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    Wafer support system
    21.
    发明授权
    Wafer support system 有权
    晶圆支撑系统

    公开(公告)号：US06343183B1

    公开(公告)日：2002-01-29

    申请号：US09605094

    申请日：2000-06-27

    申请人： Michael W. Halpin ,  Mark R. Hawkins ,  Derrick W. Foster ,  Robert M. Vyne ,  John F. Wengert ,  Cornelius A. van der Jeugd ,  Loren R. Jacobs ,  Frank B. M. Van Bilsen ,  Matthew Goodman ,  Hartmann Glenn ,  Jason M. Layton

    发明人： Michael W. Halpin ,  Mark R. Hawkins ,  Derrick W. Foster ,  Robert M. Vyne ,  John F. Wengert ,  Cornelius A. van der Jeugd ,  Loren R. Jacobs ,  Frank B. M. Van Bilsen ,  Matthew Goodman ,  Hartmann Glenn ,  Jason M. Layton

    IPC分类号： A21B200

    CPC分类号： C23C16/4586 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68792 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support a wafer in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The support arms conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages are arranged to heat the sweep gas prior to delivery underneath the wafer. Short purge channels may be provided to deliver some of the sweep gas to regions surrounding the spacers to cause a continuous flow of protective purge gas around the spacers. A common bottom section may cooperate with a plurality of different top sections to form segmented susceptors suitable for supporting various sized wafers.

    摘要翻译： 一种晶片支撑系统，其包括具有顶部和底部部分的分段式基座以及穿过其中的气体流动通道。 从形成在基座的顶部的凹部突出的多个间隔件相对于凹部间隔开地支撑晶片。 吹扫气体被引入到分段基座的底部，并且穿过气体流动通道，在凹槽中的至少一个圆形阵列的出口和间隔开的晶片之下排出。 吹扫气体在基座和晶片之间径向向外行进，以防止晶片的背面污染。 气体通过中空驱动轴输送到基座下方的多臂感受器支架中。 支撑臂将吹扫气体从驱动轴传导到分段基座中的气体通道。 气体通道被布置成在散布在晶片之下之前加热吹扫气体。 可以提供短的吹扫通道以将一些吹扫气体输送到围绕间隔物的区域，以引起隔离物周围的保护性吹扫气体的连续流动。 共同的底部部分可以与多个不同的顶部部分配合以形成适合于支撑各种尺寸的晶片的分段式基座。

    System and method for managing access of a fleet of mobile machines to a resource having multiple entry points
    24.
    发明授权
    System and method for managing access of a fleet of mobile machines to a resource having multiple entry points 失效
    用于管理移动机器队伍对具有多个入口点的资源的访问的系统和方法

    公开(公告)号：US5897595A

    公开(公告)日：1999-04-27

    申请号：US770208

    申请日：1996-12-19

    申请人： Mark R. Hawkins ,  Carl A. Kemner ,  Craig L. Koehrsen

    发明人： Mark R. Hawkins ,  Carl A. Kemner ,  Craig L. Koehrsen

    IPC分类号： G05D1/02 ,  G05D1/00 ,  G01C22/00

    CPC分类号： G05D1/0297 ,  G05D1/0236 ,  G05D1/027 ,  G05D1/0278 ,  G05D2201/0202

    摘要： The invention is a system and method for managing a resource having multiple entry points. Each mobile machine includes a queue manager for generating a queue position request upon approach to the resource. A resource manager establishes queues, one for each entry point to the resource, to control access to the resource. Upon receiving a queue position request from an approaching mobile machine, the resource manager determines which queue to place the mobile machine, and then generates a queue position and sends a queue position signal to the approaching mobile machine.

    摘要翻译： 本发明是用于管理具有多个入口点的资源的系统和方法。 每个移动机器包括队列管理器，用于在接近资源时生成队列位置请求。 资源管理器建立队列，为资源的每个入口点设置一个队列，以控制对资源的访问。 在从接近的移动机器接收到队列位置请求时，资源管理器确定哪个队列放置在移动机器上，然后生成队列位置，并向接近的移动机器发送队列位置信号。

    Cold oil protection circuit for a hydraulic system
    25.
    发明授权
    Cold oil protection circuit for a hydraulic system 失效
    液压系统冷油保护回路

