MULTIPLE-SENSE THERMO-RESISTIVE SENSOR FOR CONTACT DETECTION OF READ-WRITE HEADS
    21.
    发明申请
    MULTIPLE-SENSE THERMO-RESISTIVE SENSOR FOR CONTACT DETECTION OF READ-WRITE HEADS 有权
    用于接触检测读写头的多感测热电阻传感器

    公开(公告)号:US20130083430A1

    公开(公告)日:2013-04-04

    申请号:US13250204

    申请日:2011-09-30

    IPC分类号: G11B5/60

    CPC分类号: G11B5/6076 G11B5/607

    摘要: Techniques of the present invention include detecting a touchdown between a read/write head of a disk drive and a surface of a magnetic disk using multiple touchdown sensors located at an air-bearing surface (ABS). The multiple sensors increase the likelihood that a touchdown event—i.e., a portion of the ABS of the head contacting the underlying magnetic disk surface—will be detected. During touchdown, the portion of the head contacting the magnetic disk generates frictional heat which changes a characteristic (e.g., the electrical resistance) of at least one of the sensors located at the ABS. When the sensors are connected to a detection circuit, the changing characteristic may be monitored to identify a touchdown event. The touchdown sensors may be, for example, electrically connected in either series or parallel to the detection circuit. Thus, as long as the electrical resistance of one of the sensors is changed, a touchdown event may be detected.

    摘要翻译: 本发明的技术包括使用位于空气轴承表面(ABS)的多个触地传感器检测磁盘驱动器的读/写磁头与磁盘表面之间的触地。 多个传感器增加触发事件 - 即头部的ABS的一部分接触下面的磁盘表面 - 将被检测的可能性。 触地时,头部与磁盘接触的部分产生摩擦热,该摩擦热改变位于ABS处的至少一个传感器的特性(例如,电阻)。 当传感器连接到检测电路时,可以监视变化特性以识别触地事件。 触地传感器可以例如以串联或并联的方式电连接到检测电路。 因此,只要传感器之一的电阻改变,就可以检测到触地事件。

    Wafer level testing
    22.
    发明授权
    Wafer level testing 有权
    晶圆级测试

    公开(公告)号:US07999566B2

    公开(公告)日:2011-08-16

    申请号:US12006406

    申请日:2007-12-31

    IPC分类号: G01R31/26

    摘要: A wafer comprises a kerf region and a test chip. The kerf is a region in a wafer designated to be destroyed by chip dicing. The test chip is located within the kerf region and is configured to provide parametric data for a wafer fabrication process of a head. The test chip comprises a shield portion of a first shield layer electrically coupled to an element, a first pad within a second shield layer electrically coupled to the element, and a second pad within the second shield layer electrically coupled to the shield portion.

    摘要翻译: 晶片包括切口区域和测试芯片。 切屑是指定通过芯片切割破坏的晶片中的区域。 测试芯片位于切口区域内并且被配置为提供头部的晶片制造过程的参数数据。 测试芯片包括电耦合到元件的第一屏蔽层的屏蔽部分,电耦合到元件的第二屏蔽层内的第一焊盘以及电耦合到屏蔽部分的第二屏蔽层内的第二焊盘。

    TEST COMPONENTS FABRICATED WITH PSEUDO SENSORS USED FOR DETERMINING THE RESISTANCE OF AN MR SENSOR
    23.
    发明申请
    TEST COMPONENTS FABRICATED WITH PSEUDO SENSORS USED FOR DETERMINING THE RESISTANCE OF AN MR SENSOR 有权
    用于确定MR传感器电阻的PSEUDO传感器的测试组件

    公开(公告)号:US20090168216A1

    公开(公告)日:2009-07-02

    申请号:US11965612

    申请日:2007-12-27

    IPC分类号: G11B27/36

    摘要: Test methods and components are disclosed for testing resistances of magnetoresistance (MR) sensors in read elements. Test components are fabricated on a wafer with a first test lead, a pseudo sensor, and a second test lead. The test leads and MR sensor are fabricated with similar processes as first shields, MR sensors, and second shields of read elements on the wafer. However, the pseudo sensor in the test component is fabricated with lead material (or another material having similar resistance properties) instead of an MR thin-film structure like an MR sensor. Forming the pseudo sensor from lead material causes the resistance of the pseudo sensor to be insignificant compared to the lead resistance. Thus, a resistance measurement of the test component represents the lead resistance of a read element. An accurate resistance measurement of an MR sensor in a read element may then be determined by subtracting the lead resistance.

