Abstract:
An imager tile including four-side buttable sub-imager pixel arrays with on-chip digitizing electronic readout circuit. Pixel groupings formed from among the plurality of imagers. Readout electronics including a buffer amplifier for each of the pixel groupings are connected to respective outputs of buttable imagers. Shared analog front ends connect to respective buffer amplifiers of pixel groupings. An analog-to-digital converter at a common centroid location relative to the shared analog front ends includes three data lines—selection input/output line to individually select an output, a clock input line, and a shared digital output line. A pixel output from a respective buffer amplifier is addressable by data provided on the selection input/output line, and the pixel output is provided on the shared digital output line. The I/O lines connected to a programmable logic device where the imager serial data input is output as a massively parallel data stream.
Abstract:
A collimator grid and a method of fabricating the collimator grid are disclosed. The method includes molding a plurality of plates, each plate includes a plurality of grooves in a first surface, a plurality of fin tips in a second surface disposed opposite to the first surface, plurality of ribs on a first pair of peripheral sides, a plurality of first fiducials formed on the plurality of ribs, and a plurality of second fiducials formed on a second pair of peripheral sides. The method includes machining the second surface to form the plurality of fins having predefined dimensions. Further, the method includes stacking the plurality of plates overlapping each other based on the plurality of first fiducials, and machining the plurality of ribs and first fiducials to form the collimator grid.
Abstract:
A detector is described having readout electronics integrated in the photodetector layer. The detector may be configured to acquire both energy-integrated and photon-counting data. In one implementation, the detector is also configured with control logic to select between the jointly generated photon-counting and energy-integrated data.
Abstract:
An x-ray detector comprises: a housing, including a cover removably fastened on a flange of a flanged base and forming a semi-hermetic seal therebetween, the flanged base including a bottom surface and the flange surrounding a perimeter of the bottom surface; and an x-ray imager positioned on the bottom surface, the x-ray imager including a scintillator and an image sensor, wherein the seal semi-hermetically encloses the x-ray imager in the housing, and is positioned nonadjacently to surfaces in contact with the x-ray imager. In this way, a simpler and less costly seal for a digital x-ray panel can be provide; furthermore, the seal is reusable and resealable, facilitating repair and refurbishment of the device.
Abstract:
A detector assembly includes scintillators configured to generate a light signal in response to an impinging backscatter signal, where the scintillators are arranged in a first pattern, a plurality of first detectors, where each first detector is coupled to a scintillator and configured to receive a first portion of a light signal from that scintillator, and where the first detectors are arranged in a second pattern aligned with the first pattern, a plurality of second detectors, where each second detector is disposed adjacent a scintillator and configured to receive a second portion of the light signal from that scintillator, and where the plurality of second detectors is arranged in a third pattern, and a scintillator collimator including a plurality of openings and configured to selectively receive the backscatter signal, where the detector assembly is configured to provide depth resolution, azimuthal resolution, a defect type, a defect size, or combinations thereof.
Abstract:
An imager including sub-imager pixel arrays having a plurality of four-side buttable imagers distributed on a substrate and an on-chip digitizing readout circuit. Pixel groupings formed from among the plurality of four-side buttable imagers. The readout electronics including a buffer amplifier for each of the pixel groupings and connected to respective outputs of each four-side buttable imager of the pixel grouping. A plurality of shared analog front ends, each shared analog front end connected to respective multiple buffer amplifiers from among the plurality of pixel groupings. An analog-to-digital converter located at a common centroid location relative to the plurality of shared analog front ends, the analog-to-digital converter having a fully addressable input selection to individually select an output from each of the plurality of shared analog front ends. An output of the analog-to-digital converter connected to a trace on a back surface of the wafer substrate by a through-substrate-via.
Abstract:
A digital X-ray detector is provided. The digital X-ray detector includes multiple pixels, each pixel including a pinned photodiode, and multiple readout channels coupled to each pinned photodiode, wherein each readout channel includes at least one charge-storage capacitor, an amplifier, and a transfer gate. The digital X-ray detector also includes control circuitry coupled to each pixel of the multiple pixels and configured to selectively control a flow of photocharge generated by each pinned photodiode to a respective at least one charge-storage capacitor of each respective readout channel via control of each respective transfer gate of each respective readout channel.
Abstract:
A collimator grid and a method of fabricating the collimator grid are disclosed. The method includes molding a plurality of plates, each plate includes a plurality of grooves in a first surface, a plurality of fin tips in a second surface disposed opposite to the first surface, plurality of ribs on a first pair of peripheral sides, a plurality of first fiducials formed on the plurality of ribs, and a plurality of second fiducials formed on a second pair of peripheral sides. The method includes machining the second surface to form the plurality of fins having predefined dimensions. Further, the method includes stacking the plurality of plates overlapping each other based on the plurality of first fiducials, and machining the plurality of ribs and first fiducials to form the collimator grid.
Abstract:
The present approach relates to the use of detector elements (i.e., reference detector pixels) positioned under septa of an anti-scatter collimator. Signals detected by the reference detector pixels may be used to correct for charging-sharing events with adjacent pixels and/or to characterize or correct for focal spot misalignment either in real time or as a calibration step.
Abstract:
A method for imaging an object to be reconstructed includes acquiring projection data corresponding to the object. Furthermore, the method includes generating a measured sinogram based on the acquired projection data and formulating a forward model, where the forward model is representative of a characteristic of the imaging system. In addition, the method includes generating an estimated sinogram based on an estimated image of the object and the forward model and formulating a statistical model based on at least one of pile-up characteristics and dead time characteristics of a detector of the imaging system. Moreover, the method includes determining an update corresponding to the estimated image based on the statistical model, the measured sinogram, and the estimated sinogram and updating the estimated image based on the determined update to generate an updated image of the object. Additionally, the method includes outputting a final image of the object.