    公开(公告)号：US5564274A

    公开(公告)日：1996-10-15

    申请号：US571422

    申请日：1995-12-13

    申请人： Lee R. Denbraber ,  Mark R. Hawkins ,  David R. Meinhold ,  Steven J. Zmuda

    发明人： Lee R. Denbraber ,  Mark R. Hawkins ,  David R. Meinhold ,  Steven J. Zmuda

    IPC分类号： F15B21/04 ,  F15B13/08

    CPC分类号： F15B21/045 ,  Y10T137/7737 ,  Y10T137/86614

    摘要： A cold fluid protection circuit is provided for controlling the rate of fluid flow in a hydraulic system in response to the temperature of the oil in a reservoir. The subject invention includes a temperature sensor operative to sense the temperature of the fluid in the reservoir and deliver an electrical signal representative thereof to a controller. The controller processes the sensed temperature with respect to the rate of flow in the hydraulic system that is returning to the reservoir from an actuator through a fluid conditioning mechanism and proportionally reduces the rate of flow therethrough by controllably reducing the displacement of a directional valve mechanism in response to the sensed temperature.

    摘要翻译： 提供冷流体保护电路，用于响应于储存器中的油的温度来控制液压系统中的流体流速。 本发明包括温度传感器，其操作以感测储存器中的流体的温度并将其代表的电信号传送到控制器。 控制器相对于通过流体调节机构从致动器返回到储存器的液压系统中的流速来处理感测到的温度，并且通过可控地减小其中的方向阀机构的位移而成比例地降低其中的流量 响应感测温度。

    Gas injectors for reaction chambers in CVD systems
    26.
    发明授权
    Gas injectors for reaction chambers in CVD systems 失效
    CVD系统中反应室的气体注入器

    公开(公告)号：US5221556A

    公开(公告)日：1993-06-22

    申请号：US66019

    申请日：1987-06-24

    申请人： Mark R. Hawkins ,  McDonald Robinson

    发明人： Mark R. Hawkins ,  McDonald Robinson

    IPC分类号： C23C16/455 ,  C30B25/14

    CPC分类号： C30B25/14 ,  C23C16/455

    摘要： The present invention relates to improved injectors for use in CVD reactor systems, and more specifically for use in epitaxial deposition systems for processing a single water-at-a-time. The improved injectors of the present invention are used to provide a predetermined desired shaped velocity profile for the injected reactant gases for insuring a more uniform deposition on a single wafer to be processed within the reactor system. In the first embodiment, the reactant gas is fed into a horizontal gas distribution manifold cavity and distributed horizontally in both directions. The gas then passes through a manifold wall having a pattern of predetermined sized and spaced apertures therein. The size of the apertures and the distribution of these sizes, shapes the resultant velocity profile to a desired pattern. Since the volume flow rate through each aperture of the manifold member increases as the diameter of the aperture increases, the resultant velocity profile produced will have its maximum at the center where the largest apertures exist and its minimum at the sides where the smallest apertures exist and the velocity profile will have a desired predetermined shape as it exits the gas delivery chamber and is turned 90.degree. for injection into the input of the reaction chamber. In an alternate embodiment, a plurality of linearly dimensioned slots are provided between spacer legs for producing the predetermined desired shaped velocity profile.

    摘要翻译： 本发明涉及用于CVD反应器系统的改进的喷射器，更具体地涉及用于一次处理单个水的外延沉积系统。 本发明的改进的喷射器用于为注入的反应气体提供预定的期望的成形速度分布，以确保在反应器系统内待处理的单个晶片上更均匀的沉积。 在第一实施例中，反应气体被供给到水平气体分配歧管腔中，并且沿两个方向水平分布。 然后气体通过其中具有预定尺寸和间隔开的孔的图案的歧管壁。 孔的尺寸和这些尺寸的分布将合成的速度分布形成期望的图案。 由于通过歧管构件的每个孔口的体积流量随着孔径的增加而增加，所产生的合成速度分布将在存在最大孔径的中心处具有最大值，并且在存在最小孔隙的侧面处其最小值; 当离开气体输送室时，速度分布将具有期望的预定形状，并且转动90°以注入反应室的输入。 在替代实施例中，在间隔腿之间提供多个线性尺寸的狭槽，用于产生预定的所需成形速度分布。

    Method of loading a wafer onto a wafer holder to reduce thermal shock
    27.
    发明授权
    Method of loading a wafer onto a wafer holder to reduce thermal shock 有权
    将晶片装载到晶片架上以减少热冲击的方法

