公开(公告)号：US20140168850A1

公开(公告)日：2014-06-19

申请号：US14187297

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Robert S. Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Keith W. Seitz ,  Thomas Marzano ,  John E. Roberts ,  William C. Thiebolt ,  Christopher M. Williams ,  Buehl E. Truex

IPC: H01G4/35

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。

公开(公告)号：US20140161973A1

公开(公告)日：2014-06-12

申请号：US14182569

申请日：2014-02-18

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H01R43/00

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US08653384B2

公开(公告)日：2014-02-18

申请号：US13743254

申请日：2013-01-16

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Ricahrd L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H02G3/18 ,  A61N1/05

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基片从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US11075388B1

公开(公告)日：2021-07-27

申请号：US16185187

申请日：2018-11-09

Applicant: Greatbatch Ltd.

Inventor： Mark J. Roy ,  Joseph M. Lehnes ,  Marcus J. Palazzo ,  Robert S. Rubino ,  William C. Thiebolt ,  Ho-Chul Yun

IPC: H01M4/74

Abstract: A current collector for an electrochemical cell is described. Unlike conventional current collector designs, the current collector does not have an unperforated perimeter frame completely bordering or surrounding a perforated interior region. Instead, only that portion of the current collector adjacent to the connector tab is unperforated. Otherwise, perforations extend directly to the perimeter edge.

公开(公告)号：US10881867B2

公开(公告)日：2021-01-05

申请号：US16708881

申请日：2019-12-10

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: A61N1/37 ,  A61N1/375 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

Abstract: A method for making a dielectric substrate configured for incorporation into a hermetically sealed feedthrough is described. The method includes forming a via hole through a green-state dielectric substrate. A platinum-containing paste is filled into at least 90% of the volume of the via hole. The green-state dielectric substrate is then subjected to a heating protocol including: a binder bake-out heating portion performed at a temperature ranging from about 400° C. to about 700° C. for a minimum of 4 hours; a sintering heating portion performed at a temperature ranging from about 1,400° C. to about 1,900° C. for up to 6 hours; and a cool down portion at a rate of up to 5°/minute from a maximum sintering temperature down to about 1,000° C., then naturally to room temperature. The thusly manufacture dielectric substrate is then positioned in an opening in a ferrule that is configured to be attached to a metal housing of an active implantable medical device. The dielectric substrate is hermetically sealed to the ferrule with the sintered platinum material in the via hole providing a conductive pathway from a body fluid side to a device side of the ferrule.

公开(公告)号：USRE47624E1

公开(公告)日：2019-10-01

申请号：US15016368

申请日：2016-02-05

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominck J. Frustaci ,  Steven W. Winn

IPC: H02G3/18 ,  A61N1/05 ,  A61N1/375 ,  H01G4/30 ,  H01G4/35 ,  C22C29/12 ,  H01G2/10 ,  H01G4/40 ,  H01G4/12 ,  H01R43/00 ,  H02G3/22 ,  A61N1/08 ,  H01G4/005 ,  B23K35/30 ,  A61N1/372

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

公开(公告)号：US09889306B2

公开(公告)日：2018-02-13

申请号：US14797123

申请日：2015-07-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: B01J20/34 ,  A61N1/375 ,  A61N1/05 ,  H01G2/10 ,  H01G4/35 ,  H01R43/00 ,  A61N1/372 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/372 ,  A61N1/375 ,  B22F2998/10 ,  C22C29/12 ,  H01G2/103 ,  H01G4/35 ,  H01R43/00 ,  Y10T156/1052 ,  B22F1/0059 ,  B22F3/10

Abstract: A hermetically sealed feedthrough for attachment to an active implantable medical device includes a dielectric substrate configured to be hermetically sealed to a ferrule or an AIMD housing. A via hole is disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via hole forming a filled via electrically conductive between the body fluid side and the device side. A conductive insert is at least partially disposed within the conductive fill. Then, the conductive fill and the conductive insert are co-fired with the dielectric substrate to form a hermetically sealed and electrically conductive pathway through the dielectric substrate between the body fluid side and the device side.

公开(公告)号：US20170104207A1

公开(公告)日：2017-04-13

申请号：US15290595

申请日：2016-10-11

Applicant: Greatbatch Ltd.

