公开(公告)号：US20200009702A1

公开(公告)日：2020-01-09

申请号：US16454719

申请日：2019-06-27

Applicant: EBARA CORPORATION

Inventor： Lien Yin CHENG ,  Akira IMAMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA

IPC: B24B29/02 ,  B08B1/04 ,  H01L21/67 ,  B08B1/00

Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.

公开(公告)号：US20180289230A1

公开(公告)日：2018-10-11

申请号：US15946607

申请日：2018-04-05

Applicant: EBARA CORPORATION

Inventor： Akira IMAMURA ,  Junji KUNISAWA ,  Mitsuru MIYAZAKI

IPC: A47L11/18 ,  G01C1/00 ,  G05D3/20 ,  B24B29/00

Abstract: Various examples of a substrate cleaning apparatus and a substrate processing apparatus are described in the present disclosure. One example of the present invention is a substrate cleaning apparatus including a roll cleaning member cleaning a substrate, an inclination sensor detecting an inclination of the roll cleaning member, and an output device outputting a detection result of the inclination sensor.

公开(公告)号：US20160207162A1

公开(公告)日：2016-07-21

申请号：US15051928

申请日：2016-02-24

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Takahiro SHIMANO ,  Akira IMAMURA ,  Akira NAKAMURA

IPC: B24B37/005

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B49/02 ,  B24B49/04 ,  B24B49/18 ,  B24B49/186 ,  B24B53/005 ,  B24B53/017 ,  B24B53/08

Abstract: A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

公开(公告)号：US20240321601A1

公开(公告)日：2024-09-26

申请号：US18611156

申请日：2024-03-20

Applicant: EBARA CORPORATION

Inventor： Fumitoshi OIKAWA ,  Koichi FUKAYA ,  Hiroki TAKAHASHI ,  Akira IMAMURA

IPC: H01L21/67 ,  B08B1/34 ,  B08B3/02 ,  B08B3/04 ,  H01L21/02

CPC classification number: H01L21/67051 ,  B08B1/34 ,  B08B3/022 ,  B08B3/041 ,  H01L21/02057 ,  H01L21/67034

Abstract: A cleaning apparatus includes: a rotation support section that supports and rotates a substrate; a chemical liquid supply section that supplies a chemical liquid other than an organic solvent to a surface of the substrate; an organic solvent supply section that supplies an organic solvent to a surface of the substrate; and cleaning means that cleans a surface of the substrate supported by the rotation support section using a chemical liquid from the chemical liquid supply section, and then cleans a surface of the substrate using an organic solvent from the organic solvent supply section with the substrate being kept supported by the rotation support section.

公开(公告)号：US20190115230A1

公开(公告)日：2019-04-18

申请号：US16088691

申请日：2017-10-23

Applicant: EBARA CORPORATION

Inventor： Naoki TOYOMURA ,  Akira IMAMURA

IPC: H01L21/67 ,  B08B9/027

CPC classification number: H01L21/67075 ,  B08B9/027 ,  G03F7/70725 ,  G03F7/70841 ,  H01L21/304 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/67057 ,  H01L21/67173 ,  H01L21/6719 ,  H01L21/67219 ,  H01L21/683

Abstract: A substrate processing apparatus including: a first valve provided between a gas supply source and an air-water separation tank, the first valve opening and closing a flow path of a gas supplied from the gas supply source; a second valve that opens and closes a flow path of liquid discharged from a discharge port of the air-water separation tank; and a control unit that controls the first valve and the second valve, wherein the discharge port of the air-water separation tank communicates with a discharge port of a cleaning chamber that cleans the substrate, and the control unit controls to close the first valve after preset gas supply time elapses from when the first valve is opened and gas can no longer be discharged from the air-water separation tank and controls to close the second valve after the first valve is closed.

公开(公告)号：US20150314416A1

公开(公告)日：2015-11-05

申请号：US14800896

申请日：2015-07-16

Applicant: EBARA CORPORATION

Inventor： Hiroyuki SHINOZAKI ,  Takahiro SHIMANO ,  Akira IMAMURA ,  Akira NAKAMURA

IPC: B24B49/02 ,  B24B53/017 ,  B24B49/18 ,  B24B37/005

CPC classification number: B24B37/005 ,  B24B37/042 ,  B24B49/02 ,  B24B49/04 ,  B24B49/18 ,  B24B49/186 ,  B24B53/005 ,  B24B53/017 ,  B24B53/08

Abstract: A method is capable of monitoring the polishing surface of the polishing pad without removing the polishing pad from the polishing table. The method includes: conditioning the polishing surface of the polishing pad by causing a rotating dresser to oscillate on the polishing surface; measuring a height of the polishing surface when the conditioning of the polishing surface is performed; calculating a position of a measuring point of the height on a two-dimensional surface defined on the polishing surface; and repeating the measuring of the height of the polishing surface and the calculating of the position of the measuring point to create height distribution in the polishing surface.