    公开(公告)号：US06861321B2

    公开(公告)日：2005-03-01

    申请号：US10118073

    申请日：2002-04-05

    申请人： Tony J. Keeton ,  Michael R. Stamp ,  Mark R. Hawkins

    发明人： Tony J. Keeton ,  Michael R. Stamp ,  Mark R. Hawkins

    IPC分类号： B65G49/07 ,  C23C16/46 ,  H01L21/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/336

    CPC分类号： H01L21/67109 ,  H01L21/67115 ,  H01L21/67748

    摘要： One or more of three different measures are taken to preheat a wafer before it is loaded into direct contact with a wafer holder, in order to provide optimal throughput while reducing the risk of thermal shock to the wafer. The first measure is to move the wafer holder to a raised position prior to inserting the wafer into the reaction chamber and holding the wafer above the wafer holder. The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hs purge gas) through the chamber prior to inserting the wafer therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) above the reaction chamber.

    摘要翻译： 在将晶片加载到与晶片保持器直接接触之前，采用三种不同的措施来预热晶片，以便提供最佳的吞吐量，同时降低对晶片的热冲击的风险。 第一个措施是在将晶片插入反应室并将晶片保持在晶片保持器上方之前将晶片保持器移动到升高位置。 第二个措施是在将晶片插入其中之前提供通过腔室的导热气体（例如Hs吹扫气体）的增加的流速。 第三个措施是向反应室上方的辐射热元件（例如，加热灯）提供功率偏压。

    Wafer support system
    29.
    发明授权
    Wafer support system 有权
    晶圆支撑系统

    公开(公告)号：US06203622B1

    公开(公告)日：2001-03-20

    申请号：US09480918

    申请日：2000-01-11

    申请人： Michael W. Halpin ,  Mark R. Hawkins ,  Derrick W. Foster ,  Robert M. Vyne ,  John F. Wengert ,  Cornelius A. van der Jeugd ,  Loren R. Jacobs

    发明人： Michael W. Halpin ,  Mark R. Hawkins ,  Derrick W. Foster ,  Robert M. Vyne ,  John F. Wengert ,  Cornelius A. van der Jeugd ,  Loren R. Jacobs

    IPC分类号： C23C1600

    CPC分类号： C23C16/45521 ,  C23C16/455 ,  C23C16/4584 ,  C23C16/4586 ,  H01L21/67109 ,  H01L21/68735 ,  H01L21/6875 ,  H01L21/68785

    摘要： A wafer support system comprising a segmented susceptor having top and bottom sections and gas flow passages therethrough. A plurality of spacers projecting from a recess formed in the top section of the susceptor support wafers in spaced relationship with respect to the recess. A sweep gas is introduced to the bottom section of the segmented susceptor and travels through the gas flow passages to exit in at least one circular array of outlets in the recess and underneath the spaced wafer. The sweep gas travels radially outward between the susceptor and wafer to prevent back-side contamination of the wafer. The gas is delivered through a hollow drive shaft and into a multi-armed susceptor support underneath the susceptor. The susceptor support arms are hollow and conduct the sweep gas from the drive shaft to the gas passages in the segmented susceptor. The gas passages within the segmented susceptor are arranged to provide even heat distribution from the sweep gas prior to delivery underneath the wafer. Short purge channels may be provided to deliver some of the sweep gas to regions surrounding the spacers to cause a continuous flow of protective purge gas around the spacers. A common bottom section may cooperate with a plurality of different top sections to form segmented susceptors suitable for supporting various sized wafers.

    摘要翻译： 一种晶片支撑系统，其包括具有顶部和底部部分的分段式基座以及穿过其中的气体流动通道。 从形成在基座的顶部的凹部突出的多个间隔件相对于凹部间隔开来。 吹扫气体被引入到分段基座的底部，并且穿过气体流动通道，在凹槽中的至少一个圆形阵列的出口和间隔开的晶片之下排出。 吹扫气体在基座和晶片之间径向向外行进，以防止晶片的背面污染。 气体通过中空驱动轴输送到基座下方的多臂感受器支架中。 基座支撑臂是中空的，并将吹扫气体从驱动轴传导到分段基座中的气体通道。 分段基座内的气体通道布置成在晶片下方分配之前提供均匀的来自吹扫气体的热分布。 可以提供短的吹扫通道以将一些吹扫气体输送到围绕间隔物的区域，以引起隔离物周围的保护性吹扫气体的连续流动。 共同的底部部分可以与多个不同的顶部部分配合以形成适合于支撑各种尺寸的晶片的分段式基座。