Inventor： Robert S. Rubino ,  William C. Thiebolt ,  Marcus J. Palazzo ,  Joseph M. Lehnes ,  Ho-Chul Yun ,  Mark J. Roy

IPC: H01M4/131 ,  H01M4/485 ,  H01M4/62 ,  H01M4/66 ,  H01M4/133 ,  H01M10/0569 ,  H01M4/583 ,  H01M4/587 ,  H01M4/38 ,  H01M2/16 ,  H01M10/0568 ,  H01M10/0525 ,  H01M4/134

CPC classification number: H01M4/0404 ,  H01M4/131 ,  H01M4/133 ,  H01M4/136 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1397 ,  H01M4/366 ,  H01M4/623 ,  H01M4/624 ,  H01M4/661 ,  H01M10/052 ,  H01M10/0568 ,  H01M10/0569 ,  H01M2220/30

Abstract: A lithium electrochemical cell with increased energy density is described. The electrochemical cell comprises an improved sandwich cathode design with a second cathode active material of a relatively high energy density but of a relatively low rate capability sandwiched between two current collectors and with a first cathode active material having a relatively low energy density but of a relatively high rate capability in contact with the opposite sides of the two current collectors. In addition, a cathode fabrication process is described that increases manufacturing efficiency. The cathode fabrication process comprises a process in which first and second cathode active materials are directly applied to opposite surfaces of a perforated current collector and laminated together. The present cathode design is useful for powering an implantable medical device requiring a high rate discharge application.

公开(公告)号：US20160336115A1

公开(公告)日：2016-11-17

申请号：US15220345

申请日：2016-07-26

Applicant: Greatbatch Ltd.

Inventor： Donald F. Kaiser ,  William C. Thiebolt ,  Jason T. Hahl

IPC: H01G9/00 ,  H01G9/145 ,  H01G9/042 ,  B02C19/18

CPC classification number: H01G9/0029 ,  B02C19/186 ,  H01G9/042 ,  H01G9/052 ,  H01G9/0525 ,  H01G9/06 ,  H01G9/08 ,  H01G9/145

Abstract: An electrolytic capacitor comprising an anode comprised of cryogenically milled anode material is described. The cryogenic milling process prepares the active anode material for anode fabrication. The capacitor further comprises a casing of first and second casing members secured to each other to provide an enclosure. A feedthrough electrically insulated from the casing and from the casing and extending there from through a glass-to-metal seal, at least one anode electrically connected within the casing, a cathode, and an electrolyte. The cathode is of a cathode active material deposited on planar faces of the first and second casing members.

Abstract translation: 描述包括由低温法研磨的阳极材料构成的阳极的电解电容器。 低温研磨工艺制备用于阳极制造的活性阳极材料。 电容器还包括彼此固定以提供外壳的第一和第二壳体构件的壳体。 一种馈电线，其与所述壳体和所述壳体电绝缘，并通过玻璃 - 金属密封件延伸，至少一个阳极电连接在所述壳体内，阴极和电解质。 阴极是沉积在第一和第二壳体构件的平面上的阴极活性材料。

公开(公告)号：US20160151635A1

公开(公告)日：2016-06-02

申请号：US14556239

申请日：2014-12-01

Applicant: Greatbatch Ltd.

Inventor： Christine A. Frysz ,  Robert A. Stevenson ,  Thomas Marzano ,  Xiaohong Tang ,  William C. Thiebolt ,  Keith W. Seitz

IPC: A61N1/39 ,  A61N1/08 ,  A61N1/362

CPC classification number: A61N1/3968 ,  A61N1/086 ,  A61N1/362 ,  A61N1/3718 ,  A61N1/3754 ,  H03H1/00 ,  H03H7/0107 ,  H03H7/1758 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/005 ,  H03H2001/0085 ,  H03H2007/013

Abstract: A hermetic terminal assembly for an AIMD includes a shielded three-terminal flat-through EMI energy dissipating filter and a hermetically sealed feedthrough configured to be attachable to the ferrule or AIMD housing. The flat-through filter includes a first shield plate, an active electrode plate, and a second shield plate where the shield plates are electrically coupled to a metallization which in turn is coupled either to the ferrule or AIMD housing. The feedthrough includes an alumina substrate comprised of at least 96% alumina and a via hole with a substantially closed pore and substantially pure platinum fill. The platinum fill forms a tortuous and mutually conformal knitline or interface between the alumina substrate and the platinum fill, wherein the platinum fill is electrically coupled to at least one active electrode plate in non-conductive relationship to the at least one first and second shield plates.

Abstract translation: 用于AIMD的密封端子组件包括屏蔽的三端子平通EMI消散滤波器和被配置为可附接到套圈或AIMD壳体的密封馈通。 平通过滤器包括第一屏蔽板，有源电极板和第二屏蔽板，其中屏蔽板电耦合到金属化，金属化层又连接到套圈或AIMD壳体。 馈通包括由至少96％的氧化铝组成的氧化铝衬底和具有基本上闭孔的通孔和基本上纯的铂填充物。 铂填充物在氧化铝基底和铂填充物之间形成曲折且相互共形的编织物或界面，其中铂填充物与非至少一个第一和第二屏蔽板的非导电关系电耦合到至少一个有源电极板 。