摘要:
A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.
摘要:
A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.
摘要:
One embodiment of a method for detecting, sampling, analyzing, and correcting hot spots in an integrated circuit design allows the identification of the weakest patterns within each design layer, the accurate determination of the impact of process drifts upon the patterning performance of the real mask in a real scanner, and the optimum process correction, process monitoring, and RET improvements to optimize integrated circuit device performance and yield. The combination of high speed simulation coupled with massive data collection capability on actual aerial images and/or resist images at the specific patterns of interest provides a complete methodology for optimum RET implementation and process monitoring.
摘要:
A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.
摘要:
A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.
摘要:
A method for operation of an exposure tool in the fabrication of an integrated circuit to control registration between a preceding layer of and a succeeding layer. The preceding layer having a first alignment mark and a first registration mark. The succeeding layer is aligned to the preceding layer using an exposure tool. The succeeding layer has a second alignment mark and a second registration mark. The exposure tool measures alignment of the first alignment mark relative to the second alignment mark. After additional process steps are performed, a measurement tool measures registration relating to relative positions of the first registration mark and the second registration mark. Both the alignment information from the exposure tool and the registration information from the measurement tool is analyzed to determine corrections to improve registration between the layers, and the operation of the exposure tool is altered to improve registration.