Abstract translation: 一种方法能够监测抛光垫的抛光表面，而无需从研磨台上移除抛光垫。 该方法包括：通过使旋转的修整器在抛光表面上振荡来调节抛光垫的抛光表面; 当执行抛光表面的调理时，测量抛光表面的高度; 计算在所述抛光表面上限定的二维表面上的所述高度的测量点的位置; 并且重复测量抛光表面的高度和计算测量点的位置以在抛光表面中产生高度分布。

公开(公告)号：US20190308223A1

公开(公告)日：2019-10-10

申请号：US16373004

申请日：2019-04-02

Applicant: Ebara Corporation

Inventor： Mitsuru MIYAZAKI ,  Akira IMAMURA ,  Takuya INOUE ,  Shozo TAKAHASHI

IPC: B08B3/04 ,  G05D16/20 ,  H01L21/67

Abstract: According to one embodiment, provided is a cleaning liquid supplying system including: a circulation line in which cleaning liquid flows, first end of the circulation line being connected to a supply port of a cleaning liquid supplying apparatus, second end of the circulation line being connected to a collection port of the cleaning liquid supplying apparatus; a branch pipe branched from the circulation line and connected to a substrate cleaning unit; a valve provided on the branch pipe and configured to control supply of cleaning liquid from the circulation line to the substrate cleaning unit; and a flow rate adjuster configured to adjust a flow rate of the cleaning liquid flowing in the circulation line.

公开(公告)号：US20170236730A1

公开(公告)日：2017-08-17

申请号：US15432471

申请日：2017-02-14

Applicant: EBARA CORPORATION

Inventor： Akira IMAMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA ,  Shunsuke MATSUZAWA

IPC: H01L21/67 ,  H01L21/687 ,  B08B3/02 ,  B08B1/04 ,  B08B3/08

CPC classification number: H01L21/67051 ,  H01L21/67046 ,  H01L21/67253 ,  H01L21/68728

Abstract: A substrate cleaning apparatus comprises: a cleaning member 11,21 that comes into contact with a substrate W and cleans the substrate W; a member rotating unit 15, 25 that rotates the cleaning member 11, 21; a pressing drive unit 19, 29 that presses the cleaning member 11, 21 against the substrate W; a torque detecting unit 16, 26 for detecting torque applied to the member rotating unit 15, 25; and a control unit 50 that controls pressing force on the basis of a result of detection by the torque detecting unit 16, 26.

公开(公告)号：US20140120725A1

公开(公告)日：2014-05-01

申请号：US14061673

申请日：2013-10-23

Applicant: EBARA CORPORATION

Inventor： Mitsuru MIYAZAKI ,  Kenichi KOBAYASHI ,  Teruaki HOMBO ,  Akira IMAMURA ,  Boyu DONG ,  Hiroyuki SHINOZAKI

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/306

CPC classification number: H01L21/30625 ,  B24B37/30 ,  B24B37/34 ,  B24B37/345 ,  H01L21/67051 ,  H01L21/67219

Abstract: A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.

Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板的表面以平坦化基板的表面。 抛光装置包括具有抛光表面的抛光台，以及顶环，其构造成保持基板的外周边缘由保持环包围并将基板压靠在抛光表面上。 顶环可在抛光台上方的抛光位置，抛光台侧面的位置和清洁位置之间移动。 抛光装置包括清洁单元，该清洁单元设置在清洁位置并且被配置为朝着正在旋转的顶环的下表面喷射清洁液体，由此清洁由顶环保持的基板与顶部的下表面 环。

公开(公告)号：US20220319874A1

公开(公告)日：2022-10-06

申请号：US17607999

申请日：2020-05-29

Applicant: EBARA CORPORATION

Inventor： Akira IMAMURA ,  Mitsuru MIYAZAKI ,  Junji KUNISAWA

IPC: H01L21/67

Abstract: The present invention relates to a damper control system and a damper control method for controlling an opening degree of an exhaust damper connected to an exhaust duct. The damper control system (300) includes an exhaust damper (310), a first pressure sensor (311), and a controller (315) configured to control an opening degree of the exhaust damper (310). The controller (315) is configured to switch the opening degree of the exhaust damper (310) to an opening degree smaller than a full opening on condition that a shutter (217) is opened.