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102 条记录 (耗时 0.026 秒)

    Spring loaded microwave interconnector
    22.
    发明申请
    Spring loaded microwave interconnector 有权
    弹簧微波互连器

    公开(公告)号：US20080258848A1

    公开(公告)日：2008-10-23

    申请号：US11788140

    申请日：2007-04-19

    申请人： Clifton Quan ,  David E. Roberts ,  Shahrokh Hashemi-Yeganeh ,  Richard A. Montgomery

    发明人： Clifton Quan ,  David E. Roberts ,  Shahrokh Hashemi-Yeganeh ,  Richard A. Montgomery

    IPC分类号： H01P1/10 ,  H03H7/38

    CPC分类号： H01P5/107 ,  G01R1/06722 ,  H01R13/2421 ,  H03H7/38

    摘要： A spring loaded microwave interconnector (SLMI). The SLMI includes a waveguide probe head having a first side and opposite thereto a second side, the sides transverse to a central axis. A spring loaded coax central conductor coupled to the probe head first side and provides a distal conductive tip. The coax central conductor extends along the central axis. A dielectric sleeve is disposed about the coax central conductor adjacent to the first side. The distal conductive tip extending beyond the dielectric sleeve when in an extended position and is about flush with the dielectric sleeve when in a compressed poison. An multiport waveguide to multiport PCB assembly utilizing a plurality of SLMIs wherein the multiport waveguide and PCB have curved contours is also disclosed.

    摘要翻译： 弹簧加载微波互连器（SLMI）。 SLMI包括具有第一侧并与其相对的第二侧的波导探针头，该侧面横向于中心轴线。 耦合到探针头第一侧的弹簧加载的同轴中心导体，并提供远端导电尖端。 同轴中心导体沿着中心轴线延伸。 电介质套筒围绕与第一侧相邻的同轴电缆中心导体设置。 远端导电尖端在处于延伸位置时延伸超出介质套管并且当处于压缩毒物时与电介质套管大致平齐。 还公开了利用多个SLMI多端口PCB组件的多端口波导，其中多端口波导和PCB具有弯曲轮廓。

    Conformal electronically scanned phased array antenna and communication system for helmets and other platforms
    23.
    发明申请
    Conformal electronically scanned phased array antenna and communication system for helmets and other platforms 有权
    用于头盔和其他平台的保形电子扫描相控阵天线和通信系统

    公开(公告)号：US20080191950A1

    公开(公告)日：2008-08-14

    申请号：US11705213

    申请日：2007-02-13

    申请人： Ike Y. Chang ,  Richard W. Nichols ,  Clifton Quan ,  Jonathan D. Gordon ,  Irwin L. Newberg

    发明人： Ike Y. Chang ,  Richard W. Nichols ,  Clifton Quan ,  Jonathan D. Gordon ,  Irwin L. Newberg

    IPC分类号： H01Q1/27 ,  H01Q1/38 ,  H01Q9/04

    CPC分类号： H01Q1/276 ,  H01Q3/34 ,  H01Q13/106 ,  H01Q13/18 ,  H01Q21/0075 ,  H01Q21/064

    摘要： A phased array antenna adapted to be mounted in a helmet. In the illustrative embodiment, the antenna comprises a substrate and an array of radiating elements disposed on said substrate, each of the elements including a-resonant cavity and a mechanism for feeding the cavity with an electromagnetic signal., The cavity is formed in a multi-layer structure between a ground plane and a layer of metallization. A radiating slot or slots are provided in the layer of metallization. A first layer of dielectric material is disposed within the cavity. The feed mechanism is a microstrip feed disposed in the first layer of dielectric material parallel to a plane of a portion of the substrate over which an associated element is disposed. A layer of foam is disposed between the layer of dielectric material and the ground plane. Second and third parallel layers of dielectric material are included in each element. The second layer is disposed adjacent to the ground plane. A layer of element interconnection circuitry is disposed between the second and third layers of dielectric material. A transmit/receive module or circuitry for each element is secured to the third layer of dielectric material. The substrate may be conformal or conformable, as well as rigid. An arrangement is included for steering a beam transmitted or received by the antenna.

