公开(公告)号：US20200061751A1

公开(公告)日：2020-02-27

申请号：US16546744

申请日：2019-08-21

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/382 ,  B23K26/046 ,  B23K26/12 ,  B23K26/142 ,  B23K26/14

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; and a tubular enclosure disposed between the nozzle and a workpiece and enclosing the jet, wherein the enclosure has a changeable radial inner dimension, and is configured to adjust the position of the maximum point by changing the inner dimension.

公开(公告)号：US20200061746A1

公开(公告)日：2020-02-27

申请号：US16541669

申请日：2019-08-15

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/14 ,  B23K26/12 ,  B23K26/142 ,  B23K26/382 ,  B23K26/046

Abstract: A laser processing system capable of reliably determining an abnormality in a jet during laser process. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure any of the velocity of the jet and a sound generated by the jet impinging on a workpiece; and an abnormality determination section configured to determine whether or not output data of the measuring instrument is different from reference data.

公开(公告)号：US20170291258A1

公开(公告)日：2017-10-12

申请号：US15478695

申请日：2017-04-04

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/06 ,  B23K26/70 ,  B23K26/0622

CPC classification number: B23K26/0626 ,  B23K26/032 ,  B23K26/0622 ,  B23K26/705

Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

公开(公告)号：US11554448B2

公开(公告)日：2023-01-17

申请号：US16412728

申请日：2019-05-15

Applicant: FANUC Corporation

Inventor： Takashi Izumi

IPC: B23K31/10 ,  B23K26/00 ,  B23K26/03 ,  B23K26/082 ,  G05B13/02 ,  B23K26/38 ,  B23K26/70 ,  B23K31/00 ,  B23K26/14

Abstract: Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.

公开(公告)号：US11179801B2

公开(公告)日：2021-11-23

申请号：US16539107

申请日：2019-08-13

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/02 ,  B23K26/03 ,  B23K26/12 ,  B23K26/14

Abstract: A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle having an emission opening that emits a jet of the assist gas along an optical axis of the laser beam, the nozzle forming a maximum point of velocity of the jet at a position away from the emission opening and is configured such that during processing of the workpiece by the laser beam, a nozzle is disposed with respect to a process portion of the workpiece W, at a target position determined based on a position of the maximum point.

公开(公告)号：US11007608B2

公开(公告)日：2021-05-18

申请号：US16191615

申请日：2018-11-15

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/02 ,  B23K26/70 ,  B23K26/06 ,  B23K26/60 ,  B23K26/067

Abstract: A laser machining device includes a reflective plate disposed perpendicular to the optical axis of emitting light and having a constant reflectance to the emitting light; a return light measurement unit which measures intensity distribution of return light reflected off the reflective plate and returning to the external optical system via a beam splitter; a storage unit which stores the return light intensity distribution in a normal state as reference data; a preprocessing unit which performs processing of identifying at least one of an optical axis shift, a beam diameter anomaly, a mode anomaly, a ghost, contamination of a protective window, and a focus shift due to thermal lens effect on the basis of comparison between measurement data of the return light intensity distribution and the reference data, before laser machining; and a warning unit which warns of an anomaly in the external optical system in accordance with the preprocessing unit.

公开(公告)号：US10946484B2

公开(公告)日：2021-03-16

申请号：US16104271

申请日：2018-08-17

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/70 ,  B23K26/06 ,  B23K26/046 ,  B23K26/066 ,  B23K26/064 ,  G01J1/42

Abstract: A laser machining method includes, before laser machining: calculating the amount of focus movement on the basis of a first measurement value measured with the external optical system warmed up and being the amount of energy of a laser beam passing through a small-diameter hole and a first reference value (database D1) predetermined depending on the type of contamination of the external optical system in relation to the first measurement value; and compensating the focus position in laser machining on the basis of the calculated amount of focus movement.

公开(公告)号：US20200301403A1

公开(公告)日：2020-09-24

申请号：US16815432

申请日：2020-03-11

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: G05B19/418 ,  G06N20/00 ,  G06N5/04 ,  G05B13/02 ,  B23K26/38 ,  B23K31/00

Abstract: A machine learning apparatus able to obtaining an optimal shift amount of an assist gas. The machine learning apparatus comprises a state-observation section configured to observe machining condition data included in a machining program given to the laser machine, and measurement data of a dimension of dross generated at a cutting spot of the workpiece when the machining program is executed, as a state variable representing a current state of an environment in which the workpiece is cut; and a learning section configured to learn the shift amount in association with cutting quality of the workpiece, using the state variable.

公开(公告)号：US20200061744A1

公开(公告)日：2020-02-27

申请号：US16540614

申请日：2019-08-14

Applicant: Fanuc Corporation

Inventor： Takashi Izumi

IPC: B23K26/142 ,  B23K26/03 ,  B23K26/08 ,  B23K26/14 ,  B23K26/354

Abstract: A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a supply flow rate of the assist gas to the nozzle; and a position acquisition section configured to acquire the position of the maximum point from a measurement value of the measuring instrument by predetermined calculation.

公开(公告)号：US10537964B2

公开(公告)日：2020-01-21

申请号：US15593704

申请日：2017-05-12

Applicant: FANUC CORPORATION

Inventor： Takashi Izumi

IPC: B23K26/03 ,  B23K26/60 ,  B23K26/70

Abstract: A laser machining method includes the steps of: outputting a laser beam to the workpiece at a laser power low enough not to melt or oxidize the workpiece to measure reflected light of the laser beam; selecting a laser power suitable for melting or oxidizing the workpiece based on a measured value of the reflected light; determining whether or not the workpiece can be melted or oxidized based on the selected laser power; when the workpiece can be melted or oxidized, outputting a laser beam to the workpiece at a laser power high enough to melt or oxidize the workpiece; outputting again a laser beam to the workpiece at the low laser power to measure reflected light of the laser beam; and checking the degree of the melting or oxidization of the workpiece based on a measured value of the reflected light to determine whether or not to start laser machining.