POLYETHYLENE POUCH AND THE FABRICATION METHOD THEREOF

    公开(公告)号:US20220088886A1

    公开(公告)日:2022-03-24

    申请号:US17418028

    申请日:2018-12-28

    Abstract: The present disclosure is concerned with a method of forming a seal with a polyethylene based film structure. The polyethylene based film structure has at least one layer formed with an oriented polyethylene having a predetermined melting temperature (Tm). A conductive heat sealing device provides heat to form the seal, where a first sealing bar of the conductive heat sealing device operates at a first operating temperature of at least 10 degrees Celsius (° C.) below the Tm of the oriented polyethylene in the polyethylene based film structure and a second sealing bar of the conductive heat sealing device operates at a second operating temperature of at least 15° C. higher than the operating temperature of the first sealing bar. The seal formed with the polyethylene based film structure retains at least 99 percent of its original surface area prior to forming the seal.

    MULTILAYER STRUCTURES, PROCESSES FOR MANUFACTURING MULTILAYER STRUCTURES, AND RELATED ARTICLES

    公开(公告)号:US20200040442A1

    公开(公告)日:2020-02-06

    申请号:US16495467

    申请日:2018-04-23

    Abstract: The present invention provides multilayer structures and articles formed from such structures. In one aspect, a multilayer structure comprises (a) a biaxially oriented polyethylene film comprising an outer layer that comprises a first polyethylene composition comprising at least two linear low density polyethylenes, wherein the first polyethylene composition has a density of 0.910 to 0.940 g/cm3, an MWHDE>95 greater than 135 kg/mol and an IHDE>95 greater than 42 kg/mol, wherein the film has a thickness of 10 to 60 microns after orientation; and (b) a metal layer comprising a metal deposited on the outer layer, wherein the metal comprises Al, Zn, Au, Ag, Cu, Ni, Cr, Ge, Se, Ti, Sn, or oxides thereof, and wherein the multilayer structure has an optical density of 1.0 to 3.6, wherein the multilayer structure has a 2% secant modulus of at least 300 MPa in the machine direction when measured according to ASTM D882, and wherein the multilayer structure has an oxygen gas transmission rate of 350 cc/[m2-day] or less when measured according to ASTM D3985-05. Embodiments of the present invention also relate to processes for manufacturing multilayer structures.

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