公开(公告)号：US09337144B2

公开(公告)日：2016-05-10

申请号：US14876011

申请日：2015-10-06

Applicant: International Business Machines Corporation ,  GLOBALFOUNDRIES Inc. ,  Samsung Electronics Co., Ltd.

Inventor： O Sung Kwon ,  Dan Moy ,  Kihwang Son ,  Xiaoqiang Zhang

IPC: H01L23/525 ,  H01L23/532 ,  H01L21/321 ,  H01L23/367 ,  H01L23/522 ,  H01L23/528 ,  G01R31/28 ,  H01L21/66

CPC classification number: H01L23/5256 ,  G01R31/2858 ,  H01L21/321 ,  H01L22/12 ,  H01L22/34 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53214 ,  H01L23/53228 ,  H01L23/53257 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The present disclosure generally provides for an e-fuse structure and corresponding method for fusing the same and monitoring material leakage. The e-fuse structure can include a metal dummy structure and an electrical fuse link substantially aligned with a portion of the metal dummy structure, wherein the metal dummy structure cools at least part of the electrical fuse link in response to an electric current passing through the electrical fuse link.

公开(公告)号：US20150001635A1

公开(公告)日：2015-01-01

申请号：US13928060

申请日：2013-06-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： O Sung Kwon ,  Xiaoqiang Zhang ,  Anurag Mittal

IPC: H01L21/768 ,  H01L27/06 ,  H01L23/525

CPC classification number: H01L27/0629 ,  H01L21/76889 ,  H01L23/5225 ,  H01L23/5256 ,  H01L23/53261 ,  H01L27/101 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An integrated circuit product is disclosed that includes a resistor body and an e-fuse body positioned on a contact level dielectric material, wherein the resistor body and the e-fuse body are made of the same conductive material, a first plurality of conductive contact structures are coupled to the resistor body, conductive anode and cathode structures are conductively coupled to the e-fuse body, wherein the first plurality of conductive contact structures and the conductive anode and cathode structures are made of the same materials.