公开(公告)号：US10675911B2

公开(公告)日：2020-06-09

申请号：US15895404

申请日：2018-02-13

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ming Liu ,  JinLong Zhu ,  Jianfeng Wang

IPC: B60B3/14 ,  B60B7/06

Abstract: An isolator for a wheel hub between a brake rotor and a wheel is described, and includes a disk-shaped annular device including an inner ring, an outer ring, a first face portion, a second face portion, a plurality of apertures, a plurality of drain surface portions, and a plurality of radially-oriented drain channels disposed on the first face portion. Each drain channel is recessed in the first face portion. Each drain surface portion is recessed in the first face portion and is fluidly coupled to one of the drain channels. Each of the drain surface portions includes a continuous surface that is recessed from the first face portion between a drainage curve, a respective drain channel, and an arc that is defined on the inner ring between a first point and the respective drain channel.

公开(公告)号：US20190248176A1

公开(公告)日：2019-08-15

申请号：US15895404

申请日：2018-02-13

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ming Liu ,  JinLong Zhu ,  Jianfeng Wang

IPC: B60B7/06

Abstract: An isolator for a wheel hub between a brake rotor and a wheel rim is described, and includes a disk-shaped annular device including an inner ring, an outer ring, a first face portion, a second face portion, a plurality of apertures, a plurality of drain surface portions, and a plurality of radially-oriented drain channels disposed on the first face portion. Each drain channel is recessed in the first face portion. Each drain surface portion is recessed in the first face portion and is fluidly coupled to one of the drain channels. Each of the drain surface portions includes a continuous surface that is recessed from the first face portion between a drainage curve, a respective drain channel, and an arc that is defined on the inner ring between a first point and the respective drain channel.

公开(公告)号：US12213291B2

公开(公告)日：2025-01-28

申请号：US17886891

申请日：2022-08-12

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Anthony Michael Coppola ,  Erik Brandon Golm ,  Alireza Fatemi ,  Ming Liu ,  Seongchan Pack ,  Muhammad Hussain Alvi ,  Ronald O. Grover, Jr.

IPC: H05K7/20 ,  B60L15/00 ,  H02M7/00

Abstract: A power control system for an electric vehicle includes a power inverter comprising a switch module including a plurality of power switches, a controller board, and a gate driver board in communication with the controller board and configured to drive gates of the plurality of switches. A first housing is made of polymer composite, encloses the power inverter, defines a first cooling cavity in thermal communication with a first surface of the switch module, and encapsulates a portion of at least one of the switch module, the controller board and the gate driver board.

公开(公告)号：US12132010B2

公开(公告)日：2024-10-29

申请号：US17225508

申请日：2021-04-08

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Anthony M. Coppola ,  Seongchan Pack ,  Ming Liu

IPC: H01L23/00 ,  B60K1/04 ,  H01L21/56 ,  H01L23/473 ,  H01L23/552 ,  H02M7/00

CPC classification number: H01L23/564 ,  B60K1/04 ,  H01L23/473 ,  H01L23/552 ,  H02M7/003

Abstract: Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.

公开(公告)号：US20220328427A1

公开(公告)日：2022-10-13

申请号：US17225508

申请日：2021-04-08

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Anthony M. Coppola ,  Seongchan Pack ,  Ming Liu

IPC: H01L23/00 ,  B60K1/04 ,  H01L23/552 ,  H01L23/473 ,  H02M7/00 ,  H01L21/56

Abstract: Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.

公开(公告)号：US11207982B2

公开(公告)日：2021-12-28

申请号：US16710772

申请日：2019-12-11

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ming Liu ,  Anthony M. Coppola ,  Kestutis A. Sonta

IPC: B60L15/20 ,  B60L1/02 ,  B60L50/64 ,  B60L53/22 ,  H01M10/6556 ,  H01M10/6552 ,  H01M10/613 ,  H01M10/625 ,  B60L53/12

Abstract: Presented are electronic power module assemblies with direct-cooling heat pipe systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A sidewall of the module's housing defines therethrough multiple coolant windows that fluidly connect to the coolant chamber. A power semiconductor switching device is mounted to the module housing, fluidly sealed to a first coolant window with the power device's inboard surface exposed to the coolant fluid. The power device is operable to modify electric current transmitted between a power source and an electrical load. A heat pipe with an outer casing has a first casing segment thereof mounted to an outboard surface of the power device, and a second casing segment fluidly sealed to a second coolant window and exposed to the coolant fluid.

公开(公告)号：US20210178902A1

公开(公告)日：2021-06-17

申请号：US16710772

申请日：2019-12-11

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Ming Liu ,  Anthony M. Coppola ,  Kestutis A. Sonta

IPC: B60L1/02 ,  B60L50/64 ,  B60L15/20 ,  B60L53/22 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6552 ,  H01M10/613

Abstract: Presented are electronic power module assemblies with direct-cooling heat pipe systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A sidewall of the module's housing defines therethrough multiple coolant windows that fluidly connect to the coolant chamber. A power semiconductor switching device is mounted to the module housing, fluidly sealed to a first coolant window with the power device's inboard surface exposed to the coolant fluid. The power device is operable to modify electric current transmitted between a power source and an electrical load. A heat pipe with an outer casing has a first casing segment thereof mounted to an outboard surface of the power device, and a second casing segment fluidly sealed to a second coolant window and exposed to the coolant fluid.

公开(公告)号：US20190062926A1

公开(公告)日：2019-02-28

申请号：US15690329

申请日：2017-08-30

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Mahmoud Abd Elhamid ,  Yang Guo ,  Ming Liu ,  Anil K. Sachdev

IPC: C23F13/02

Abstract: A method is provided for reducing the corrosion rate of surfaces of formed magnesium or magnesium alloy articles in which the formed surface contains small embedded particles of iron. By exposing the iron particle-containing formed surface to an acidic, aqueous solution comprising alkali metal fluoride ions at a temperature of between 20° C. and 30° C., an adherent passivating layer of MgF2 is formed. Further, such exposure to the acidified, aqueous, fluoride ion-containing solution reduces or eliminates the concentration of cathodic, corrosion-promoting, iron-containing particles on the article surface as the magnesium fluoride layer is being formed. The development of the passivating layer reduces corrosion in a water-containing environment, and even if the passivating MgF2 layer is breached, the reduction in surface iron-containing particles reduces the inherent corrosion rate of the article.