    摘要翻译: 公开了用于测试读取元件中的磁阻(MR)传感器的电阻的测试方法和组件。 在具有第一测试导线,伪传感器和第二测试导线的晶片上制造测试部件。 测试引线和MR传感器采用与晶片上的读取元件的第一屏蔽,MR传感器和第二屏蔽件类似的工艺制造。 然而,测试部件中的伪传感器用诸如MR传感器的MR薄膜结构的铅材料(或具有相似电阻特性的另一种材料)代替。 从铅材料形成伪传感器导致伪传感器的电阻与引线电阻相比不显着。 因此,测试部件的电阻测量表示读取元件的引线电阻。 然后可以通过减去引线电阻来确定读取元件中的MR传感器的精确电阻测量。

    Wafer level testing
    24.
    发明申请
    Wafer level testing 有权
    晶圆级测试

    公开(公告)号:US20090167333A1

    公开(公告)日:2009-07-02

    申请号:US12006406

    申请日:2007-12-31

    IPC分类号: G01R31/02 G01R31/26

    摘要: A wafer comprises a kerf region and a test chip. The kerf is a region in a wafer designated to be destroyed by chip dicing. The test chip is located within the kerf region and is configured to provide parametric data for a wafer fabrication process of a head. The test chip comprises a shield portion of a first shield layer electrically coupled to an element, a first pad within a second shield layer electrically coupled to the element, and a second pad within the second shield layer electrically coupled to the shield portion.

    摘要翻译: 晶片包括切口区域和测试芯片。 切屑是指定通过芯片切割破坏的晶片中的区域。 测试芯片位于切口区域内并且被配置为提供头部的晶片制造过程的参数数据。 测试芯片包括电耦合到元件的第一屏蔽层的屏蔽部分,电耦合到元件的第二屏蔽层内的第一焊盘以及电耦合到屏蔽部分的第二屏蔽层内的第二焊盘。

    Recording heads having electrical pads on multiple surfaces
    26.
    发明授权
    Recording heads having electrical pads on multiple surfaces 失效
    在多个表面上具有电焊盘的记录头

    公开(公告)号:US07446977B2

    公开(公告)日:2008-11-04

    申请号:US11043490

    申请日:2005-01-26

    IPC分类号: G11B5/60

    摘要: A recording head is disclosed that includes electrical pads on multiple surfaces. The recording head includes a substrate portion abutting a deposited portion. The deposited portion includes an air bearing surface (ABS) (or bottom surface), an end surface, and at least one other surface. The end surface is the surface traditionally used by head designers for electrical pads. In accord with the invention, one or more electrical pads are included on the other surfaces of the deposited portion (i.e., a surface other than the end surface). Electrical pads may also be included on the end surface.

    摘要翻译: 公开了一种包括多个表面上的电焊盘的记录头。 记录头包括邻接沉积部分的基底部分。 沉积部分包括空气轴承表面(ABS)(或底表面),端表面和至少另一个表面。 端面是传统上由头设计师用于电焊盘的表面。 根据本发明,一个或多个电焊盘包括在沉积部分的其它表面(即除了端面之外的表面)上。 电焊盘也可以包括在端面上。

    Magnetic head with thin trailing pedestal layer
    27.
    发明授权
    Magnetic head with thin trailing pedestal layer 失效
    磁头与薄拖尾基座层

    公开(公告)号:US07292409B1

    公开(公告)日:2007-11-06

    申请号:US10788766

    申请日:2004-02-27

    IPC分类号: G11B5/147 G11B5/17 G11B5/187

    摘要: A magnetic head for a disk drive is disclosed that has a first soft magnetic pole layer disposed in the head adjacent to a medium-facing surface and extending perpendicular to the medium-facing surface; a second soft magnetic pole layer disposed closer than the first pole layer to the trailing end, the second pole layer magnetically coupled to the first pole layer in a backgap region; a soft magnetic pedestal adjoining the second pole layer, disposed closer than the second pole layer to the medium-facing surface and extending less than the second pole layer extends from the medium-facing surface, the pedestal separated from the first pole layer by a nonferromagnetic gap, the pedestal having a thickness that is less than four hundred and fifty nanometers between the gap and the second pole layer. Longitudinal and perpendicular recording embodiments are disclosed, as well as solenoidal, single-layer and dual-layer reversed-current coil structures.

