公开(公告)号：US20200016720A1

公开(公告)日：2020-01-16

申请号：US16507381

申请日：2019-07-10

Applicant: Ebara Corporation

Inventor： Akira NAKAMURA

IPC: B24B37/005 ,  G01B7/06 ,  B24B37/20

Abstract: A film thickness measuring apparatus and an end point detector monitor a film thickness of a conductive film based on an output of an eddy current sensor disposed in a polishing table. The output of the eddy current sensor includes an impedance component, and when a resistance component and a reactance component of the impedance component are associated with the respective axes of a coordinate system having two orthogonal coordinate axes, at least some points on the coordinate system corresponding to the impedance component form at least a part of a circle. The film thickness measuring apparatus determines a distance between a point on the coordinate system and the center of the circle, determines the film thickness from the impedance component and corrects the determined film thickness using the determined distance.

公开(公告)号：US20180016676A1

公开(公告)日：2018-01-18

申请号：US15647684

申请日：2017-07-12

Applicant: EBARA CORPORATION

Inventor： Akira NAKAMURA

IPC: C23C14/54 ,  G01N27/02

CPC classification number: C23C14/542 ,  B24B37/00 ,  B24B37/013 ,  B24B37/107 ,  B24B49/04 ,  B24B49/105 ,  G01N27/025

Abstract: Eddy current formable in a polishing target is detected as an impedance by an eddy current sensor. A resistance component and a reactance component of the impedance are associated with respective axes of a coordinate system having orthogonal axes, respectively. An angle calculator calculates the tangent of an intersection angle between a first straight line connecting a first point corresponding to an impedance for a zero film thickness, and a second point corresponding to an impedance for a non-zero film thickness, and a diameter of a circle passing through the first point. A film thickness calculator determines the film thickness from the tangent.

公开(公告)号：US20160074987A1

公开(公告)日：2016-03-17

申请号：US14832618

申请日：2015-08-21

Applicant: Ebara Corporation

Inventor： Taro TAKAHASHI ,  Hidetaka NAKAO ,  Akira NAKAMURA

IPC: B24B37/005 ,  B24B49/00 ,  H01L21/306 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683

CPC classification number: B24B37/005 ,  B24B49/00 ,  H01L22/14 ,  H01L22/20

Abstract: The present invention improves the accuracy of film thickness detection. A film thickness signal processing apparatus 230 is provided with a receiving unit 232 for receiving film thickness data output from an eddy-current sensor 210 for detecting the film thickness of a polishing object 102 along a surface to be polished thereof; an identifying unit 236 for identifying the effective range of the film thickness data on the basis of the film thickness data received by the receiving unit 232; and a correcting unit 238 for correcting the film thickness data within the effective range identified by the identifying unit 236.

Abstract translation: 本发明提高了膜厚检测的精度。 膜厚信号处理装置230设置有接收单元232，用于接收从涡流传感器210输出的膜厚度数据，用于沿着待抛光的表面检测抛光对象102的膜厚度; 识别单元236，用于基于由接收单元232接收的胶片厚度数据来识别胶片厚度数据的有效范围; 以及用于校正由识别单元236识别的有效范围内的膜厚度数据的校正单元238。

公开(公告)号：US20150314416A1

公开(公告)日：2015-11-05

申请号：US14800896

申请日：2015-07-16

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Takahiro SHIMANO ,  Akira IMAMURA ,  Akira NAKAMURA

IPC: B24B49/02 ,  B24B53/017 ,  B24B49/18 ,  B24B37/005

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B49/02 ,  B24B49/04 ,  B24B49/18 ,  B24B49/186 ,  B24B53/005 ,  B24B53/017 ,  B24B53/08

Abstract: A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

Abstract translation: 一种方法能够监测抛光垫的抛光表面，而无需从研磨台上移除抛光垫。 该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。