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    Multi-carriage dual-spindle symmetrical grinding processing center
    1.
    发明授权
    Multi-carriage dual-spindle symmetrical grinding processing center 有权
    多轴双主轴对称研磨加工中心

    公开(公告)号：US09272385B2

    公开(公告)日：2016-03-01

    申请号：US13261937

    申请日：2013-06-09

    申请人： Xiangtan Sanfeng CNC Machine Tool Co., Ltd.

    发明人： Huaizhong Guo ,  Tianrun Guo

    IPC分类号： B24B25/00 ,  B24B49/12 ,  B24B53/00

    CPC分类号： B24B25/00 ,  B23Q3/15706 ,  B23Q3/1572 ,  B24B7/02 ,  B24B7/04 ,  B24B27/0076 ,  B24B27/0084 ,  B24B49/12 ,  B24B53/00 ,  B24B53/005 ,  B24B53/047 ,  B24B55/06

    摘要： A multi-carriage dual-spindle symmetrical grinding processing center, wherein: A work table with a rotary table therein is positioned on a first carriage which is attached to a front base; first and second upright posts are positioned in a gantry form on a back base; a horizontal grinding head is connected to a second carriage between the upright posts; a third left carriage and a third right carriage are slidingly connected to the first and second upright posts, respectively, and a left slider and a right slider are connected to the third left carriage and the third right carriage, respectively; a vertical grinding head is installed at the front end of the right slider; an automatic tool changing device is equipped with the vertical grinding head, and a grinding wheel profile dressing device can be installed on the second carriage and on the left slider.

    摘要翻译： 一种多托架双轴对称研磨加工中心，其特征在于，具有旋转台的工作台位于安装在前基座上的第一滑架上; 第一和第二直立柱以后台的台架形式定位; 水平磨头与立柱之间的第二台架连接; 第三左托架和第三右托架分别滑动地连接到第一和第二直立柱，左滑块和右滑块分别连接到第三左托架和第三右托架; 在右滑块的前端安装有立式磨头; 自动换刀装置配备有立式磨头，砂轮轮廓修整装置可以安装在第二滑架和左滑块上。

    METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, METHOD OF OBTAINING A SLIDING VECTOR DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, AND POLISHING APPARATUS
    2.
    发明申请
    METHOD OF OBTAINING A SLIDING DISTANCE DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, METHOD OF OBTAINING A SLIDING VECTOR DISTRIBUTION OF A DRESSER ON A POLISHING MEMBER, AND POLISHING APPARATUS 有权
    获取抛光构件上的刮水器的滑动距离分布的方法，获得抛光构件上的刮水器的滑动矢量分布的方法和抛光装置

    公开(公告)号：US20140342642A1

    公开(公告)日：2014-11-20

    申请号：US14184655

    申请日：2014-02-19

    申请人： EBARA CORPORATION

    发明人： Takahiro SHIMANO ,  Mutsumi TANIKAWA ,  Hisanori MATSUO ,  Kuniaki YAMAGUCHI ,  Katsuhide WATANABE

    IPC分类号： B24B53/00 ,  B24B53/017 ,  B24B53/02

    CPC分类号： B24B53/005 ,  B24B53/017 ,  B24B53/02

    摘要： The method includes: calculating an increment of a sliding distance of a dresser by multiplying a relative speed between the dresser and a polishing member by a contact time between them; correcting the increment of the sliding distance by multiplying the calculated increment of the sliding distance by at least one correction coefficient; calculating the sliding distance by repeatedly adding the corrected increment of the sliding distance to the sliding distance according to elapse of time; and producing the sliding-distance distribution of the dresser from the obtained sliding distance and a position of a sliding-distance calculation point. The at least one correction coefficient includes an unevenness correction coefficient provided for the sliding-distance calculation point. The unevenness correction coefficient is a correction coefficient that allows a profile of the polishing member to reflect a difference between an amount of scraped material of the polishing member in its raised portion and an amount of scraped material of the polishing member in its recess portion.

