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公开(公告)号：US12132010B2
公开(公告)日：2024-10-29
申请号：US17225508
申请日：2021-04-08
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Anthony M. Coppola , Seongchan Pack , Ming Liu
IPC: H01L23/00 , B60K1/04 , H01L21/56 , H01L23/473 , H01L23/552 , H02M7/00
CPC classification number: H01L23/564 , B60K1/04 , H01L23/473 , H01L23/552 , H02M7/003
Abstract: Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.
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公开(公告)号：US20240290998A1
公开(公告)日：2024-08-29
申请号：US18173899
申请日：2023-02-24
Applicant: GM Global Technology Operations LLC
Inventor： Seongchan Pack , Kanako Okada , Nikhil Chincholkar
IPC: H01M8/04089 , H01M8/0258
CPC classification number: H01M8/04089 , H01M8/0258 , H01M2250/20
Abstract: A valve for a hydrogen fuel cell module, a hydrogen fuel cell module including a valve, and a method of applying a surface coating on a valve. The valve includes a valve body defining an interior including a base material. The base material has a first surface. The valve also includes a surface coating disposed on the base material. The surface coating includes a surface layer having a second surface opposing the first surface. The surface layer contacts the first surface, and the surface layer comprises a first polymer. The surface coating also includes a dielectric layer contacting the second surface. In a hydrogen fuel cell module, the valve is connected to an exhaust flow path downstream of at least one of an anode or a cathode of a hydrogen fuel cell stack.
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Patent Agency Ranking
公开(公告)号：US11770919B1
公开(公告)日：2023-09-26
申请号：US17862732
申请日：2022-07-12
Applicant: GM Global Technology Operations LLC
Inventor： Seongchan Pack , Anthony Michael Coppola , James R. Salvador
IPC: H05K9/00
CPC classification number: H05K9/0081
Abstract: An electromagnetic interference shielding composite. The electromagnetic interference shielding composite includes a polymer substrate formed into a shape of a packaging component. The composite further includes an electromagnetic interference layer contacting the polymer substrate and a conductive coating contacting the electromagnetic interference layer. An integrated power electronic module includes packaging including the electromagnetic interference shielding composite. A method of forming the electromagnetic interference shielding composite for an integrated power electronic module includes molding a polymer substrate into a shape of a packaging component, forming an electromagnetic interference layer on the polymer substrate, and forming a conductive coating on the electromagnetic interference layer.
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24.发明授权公开(公告)号：US11654663B2
公开(公告)日：2023-05-23
申请号：US17340251
申请日：2021-06-07
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Seongchan Pack , Venkateshwar R. Aitharaju
CPC classification number: B32B27/18 , B32B7/10 , B32B15/08 , B32B27/08 , B32B37/06 , B32B37/144 , B32B2250/03 , B32B2255/06 , B32B2255/205 , B32B2307/3065
Abstract: A polymer-metal sandwich structure includes a first layer made of a polymer and having a first bonding surface, a second layer made of a metal and having a second bonding surface, and a third layer sandwiched between and in contact with the first and second bonding surfaces. The first layer contains or is capable of liberating anions of a first ion type at the first bonding surface, the second layer contains or is capable of liberating cations of a second ion type at the second bonding surface, and the third layer is made of a flame retardant formed of anions of the first ion type and cations of the second ion type. A method of manufacturing the polymer-metal sandwich structure is also provided.
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公开(公告)号：US20220328427A1
公开(公告)日：2022-10-13
申请号：US17225508
申请日：2021-04-08
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Anthony M. Coppola , Seongchan Pack , Ming Liu
IPC: H01L23/00 , B60K1/04 , H01L23/552 , H01L23/473 , H02M7/00 , H01L21/56
Abstract: Presented are metal-coated, polymer-encapsulated power semiconductor modules, methods for making/using such power modules, and vehicles with traction power inverters containing such power modules. A power electronics assembly includes one or more power semiconductor modules packaged inside an assembly housing. Each power module includes a substrate, a semiconductor device mounted on the substrate, a polymeric encapsulant encasing therein the substrate and semiconductor device, and an electrical lead connected to the semiconductor device and projecting from the polymeric encapsulant. A metallic or ceramic coating is applied to select sections of the polymeric encapsulant's exposed exterior surface. The metallic/ceramic coating may be a single metallic layer that covers substantially all of the exposed surface area of the polymeric encapsulant's exterior surface. An optional hydrophobic polymer layer, passivated layer, and/or oxidized layer may cover the exterior surface of this metallic layer. Alternatively, another metallic layer or intercalated lamellar microstructures may cover the metallic layer.
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公开(公告)号：US11220977B2
公开(公告)日：2022-01-11
申请号：US16539517
申请日：2019-08-13
Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
Inventor： Anthony M. Coppola , Peter P. Andruskiewicz, IV , Bradley A. Newcomb , Su Jung Han , Seongchan Pack
Abstract: A linerless engine block includes a polymer matrix composite having an internal surface that defines a bore. The polymer matrix composite has a first thermal conductivity at the internal surface of at least 5 W/m·° C. The linerless engine block also includes a first bond coating disposed on the internal surface within the bore, and a second wear-resistant coating disposed on the first bond coating within the bore such that the second wear-resistant coating is adhered to the polymer matrix composite by the first bond coating. A method of forming the linerless engine block is also described.
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27.发明申请公开(公告)号：US20200083778A1
公开(公告)日：2020-03-12
申请号：US16124906
申请日：2018-09-07
Applicant: GM Global Technology Operations LLC
Inventor： Seongchan Pack , Su Jung Han , Martin S. Kramer , Song He
Abstract: An integrated power electronics component configured for mitigating noise, vibration, and harshness includes a case formed from metal and configured to dampen a sound wave having a first frequency and a first amplitude and propagatable in a first direction. The case has a first surface and a second surface spaced apart from the first surface, a first stiffness, and a first strength, and the first and second surfaces include a structure defining a plurality of recessions therein. The component includes a cured polymer formed from a composition disposed on at least one of the first and second surfaces in each of the recessions to thereby dampen the sound wave in the first direction and in a second direction that is perpendicular to the first direction to a second frequency that is less than the first frequency and a second amplitude that is less than the first amplitude.
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