号：US20210181543A1

公开(公告)日：2021-06-17

申请号：US16716139

申请日：2019-12-16

Applicant: Cisco Technology, Inc.

Inventor： Ming Gai Stanley LO ,  Vipulkumar K. PATEL ,  Mark A. WEBSTER ,  Prakash B. GOTHOSKAR

IPC: G02F1/01 ,  G02F1/025

Abstract: A thermo-optic phase shifter comprises an optical waveguide comprising a P-type region comprising a first contact, an N-type region comprising a second contact, and a waveguide region disposed between the P-type region and the N-type region and having a raised portion. The thermo-optic phase shifter further comprises one or more heating elements. The one or more heating elements include one or more discrete resistive heating elements or the P-type and N-type regions driven as resistive heating elements.

公开(公告)号：US20210088722A1

公开(公告)日：2021-03-25

申请号：US16579330

申请日：2019-09-23

Applicant: Cisco Technology, Inc.

Inventor： Sandeep RAZDAN ,  Vipulkumar K. PATEL ,  Aparna R. PRASAD

IPC: G02B6/12 ,  G02B6/13 ,  H01L23/00 ,  B23K35/26

Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

公开(公告)号：US20210080662A1

公开(公告)日：2021-03-18

申请号：US16570040

申请日：2019-09-13

Applicant: Cisco Technology, Inc.

Inventor： Ashley J.M. ERICKSON ,  Anthony D. KOPINETZ ,  Vipulkumar K. PATEL

IPC: G02B6/42

Abstract: Embodiments herein describe an optical array unit configured to couple a photonic die with a plurality of optical fibers. The optical array unit includes alignment features which engage with alignment features on a corresponding photonic die. The engaged alignment features reduce the need for active alignment while also reducing the complexities of traditional passive alignment features.

公开(公告)号：US20200158949A1

公开(公告)日：2020-05-21

申请号：US16198251

申请日：2018-11-21

Applicant: Cisco Technology, Inc.

Inventor： Xunyuan ZHANG ,  Vipulkumar K. PATEL ,  Prakash B. GOTHOSKAR

IPC: G02B6/122 ,  G02B6/136

Abstract: A method of fabricating an optical apparatus comprises forming a first waveguide on a dielectric substrate. The first waveguide extends in a direction of an optical path. The first waveguide comprises a monocrystalline semiconductor material and is doped with a first conductivity type. The method further comprises depositing a first dielectric layer on the first waveguide, etching a first opening that extends at least partly through the first dielectric layer, and forming a second waveguide at least partly overlapping the first waveguide along the direction. The second waveguide is doped with a different, second conductivity type. Forming the second waveguide comprises depositing a monocrystalline semiconductor material on the first dielectric layer, whereby the first opening is filled with the deposited monocrystalline semiconductor material.

公开(公告)号：US20240272385A1

公开(公告)日：2024-08-15

申请号：US18167003

申请日：2023-02-09

Applicant: Cisco Technology, Inc.

Inventor： Li CHEN ,  Long CHEN ,  Norbert SCHLEPPLE ,  Aparna R. PRASAD ,  Vipulkumar K. PATEL

IPC: G02B6/42

CPC classification number: G02B6/4251 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/4238

Abstract: Photonic packages with underfill dam structures are described. The underfill dam structures address various underfill material location issues by controlling where an underfill material flows and which areas of the photonic package underfill material is excluded from entering.