Method for attaching a flex circuit to a printed circuit board
    21.
    发明授权
    Method for attaching a flex circuit to a printed circuit board 有权
    将柔性电路连接到印刷电路板的方法

    公开(公告)号:US09125331B2

    公开(公告)日:2015-09-01

    申请号:US13598362

    申请日:2012-08-29

    IPC分类号: H05K3/30 H05K3/32 H05K3/36

    摘要: Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译: 公开了使用各向异性导电膜(ACF)接合工艺将柔性电路结合到印刷电路板(PCB)的方法和系统。 根据本发明的一个方面,支撑件可以以电磁干扰(EMI)屏蔽壳体的方式附接,使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位,并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures
    22.
    发明申请
    Methods For Assembling Electronic Devices Using Embedded Light Guide Structures 有权
    使用嵌入式光导体结构组装电子设备的方法

    公开(公告)号:US20130215638A1

    公开(公告)日:2013-08-22

    申请号:US13401692

    申请日:2012-02-21

    IPC分类号: F21V8/00 B32B38/10 B32B37/12

    摘要: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    摘要翻译: 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时,可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分,刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    METHOD FOR ATTACHING A FLEX CIRCUIT TO A PRINTED CIRCUIT BOARD
    23.
    发明申请
    METHOD FOR ATTACHING A FLEX CIRCUIT TO A PRINTED CIRCUIT BOARD 审中-公开
    用于将柔性电路连接到印刷电路板的方法

    公开(公告)号:US20130042955A1

    公开(公告)日:2013-02-21

    申请号:US13598362

    申请日:2012-08-29

    IPC分类号: B32B37/12

    摘要: Methods and systems for bonding a flex circuit to a printed circuit board (PCB) using an anisotropic conductive film (ACF) bonding process are disclosed. According to one aspect of the present invention, supports may be attached to an electromagnetic interference (EMI) shielding can in such a way that the EMI shielding can is arranged to support and/or spread forces involved in ACF bonding. The supports may be located proximate to the walls of the EMI shielding can, and positioned such that the supports effectively do not come into contact with components mounted on a PCB along with the EMI shielding can.

    摘要翻译: 公开了使用各向异性导电膜(ACF)接合工艺将柔性电路结合到印刷电路板(PCB)的方法和系统。 根据本发明的一个方面,支撑件可以以电磁干扰(EMI)屏蔽壳体的方式附接,使得EMI屏蔽罩可以被布置成支撑和/或扩展涉及ACF键合的力。 支撑件可以靠近EMI屏蔽罩的壁定位,并且被定位成使得支撑件与EMI屏蔽罐一起有效地不与安装在PCB上的部件接触。

    ELECTROMAGNETIC INTERFERENCE SHIELDS WITH PIEZOS
    25.
    发明申请
    ELECTROMAGNETIC INTERFERENCE SHIELDS WITH PIEZOS 有权
    电磁干扰与PIEZOS相关

    公开(公告)号:US20120148081A1

    公开(公告)日:2012-06-14

    申请号:US13401729

    申请日:2012-02-21

    IPC分类号: H04R1/20 H04R1/02

    摘要: Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

    摘要翻译: 公开了用于提高与诸如压电扬声器的扬声器相关联的声学性能的方法和装置。 根据一个方面,一种装置包括基板,安装在基板上的壳体和压电扬声器装置。 压电扬声器装置至少部分地安装在罐上。 在一个实施例中,衬底是印刷电路板(PCB),并且罐是电磁干扰(EMI)屏蔽罐。

    Electronic devices with tubular flexible circuitry
    29.
    发明授权
    Electronic devices with tubular flexible circuitry 有权
    具有管状柔性电路的电子设备

    公开(公告)号:US08797748B2

    公开(公告)日:2014-08-05

    申请号:US13316348

    申请日:2011-12-09

    申请人: Teodor Dabov

    发明人: Teodor Dabov

    IPC分类号: H05K1/00

    摘要: An electronic device may be provided that has flexible circuitry such as spiral wrapped flexible circuitry. Flexible circuitry may be connected to one or more sides of an electronic component such as rigid printed circuit board or coupled between a rigid printed circuit board an another device component. Flexible circuitry may include an adhesive strip for maintaining a spiral wrap configuration of the flexible circuitry. An adhesive strip may be covered by a removable protective liner during manufacturing of an electronic device so that the flexible circuitry may be tested in a flat, unrolled configuration prior to installation in the electronic device. Flexible circuitry may include a conductive layer configured to form an electromagnetic shield for an electronic component mounted in the spiral wrap. Flexible circuitry may be wrapped around an elongated support member that is mounted along an edge of the electronic component.

    摘要翻译: 可以提供具有诸如螺旋缠绕的柔性电路的柔性电路的电子设备。 柔性电路可以连接到诸如刚性印刷电路板的电子部件的一个或多个侧面,或者连接在刚性印刷电路板与另一个器件部件之间。 柔性电路可以包括用于维持柔性电路的螺旋卷绕构型的胶带。 在制造电子设备期间,粘合剂条可以由可移除的保护性衬垫覆盖,使得柔性电路可以在安装到电子设备中之前以平坦的展开形式进行测试。 柔性电路可以包括被配置为形成用于安装在螺旋状卷体中的电子部件的电磁屏蔽的导电层。 柔性电路可以围绕沿着电子部件的边缘安装的细长支撑构件缠绕。

    WATER INHIBITING SLIDE SWITCH
    30.
    发明申请
    WATER INHIBITING SLIDE SWITCH 失效
    防水滑动开关

    公开(公告)号:US20120055767A1

    公开(公告)日:2012-03-08

    申请号:US12970759

    申请日:2010-12-16

    IPC分类号: H01H15/04 H01H3/00

    CPC分类号: H01H15/04

    摘要: Electromechanical switches are provided. The electromechanical switches can include conductive components that are configured to change position relative to one another in response to a mechanical input. The electromechanical switch can include a distribution mechanism for replenishing a moisture inhibiting layer, such as an oleophobic material, on surface portions of conductive components within the switch. During actuation of the electromechanical switch, the distribution mechanism can be configured to reapply the moisture inhibiting material to the surface portions of the conductive components to prevent damage resulting from moisture intrusion.

    摘要翻译: 提供机电开关。 机电开关可以包括被配置为响应于机械输入而相对于彼此改变位置的导电部件。 机电开关可以包括用于在开关内的导电部件的表面部分上补充诸如疏油材料的防潮层的分配机构。 在机电开关的致动期间,分配机构可以被配置为将防潮材料重新应用于导电部件的表面部分,以防止由湿气侵入引起的损坏。