公开(公告)号：US20230152501A1

公开(公告)日：2023-05-18

申请号：US17525327

申请日：2021-11-12

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Yusheng Bian ,  Vibhor JAIN

IPC: G02B5/18 ,  G01N27/04

CPC classification number: G02B5/1861 ,  G01N27/041

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a photonic chip security structure and methods of manufacture. The structure includes an optical component over a substrate material, and at least one vertical wall including a reflecting material within a dielectric stack of material and surrounding the optical component.

公开(公告)号：US20220406732A1

公开(公告)日：2022-12-22

申请号：US17352414

申请日：2021-06-21

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Frank G. Kuechenmeister ,  Richard F. Taylor, III ,  Saquib B. Halim

IPC: H01L23/00 ,  H01L23/58 ,  H01L23/66 ,  H03H1/00 ,  G06F30/392

Abstract: Disclosed is a radio frequency integrated circuit (RFIC) chip that includes an integrated circuit (IC) area and a crackstop laterally surrounding the IC area. The crackstop includes a metallic barrier (or, alternatively, concentric metallic barriers) electrically isolated from the IC area. One or more noise suppressors and, particularly, one or more passive filters (e.g., low pass filter(s), high pass filter(s), band pass filter(s), and/or band stop filter(s)) are integrated into the structure of the metallic barrier(s) to inhibit propagation, through the crackstop, of noise signals within a specific RF range. The specific RF range can be a customer-specified operating parameter. By embedding customized noise suppressor(s) into the crackstop, local signal interference unique to the customer-specified operating parameters can be minimized while also avoiding or at least minimizing the risk of moisture ingress to the IC area. Also disclosed is a method of forming the chip.

公开(公告)号：US20220291464A1

公开(公告)日：2022-09-15

申请号：US17196428

申请日：2021-03-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Jae Kyu Cho ,  Frank Kuechenmeister ,  John J. Ellis-Monaghan ,  Michal Rakowski

IPC: G02B6/42 ,  G02B6/13 ,  F21V8/00 ,  G02B6/122

Abstract: Structures including an edge coupler and a crackstop, as well as methods of forming a structure including an edge coupler and a crackstop. A waveguide core and a crackstop are located over a top surface of a dielectric layer. A communication passageway is either optically coupled or electrically coupled to the waveguide core. The communication passageway, which may include an electric conductor or a buried waveguide core, extends laterally beneath the crackstop.