公开(公告)号：US09434044B2

公开(公告)日：2016-09-06

申请号：US14668866

申请日：2015-03-25

申请人： EBARA CORPORATION

发明人： Ryuichi Kosuge ,  Hiroshi Sotozaki ,  Takahiro Kawano ,  Akihiro Mochida

IPC分类号： B24B37/00 ,  B24B37/005

CPC分类号： B24B37/0053

摘要： A polishing apparatus which can reduce scratches that are generated on a surface of a substrate during polishing by detecting a foreign matter such as a fragment of the substrate on an inner circumferential surface of a retaining ring for holding an edge portion (peripheral portion) of the substrate is disclosed. The polishing apparatus includes a polishing table having a polishing surface, and a top ring having a substrate holding surface to hold a beck surface of a substrate and a retaining ring to retain the substrate on the substrate holding surface. The top ring holds the substrate and presses the substrate against the polishing surface. The polishing apparatus includes an imaging device configured to image an inner circumferential surface of the retaining ring, and an image processor configured to process an image obtained by the imaging device to judge whether there is a foreign matter on the inner circumferential surface of the retaining ring.

摘要翻译： 一种抛光装置，其能够通过在保持环的保持环的内周面上检测诸如基片的碎片等异物来保持边缘部（周边部），从而能够减少在研磨时在基板表面产生的划痕 底物被公开。 抛光装置包括具有抛光表面的抛光台和具有用于保持基板的表面的基板保持表面和保持环以将基板保持在基板保持表面上的顶环。 顶环保持基板并将基板压靠在抛光表面上。 抛光装置包括：成像装置，其被构造成对保持环的内周面进行成像;以及图像处理器，被配置为处理由成像装置获得的图像，以判断在保持环的内周面上是否存在异物 。

公开(公告)号：US09409277B2

公开(公告)日：2016-08-09

申请号：US14067723

申请日：2013-10-30

申请人： EBARA CORPORATION

发明人： Masao Umemoto ,  Tadakazu Sone ,  Hideo Aizawa ,  Ryuichi Kosuge ,  Masaaki Eriguchi

IPC分类号： B24B53/017 ,  B24B37/04

CPC分类号： B24B53/017 ,  B24B37/04

摘要： A polishing apparatus includes: a rotatable polishing table for supporting a polishing pad having a polishing surface; a top ring head having a top ring; a top ring head cover surrounding the top ring head; a dresser head having a dresser configured to dress the polishing surface; a dresser head cover surrounding the dresser head; a spray nozzle configured to spray a cleaning liquid onto an upper surface of the top ring and an outer surface of the top ring head cover when the top ring is in the substrate transfer position; and a spray nozzle configured to spray a cleaning liquid onto an outer surface of the dresser head cover when the dresser is in the retreated position.

摘要翻译： 抛光装置包括：可旋转抛光台，用于支撑具有抛光表面的抛光垫; 具有顶环的顶环头; 围绕顶环头部的顶环头盖; 修整器头部具有修整器，该修整器构造成用来装饰抛光表面; 围绕梳妆台头的梳妆台头罩; 喷嘴，其构造成当所述顶环处于所述基板转移位置时，将清洗液喷射到所述顶环的上表面和所述顶环头盖的外表面; 以及喷雾喷嘴，其构造成当所述修整器处于退避位置时将清洁液体喷射到所述修整器盖罩的外表面上。

公开(公告)号：US20150017889A1

公开(公告)日：2015-01-15

申请号：US14325830

申请日：2014-07-08

申请人： EBARA CORPORATION

发明人： Masao Umemoto ,  Ryuichi Kosuge ,  Hiroshi Shimomoto ,  Hideo Aizawa

IPC分类号： B24B37/34 ,  B24B37/32 ,  B24B55/00

CPC分类号： B24B37/34 ,  B08B1/002 ,  B24B37/32 ,  H01L21/67046

摘要： A polishing apparatus which can remove slurry which has entered into a gap between an elastic membrane for pressing a substrate such as a wafer and a retaining ring is disclosed. The polishing apparatus includes a top ring which has an elastic membrane configured to form a pressure chamber for pressing the substrate against a polishing pad, and a retaining ring disposed around the elastic membrane and configured to press the polishing pad, a top ring rotating device configured to rotate the top ring about an axis of the top ring, and a cleaning brush configured to be brought into contact with a peripheral portion of a lower surface and an outer circumferential surface of the elastic membrane.

摘要翻译： 公开了一种抛光装置，其可以去除进入用于挤压诸如晶片的基板的弹性膜和保持环之间的间隙中的浆料。 抛光装置包括：顶环，其具有弹性膜，其构造成形成用于将基板压靠在抛光垫上的压力室;以及保持环，其设置在弹性膜周围并构造成按压抛光垫;顶环旋转装置， 围绕顶环的轴线旋转顶环;以及清洁刷，其构造成与弹性膜的下表面和外周表面的周边部分接触。