    摘要翻译： 该方法包括：通过将修整器和抛光构件之间的相对速度乘以它们之间的接触时间来计算修整器的滑动距离的增量; 通过将计算出的滑动距离的增加乘以至少一个校正系数来校正滑动距离的增量; 通过根据时间经过反复地将滑动距离的校正增量反复地添加到滑动距离来计算滑动距离; 并且从获得的滑动距离和滑动距离计算点的位置产生修整器的滑动距离分布。 所述至少一个校正系数包括为所述滑动距离计算点提供的不均匀性校正系数。 不均匀性校正系数是使研磨部件的轮廓反映研磨部件的凸起部分的刮削材料量与其凹部中研磨部件的刮削材料量之间的差异的校正系数。

    TRUING DEVICE OF GRINDING MACHINE
    3.
    发明申请
    TRUING DEVICE OF GRINDING MACHINE 有权
    研磨机研磨装置

    公开(公告)号：US20120329368A1

    公开(公告)日：2012-12-27

    申请号：US13492009

    申请日：2012-06-08

    申请人： Yoshio WAKAZONO ,  Tetsuro FURUHATA ,  Hisanobu KOBAYASHI

    发明人： Yoshio WAKAZONO ,  Tetsuro FURUHATA ,  Hisanobu KOBAYASHI

    IPC分类号： B24B49/00 ,  B24B53/00

    CPC分类号： B24B53/005 ,  B24B53/14

    摘要： A truing device of a grinding machine includes: a truer that corrects a shape of a grinding wheel; a swivel table that supports the truer such that the truer is swivelable about a swivel axis Ac; detecting means for directly detecting a distance from a truing edge position of the truer, which contacts the grinding wheel during correction of the shape of the grinding wheel, to a swivel center O of the swivel table; and control means for controlling the truing edge position of the truer with respect to the grinding wheel based on the distance L detected by the detecting means to true the grinding wheel.

    摘要翻译： 研磨机的修整装置包括：校正砂轮的形状的更真实性; 旋转台，其支撑修整器，使得修整器围绕旋转轴线Ac可旋转; 检测装置，用于直接检测在修整砂轮形状期间与砂轮接触的修整器的修整边缘位置到旋转台的旋转中心O的距离; 以及控制装置，用于基于由检测装置检测到的真实的砂轮来控制修整器相对于砂轮的修整边缘位置。

    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD
    5.
    发明申请
    APPARATUS AND METHODS FOR CONDITIONING A POLISHING PAD 审中-公开
    用于调节抛光垫的装置和方法

    公开(公告)号：US20070212983A1

    公开(公告)日：2007-09-13

    申请号：US11684969

    申请日：2007-03-12

    申请人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    发明人： Roy C. Nangoy ,  Shou-Sung Chang ,  Donald J.K. Olgado ,  Hung Chih Chen ,  Gerald John Alonzo

    IPC分类号： B24B51/00 ,  B24B1/00 ,  B24B21/18

    CPC分类号： B24B53/017 ,  B24B53/005 ,  B24B53/12

    摘要： Apparatus and methods for conditioning a polishing pad include a base, an arm pivotally coupled to the base and adapted to support a conditioning disk, and an actuator coupled to the base and the arm. The actuator is adapted to cause the arm to press the conditioning disk against the polishing pad with a linearly variable amount of force. A first force is produced with the actuator. The first force is scaled by a linearly variable amount to a second force that is applied to the polishing pad by a conditioning disk. Numerous other aspects are disclosed.

    摘要翻译： 用于调理抛光垫的装置和方法包括基座，枢转地联接到基座并适于支撑调节盘的臂以及联接到基座和臂的致动器。 致动器适于使臂以线性可变量的力将调节盘压靠抛光垫。 用致动器产生第一力。 第一力通过线性可变量被缩放到通过调节盘施加到抛光垫的第二力。 公开了许多其他方面。

    SUBSTRATE POLISHING APPARATUS
    6.
    发明申请
    SUBSTRATE POLISHING APPARATUS 审中-公开

    公开(公告)号：US20180093363A1

    公开(公告)日：2018-04-05

    申请号：US15714876

    申请日：2017-09-25

    申请人： EBARA CORPORATION

    发明人： Hiroyuki SHINOZAKI

    IPC分类号： B24B49/18 ,  B24B53/00 ,  B24B53/12

    CPC分类号： B24B49/186 ,  B24B53/005 ,  B24B53/12

    摘要： According to an aspect of the present disclosure, a substrate polishing apparatus including a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions is provided.