    摘要翻译: 公开了一种用于磁盘驱动器的磁头,其具有第一软磁极层,该第一软磁极层设置在与中间面向表面相邻并且垂直于介质面向表面延伸的头部中; 第二软磁极层,设置成比所述第一极层更靠近所述后端,所述第二极层在后隙区域中磁耦合到所述第一极层; 邻近第二极层的软磁性基座设置成比第二极层更靠近介质相对表面并且延伸小于第二极层从中介面向表面延伸,基座与第一极层分离,由非铁磁 间隙,所述基座在所述间隙和所述第二极层之间具有小于四百五十纳米的厚度。 公开纵向和垂直记录实施例,以及螺线管,单层和双层反向电流线圈结构。

    Stitched pole write element with a T-shaped pole tip portion
    28.
    发明授权
    Stitched pole write element with a T-shaped pole tip portion 有权
    带有T形极端部分的针脚写入元件

    公开(公告)号:US07116517B1

    公开(公告)日:2006-10-03

    申请号:US10323128

    申请日:2002-12-18

    IPC分类号: G11B5/147

    摘要: A T-shaped pole tip portion of an upper pole of a write element for a magnetic disk drive is provided. One end of the pole tip portion, constituting the bottom of the “T,” forms a narrow nose segment at an air bearing surface, while a wing segment at the opposite end of the pole tip portion constitutes the cross-bar top of the “T.” A transition segment extends between the nose segment and the wing segment. A yoke portion of the upper pole includes a surface that is parallel to the air bearing surface and recessed therefrom by a P3R depth. The transition segment does not widen significantly until after the P3R depth, accordingly, the wing segment is recessed from the air bearing surface by more than the P3R depth.

    摘要翻译: 提供了用于磁盘驱动器的写入元件的上极的T形极尖部分。 构成“T”底部的极端部的一端在空气轴承面形成窄的鼻部,而在极尖部的另一端的翼部构成“ T.“ 过渡段在鼻段和翼段之间延伸。 上极的轭部包括平行于空气轴承表面并且通过P 3 R深度从其中凹入的表面。 在P 3 R深度之后,过渡段不会显着扩大,因此翼段从空气轴承表面凹陷多于P 3 R深度。

    Multiple-sense thermo-resistive sensor for contact detection of read-write heads
    30.
    发明授权
    Multiple-sense thermo-resistive sensor for contact detection of read-write heads 有权
    用于读写头接触检测的多感测热电阻传感器

    公开(公告)号:US08854764B2

    公开(公告)日:2014-10-07

    申请号:US13250204

    申请日:2011-09-30

    IPC分类号: G11B21/02 G11B5/60

    CPC分类号: G11B5/6076 G11B5/607

    摘要: Techniques of the present invention include detecting a touchdown between a read/write head of a disk drive and a surface of a magnetic disk using multiple touchdown sensors located at an air-bearing surface (ABS). The multiple sensors increase the likelihood that a touchdown event—i.e., a portion of the ABS of the head contacting the underlying magnetic disk surface—will be detected. During touchdown, the portion of the head contacting the magnetic disk generates frictional heat which changes a characteristic (e.g., the electrical resistance) of at least one of the sensors located at the ABS. When the sensors are connected to a detection circuit, the changing characteristic may be monitored to identify a touchdown event. The touchdown sensors may be, for example, electrically connected in either series or parallel to the detection circuit. Thus, as long as the electrical resistance of one of the sensors is changed, a touchdown event may be detected.

    摘要翻译: 本发明的技术包括使用位于空气轴承表面(ABS)的多个触地传感器检测磁盘驱动器的读/写磁头与磁盘表面之间的触地。 多个传感器增加触发事件 - 即头部的ABS的一部分接触下面的磁盘表面 - 将被检测的可能性。 触地时,头部与磁盘接触的部分产生摩擦热,该摩擦热改变位于ABS处的至少一个传感器的特性(例如,电阻)。 当传感器连接到检测电路时,可以监视变化特性以识别触地事件。 触地传感器可以例如以串联或并联的方式电连接到检测电路。 因此,只要传感器之一的电阻改变,就可以检测到触地事件。