    摘要翻译： 适合安装在头盔中的相控阵天线。 在说明性实施例中，天线包括衬底和布置在所述衬底上的辐射元件阵列，每个元件包括谐振腔和用于向空腔馈送电磁信号的机构，空腔形成为多 在地平面和金属化层之间的层结构。 在金属化层中提供辐射槽或槽。 介电材料的第一层设置在空腔内。 馈送机构是布置在电介质材料的第一层中的平行于衬底部分的平面的微带馈电，相关元件设置在该平面上。 一层泡沫体设置在介电材料层和接地平面之间。 介电材料的第二和第三平行层包括在每个元件中。 第二层设置在接地平面附近。 元件互连电路层设置在介电材料的第二和第三层之间。 用于每个元件的发射/接收模块或电路固定到第三层电介质材料。 衬底可以是适形的或适形的，以及刚性的。 包括用于控制由天线发送或接收的波束的布置。

    Airship mounted array
    24.
    发明申请
    Airship mounted array 有权
    飞艇安装阵列

    公开(公告)号：US20080030413A1

    公开(公告)日：2008-02-07

    申请号：US11499593

    申请日：2006-08-04

    申请人： Jar J. Lee ,  Clifton Quan ,  Stanley W. Livingston

    发明人： Jar J. Lee ,  Clifton Quan ,  Stanley W. Livingston

    IPC分类号： H01Q1/28

    CPC分类号： H01Q1/1292 ,  H01Q1/286 ,  H01Q3/46 ,  H01Q5/42 ,  H01Q21/0018

    摘要： A space-fed conformal array for a high altitude airship includes a primary array lens assembly adapted for conformal mounting to a non-planar airship surface. The lens assembly includes a first set of radiator elements and a second set of radiator elements, the first set and the second set spaced apart by a spacing distance. The first set of radiators faces outwardly from the airship surface to provide a radiating aperture. The second set of radiators faces inwardly toward an inner space of the airship, for illumination by a feed array spaced from the second set of radiators.

    摘要翻译： 用于高空飞艇的空间馈电保形阵列包括适于安装到非平面飞艇表面的主阵列透镜组件。 透镜组件包括第一组散热器元件和第二组散热器元件，第一组和第二组间隔开间隔距离。 第一组散热器从飞艇表面向外面向外提供辐射孔。 第二组散热器向内朝向飞艇的内部空间，用于通过与第二组散热器间隔开的进给阵列进行照明。

    Low cost 2-D electronically scanned array with compact CTS feed and MEMS phase shifters
    28.
    发明授权
    Low cost 2-D electronically scanned array with compact CTS feed and MEMS phase shifters 有权
    低成本的2-D电子扫描阵列，具有紧凑的CTS馈电和MEMS移相器

    公开(公告)号：US06677899B1

    公开(公告)日：2004-01-13

    申请号：US10373941

    申请日：2003-02-25

    申请人： Jar J. Lee ,  Clifton Quan ,  Brian M. Pierce

    发明人： Jar J. Lee ,  Clifton Quan ,  Brian M. Pierce

    IPC分类号： H01Q300

    CPC分类号： H01Q3/36

    摘要： A microelectromechanical system (MEMS) steerable electronically scanned lens array (ESA) antenna and method of frequency scanning are disclosed. The MEMS ESA antenna includes a MEMS E-plane steerable lens array and a MEMS H-plane steerable linear array. The MEMS E-plane steerable lens array includes first and second arrays of wide band radiating elements, and an array of MEMS E-plane phase shifter modules disposed between the first and second arrays of radiating elements. The MEMS H-plane steerable linear array includes a continuous transverse stub (CTS) feed array and an array of MEMS H-plane phase shifter modules at an input of the CTS feed array. The MEMS H-plane steerable linear array is disposed adjacent the first array of radiating elements of the MEMS E-plane steerable lens array for providing a planar wave front in the near field. The H-plane phase shifter modules shift RF signals input into the CTS feed array based on the phase settings of the H-plane phase shifter modules, and the E-plane phase shifter modules steer a beam radiated from the CTS feed array in an E-plane based on the phase settings of the E-plane phase shifter modules.

    摘要翻译： 公开了一种微机电系统（MEMS）可控电子扫描透镜阵列（ESA）天线和频率扫描方法。 MEMS ESA天线包括MEMS E平面可控透镜阵列和MEMS H平面可导向线性阵列。 MEMS E平面可控透镜阵列包括宽带辐射元件的第一和第二阵列，以及设置在辐射元件的第一和第二阵列之间的MEMS E平面移相器模块阵列。 MEMS H平面可导向线性阵列包括在CTS馈送阵列的输入处的连续横向短截线（CTS）馈电阵列和MEMS H平面移相器模块阵列。 MEMS H平面可导向线性阵列邻近MEMS E平面可控透镜阵列的第一辐射元件阵列设置，用于在近场提供平面波前。 H平面移相器模块基于H平面移相器模块的相位设置将输入到CTS馈送阵列的RF信号移位，并且E平面移相器模块将从CTS馈送阵列辐射的光束转向E 基于E平面移相器模块的相位设置。

    Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities
    29.
    发明授权
    Wideband shielded coaxial to microstrip orthogonal launcher using distributed discontinuities 失效
    宽带屏蔽同轴微带正交发射器使用分布式不连续性

    公开(公告)号：US06236287B1

    公开(公告)日：2001-05-22

    申请号：US09310525

    申请日：1999-05-12

    申请人： Clifton Quan ,  Edward L. Robertson ,  Rosie M. Jorgenson ,  Mark Y. Hashimoto ,  David E. Roberts

    发明人： Clifton Quan ,  Edward L. Robertson ,  Rosie M. Jorgenson ,  Mark Y. Hashimoto ,  David E. Roberts

    IPC分类号： H01P104

    CPC分类号： H01P5/085

    摘要： A coaxial-to-microstrip vertical transition includes a dielectric substrate having formed on a first surface thereof a primary microstrip conductor trace, and on a second surface a secondary microstrip conductor trace. A first conductive via extends through the dielectric substrate and electrically connects the primary conductor trace to the secondary conductor trace. A second conductive via is spaced from the first conductive via and extends through the dielectric substrate to electrically connect the secondary conductor trace to the coaxial center conductor. A bottom microstrip ground plane layer is defined on the second substrate surface. A conductive base plate structure has a cavity formed therein, the substrate positioned such that the base plate structure is in contact with the bottom ground plane layer, and the secondary conductor trace is positioned over the cavity. The substrate is positioned between a cover structure and the base plate structure, the cover structure disposed in spaced relation with respect to the first surface of the substrate. A coaxial transmission line structure includes an outer shield and a coaxial center conductor structure disposed within the outer conductor and transverse to the substrate, the center conductor passed through an opening in the cover structure to contact the second via. A conductive plate structure is positioned between the plane of the cover structure and the substrate, providing shielding surrounding the center conductor between the cover and the substrate.

    摘要翻译： 同轴对微带垂直转变包括在其第一表面上形成有初级微带导体迹线的介质基片，在第二表面上形成次级微带导体迹线。 第一导电通孔延伸穿过电介质基板并将初级导体迹线电连接到次级导体迹线。 第二导电通孔与第一导电通孔间隔开并延伸穿过电介质基板，以将次导体迹线电连接到同轴中心导体。 底部微带接地平面层限定在第二基板表面上。 导电基板结构具有形成在其中的空腔，基板被定位成使得底板结构与底部接地平面层接触，并且次级导体迹线位于空腔上方。 基板位于盖结构和基板结构之间，盖结构相对于基板的第一表面间隔开设置。 同轴传输线结构包括外屏蔽和同轴中心导体结构，其设置在外导体内且横向于衬底，中心导体穿过盖结构中的开口以接触第二通孔。 导电板结构位于盖结构的平面和基板之间，提供围绕盖和基板之间的中心导体的屏蔽。

    Injection molded offset slabline RF feedthrough for active array aperture interconnect
    30.
    发明授权
    Injection molded offset slabline RF feedthrough for active array aperture interconnect 失效
    注射偏移平板线RF馈通用于有源阵列孔径互连

    公开(公告)号：US5703599A

    公开(公告)日：1997-12-30

    申请号：US607037

    申请日：1996-02-26

    申请人： Clifton Quan ,  Peter Holbrook ,  Bill Batterton ,  Pat Fitzgerald ,  Dan Roper ,  Min Takaki

    发明人： Clifton Quan ,  Peter Holbrook ,  Bill Batterton ,  Pat Fitzgerald ,  Dan Roper ,  Min Takaki

    IPC分类号： H01Q13/08 ,  H01Q21/00 ,  H01Q3/26

    CPC分类号： H01Q21/0087 ,  H01Q13/085 ,  H01Q21/0025

    摘要： An offset RF interconnect structure for interconnecting an active array radiating aperture to a transmit/receive (T/R) module sub-array, wherein the corresponding input/output (I/O) ports lie on different lattices. The interconnect structure employs dielectric-filled slabline transmission line, which includes a center conductor wire conductor bent to form the offset interconnection between two ports misaligned in two dimensions. The structure includes a dielectric housing that is formed by injection molding about the center slabline wire conductor. The offset interconnect structure can be integrated with an in-line coaxial interconnect structure.

    摘要翻译： 用于将有源阵列辐射孔与用于将发射/接收（T / R）模块子阵列互连的偏移RF互连结构，其中相应的输入/输出（I / O）端口位于不同的晶格上。 互连结构采用介质填充的板条传输线，其包括弯曲的中心导体导线导体，以形成两个端口在两个尺寸上不对准的偏移互连。 该结构包括通过围绕中心板线导线注射成型形成的电介质外壳。 偏移互连结构可以与在线同轴互连结构集成。