Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing
    23.
    发明授权
    Method for detecting, sampling, analyzing, and correcting marginal patterns in integrated circuit manufacturing 有权
    在集成电路制造中检测,采样,分析和校正边缘图案的方法

    公开(公告)号:US07853920B2

    公开(公告)日:2010-12-14

    申请号:US11437594

    申请日:2006-05-19

    IPC分类号: G06F17/50 G06K9/00

    摘要: One embodiment of a method for detecting, sampling, analyzing, and correcting hot spots in an integrated circuit design allows the identification of the weakest patterns within each design layer, the accurate determination of the impact of process drifts upon the patterning performance of the real mask in a real scanner, and the optimum process correction, process monitoring, and RET improvements to optimize integrated circuit device performance and yield. The combination of high speed simulation coupled with massive data collection capability on actual aerial images and/or resist images at the specific patterns of interest provides a complete methodology for optimum RET implementation and process monitoring.

    摘要翻译: 用于在集成电路设计中检测,采样,分析和校正热点的方法的一个实施例允许识别每个设计层内的最弱图案,精确确定工艺的影响漂移对真实掩模的图案化性能 在真正的扫描仪中,以及最佳的过程校正,过程监控和RET改进,以优化集成电路器件的性能和产量。 将高速仿真与实际航空图像上的海量数据收集能力和/或特定感兴趣图像的抗蚀图像相结合,为最佳的RET实施和过程监控提供了一个完整的方法。

    Photo-Mask and Wafer Image Reconstruction
    25.
    发明申请
    Photo-Mask and Wafer Image Reconstruction 有权
    照片掩模和晶片图像重建

    公开(公告)号:US20100021042A1

    公开(公告)日:2010-01-28

    申请号:US12475338

    申请日:2009-05-29

    IPC分类号: G06T7/00

    摘要: A system receives a mask pattern and a first image of at least a portion of a photo-mask corresponding to the mask pattern. The system determines a second image of at least the portion of the photo-mask based on the first image and the mask pattern. This second image is characterized by additional spatial frequencies than the first image.

    摘要翻译: 系统接收掩模图案和对应于掩模图案的光掩模的至少一部分的第一图像。 该系统基于第一图像和掩模图案来确定光掩模的至少一部分的第二图像。 该第二图像的特征在于比第一图像更多的空间频率。

    Method and application of metrology and process diagnostic information for improved overlay control
    26.
    发明授权
    Method and application of metrology and process diagnostic information for improved overlay control 有权
    计量和过程诊断信息的方法和应用,用于改进覆盖控制

    公开(公告)号:US06868301B1

    公开(公告)日:2005-03-15

    申请号:US10364769

    申请日:2003-02-11

    申请人: Moshe E. Preil

    发明人: Moshe E. Preil

    IPC分类号: G03F7/20 G03F9/00 G06F19/00

    CPC分类号: G03F9/7046 G03F7/70633

    摘要: A method for operation of an exposure tool in the fabrication of an integrated circuit to control registration between a preceding layer of and a succeeding layer. The preceding layer having a first alignment mark and a first registration mark. The succeeding layer is aligned to the preceding layer using an exposure tool. The succeeding layer has a second alignment mark and a second registration mark. The exposure tool measures alignment of the first alignment mark relative to the second alignment mark. After additional process steps are performed, a measurement tool measures registration relating to relative positions of the first registration mark and the second registration mark. Both the alignment information from the exposure tool and the registration information from the measurement tool is analyzed to determine corrections to improve registration between the layers, and the operation of the exposure tool is altered to improve registration.

    摘要翻译: 一种用于在制造集成电路中的曝光工具的操作方法,以控制前一层和后一层之间的配准。 前一层具有第一对准标记和第一对准标记。 使用曝光工具将后一层与前一层对准。 后续层具有第二对准标记和第二对准标记。 曝光工具测量第一对准标记相对于第二对准标记的对准。 在执行额外的处理步骤之后,测量工具测量与第一对准标记和第二对准标记的相对位置相关的注册。 分析来自曝光工具的对准信息和来自测量工具的注册信息,以确定校正以改善层之间的配准,并且改变曝光工具的操作以改善注册。