Method of riveting involving ultrasonic pulses

    公开(公告)号:US10189075B2

    公开(公告)日:2019-01-29

    申请号:US15413524

    申请日:2017-01-24

    Abstract: A method of riveting a first substrate and a second substrate with a rivet includes delivering a first ultrasonic pulse to a respective exterior surface of the first substrate at a predefined target area, via an ultrasonic device. The first ultrasonic pulse is configured to soften the first substrate at a first softening temperature. The method includes attaching a crust layer on a rivet head of the rivet. A second ultrasonic pulse is delivered to the predefined target area to soften the crust layer at a second softening temperature, via the ultrasonic device. A surface profile of the crust layer is fashioned via compression of a horn inner cavity of the ultrasonic device over the crust layer. The crust layer is cooled to harden into a seal configured to prevent entry of moisture between the rivet and the respective exterior surface of the first substrate, thereby reducing galvanic corrosion.

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