摘要:
An electronic device may have a conductive housing with an antenna window. A display cover layer may be mounted on the front face of the device. Antenna and proximity sensor structures may include a dielectric support structure with a notch. The antenna window may have a protruding portion that extends into the notch between the display cover layer and the antenna and proximity sensor structures. The antenna and proximity sensor structures may have an antenna feed that is coupled to a first conductive layer by a high pass circuit and capacitive proximity sensor circuitry that is coupled to the first conductive layer and a parallel second conductive layer by a low pass circuit. The first conductive layer may be formed from a metal coating on the support structure. The second conductive layer may be formed from patterned metal traces in a flexible printed circuit.
摘要:
An electronic device may have a housing in which an antenna is mounted. An antenna window may be mounted in the housing to allow radio-frequency signals to be transmitted from the antenna and to allow the antenna to receive radio-frequency signals. Near-field radiation limits may be satisfied by reducing transmit power when an external object is detected in the vicinity of the dielectric antenna window and the antenna. A capacitive proximity sensor may be used in detecting external objects in the vicinity of the antenna. The proximity sensor and the antenna may be formed using integral antenna resonating element and proximity sensor capacitor electrode structures. These structures may be formed from identical first and second patterned conductive layers on opposing sides of a dielectric substrate. A transceiver and proximity sensor may be coupled to the structures through respective high-pass and low-pass circuits.
摘要:
Antennas are provided for electronic devices such as portable computers. Multiple resonating elements may be formed on a flexible antenna resonating element substrate. The flexible antenna resonating element substrate may have a first antenna resonating element at one end and a second antenna resonating element at an opposing end. The flexible antenna resonating substrate may be wrapped around a dielectric carrier and mounted within an electronic device under an inactive display region and above a dielectric housing window. Conductive structures such as conductive housing structures may form antenna ground. The resonating elements and antenna ground may form first and second antennas. A parasitic antenna resonating element may form part of the first antenna.
摘要:
A flex circuit may have test structures and antenna structures. The test structures may include test capacitors and transmission lines. The performance of the test structures may be measured using test equipment. Pass/fail criteria may be applied to the flex circuit based on the measured values. If the flex circuit is a failing circuit, flex circuit manufacturing settings may be adjusted. The performance of a radio-frequency (RF) cable may also be measured using the test equipment. Sample portions of the RF cable may be obtained and measured. Pass/fail criteria may be applied to the RF cable based on measured cable loss values. If the RF cable is a failing cable, RF cable manufacturing settings may be adjusted. Antenna structures associated with passing flex circuits and RF cable segments associated with passing sample RF cable segments may be incorporated into a wireless device during production device assembly.
摘要:
An electronic device may have a conductive housing with an antenna window. A display cover layer may be mounted on the front face of the device. Antenna and proximity sensor structures may include a dielectric support structure with a notch. The antenna window may have a protruding portion that extends into the notch between the display cover layer and the antenna and proximity sensor structures. The antenna and proximity sensor structures may have an antenna feed that is coupled to a first conductive layer by a high pass circuit and capacitive proximity sensor circuitry that is coupled to the first conductive layer and a parallel second conductive layer by a low pass circuit. The first conductive layer may be formed from a metal coating on the support structure. The second conductive layer may be formed from patterned metal traces in a flexible printed circuit.
摘要:
An electronic device may have a conductive housing with an antenna window. A display cover layer may be mounted on the front face of the device. Antenna and proximity sensor structures may include a dielectric support structure with a notch. The antenna window may have a protruding portion that extends into the notch between the display cover layer and the antenna and proximity sensor structures. The antenna and proximity sensor structures may have an antenna feed that is coupled to a first conductive layer by a high pass circuit and capacitive proximity sensor circuitry that is coupled to the first conductive layer and a parallel second conductive layer by a low pass circuit. The first conductive layer may be formed from a metal coating on the support structure. The second conductive layer may be formed from patterned metal traces in a flexible printed circuit.
摘要:
An electronic device may be provided with a speaker box antenna for transmitting and receiving radio-frequency signals. A speaker box antenna may be formed from a hollow dielectric speaker box containing a speaker driver. An opening in the speaker box adjacent to the speaker driver may be aligned with a speaker port opening in a conductive electronic device housing structure. The speaker box may be surrounded by conductive structures that form a cavity for the antenna. The conductive structures may include parts of the conductive electronic device housing structure. The speaker box may have opposing upper and lower surfaces. Metal plates may form parts of the upper and lower surfaces and may be shorted together using a conductive layer such as a strip of metal tape. Frequencies of operation may be selected for the antenna that suppress undesired cavity modes and enhance antenna performance.
摘要:
An electronic device may have a housing in which an antenna is mounted. An antenna window may be mounted in the housing to allow radio-frequency signals to be transmitted from the antenna and to allow the antenna to receive radio-frequency signals. Near-field radiation limits may be satisfied by reducing transmit power when an external object is detected in the vicinity of the dielectric antenna window and the antenna. A capacitive proximity sensor may be used in detecting external objects in the vicinity of the antenna. The proximity sensor may have conductive layers separated by a dielectric. A capacitance-to-digital converter may be coupled to the proximity sensor by inductors. The capacitive proximity sensor may be interposed between an antenna resonating element and the antenna window. The capacitive proximity sensor may serve as a parasitic antenna resonating element and may be coupled to the housing by a capacitor.
摘要:
Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. A parallel-fed loop antenna may be formed from portions of an electronic device bezel and a ground plane. The antenna may operate in multiple communications bands. An impedance matching circuit for the antenna may be formed from a parallel-connected inductive element and a series-connected capacitive element. The bezel may surround a peripheral portion of a display that is mounted to the front of an electronic device. The bezel may contain a gap. Antenna feed terminals for the antenna may be located on opposing sides of the gap. The inductive element may bridge the gap and the antenna feed terminals. The capacitive element may be connected in series between one of the antenna feed terminals and a conductor in a transmission line located between the transceiver circuitry and the antenna.
摘要:
Electronic devices are provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may include antennas such as inverted-F antennas that contain antenna resonating elements and antenna ground elements. Antenna resonating elements may be formed from patterned conductive traces on substrates such as flex circuit substrates. Antenna ground elements may be formed from conductive device structures such as metal housing walls. Support and biasing structures such as dielectric support members and layer of foam may be used to support and bias antenna resonating elements against planar device structures. The planar device structures against which the antenna resonating elements are biased may be planar dielectric members such as transparent layers of display cover glass or other planar structures. Adhesive may be interposed between the planar structures and the antenna resonating elements.