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公开(公告)号：US08059406B1
公开(公告)日：2011-11-15
申请号：US12818268
申请日：2010-06-18
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： In a memory device and its heat sink, the memory device includes a memory, a heat sink mounted onto the memory and a clamping element, and the heat sink includes an isothermal vapor chamber plate and a heat dissipating body, and the isothermal vapor chamber plate is attached onto an external side of the memory and includes an insert portion, and the heat dissipating body includes a base plate, a plurality of heat dissipating fins extended from the base plate, and a pawl arm extended from the base plate and in an opposite direction of the fins, and the heat dissipating body is coupled to the insert portion in a replaceable manner by the pawl arm, and the clamping element is provided for clamping the base plate and the isothermal vapor chamber plate, such that the heat dissipating body can be replaced on the isothermal vapor chamber plate easily.
摘要翻译： 在存储器件及其散热器中，存储器件包括存储器，安装在存储器上的散热器和夹紧元件，散热器包括等温蒸气室板和散热体，以及等温蒸气室板 附接到存储器的外侧，并且包括插入部分，并且散热体包括基板，从基板延伸的多个散热翅片和从基板延伸的棘爪臂，并且在相对的 鳍片的方向和散热体通过棘爪臂以可更换的方式联接到插入部分，并且夹紧元件被设置用于夹紧基板和等温蒸气室板，使得散热体可以 在等温蒸汽室板上更换。
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公开(公告)号：US20110067850A1
公开(公告)日：2011-03-24
申请号：US12563550
申请日：2009-09-21
CPC分类号： H01L23/4006 , F28D15/0233 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A buckling device for electronic heating element, inter-assembled with a thermally conductive body, includes a cooling plate, a pair of fixing legs bent-and-extended from the cooling plate and formed under the cooling plate and a fixing arm bent-and-extended from the cooling plate and formed under the cooling plate. On the cooling plate, a plurality of slots are stamped, one side of each of which is bent and configured into a cooling piece. The thermally conductive body is fixed by being sandwiched between the fixing arm and the cooling plate. Thereby, the buckling device can be used in a thin electronic device to reduce its assembly and machining costs on a large scale.
摘要翻译： 用于与导热体组装的电子加热元件的弯曲装置包括冷却板，从冷却板弯曲并延伸并形成在冷却板下方的一对固定腿，以及固定臂， 从冷却板延伸并形成在冷却板下面。 在冷却板上，多个槽被冲压，每个槽被弯曲并构成一个冷却片。 导热体通过夹在固定臂和冷却板之间而被固定。 因此，该弯曲装置可以用于薄的电子装置中以大规模地减少组装和加工成本。
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公开(公告)号：US20110067844A1
公开(公告)日：2011-03-24
申请号：US12793726
申请日：2010-06-04
IPC分类号： F28D15/04
CPC分类号： F28D15/04 , F28D15/0233 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： The planar heat pipe includes a metallic tube composed of two flat extensions and a shrinked intermediate structure, a wick structure, a working fluid and a support element. The flat extensions are separately located at two ends of the metallic tube. The intermediate structure connects between the flat extensions. The wick structure is arranged in the metallic tube. The working fluid is injected in the metallic tube and attached in the wick structure. The support element is disposed in the metallic tube for supporting the wick structure.
摘要翻译： 平面热管包括由两个扁平延伸部和收缩的中间结构，芯结构，工作流体和支撑元件组成的金属管。 扁平延伸部分别位于金属管的两端。 中间结构连接在扁平延伸部分之间。 芯体结构布置在金属管中。 将工作流体注入金属管并附着在芯结构中。 支撑元件设置在用于支撑芯结构的金属管中。
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公开(公告)号：US07875900B2
公开(公告)日：2011-01-25
申请号：US12325554
申请日：2008-12-01
IPC分类号： H01L33/00
CPC分类号： H05K1/0203 , F21K9/00 , F21V29/51 , F21V29/75 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , H05K1/0272 , H05K1/056 , H05K1/181 , H05K2201/10106 , H05K2203/088
摘要： A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.
摘要翻译： 发光二极管（LED）的导热结构包括蒸气室，绝缘层，导电层和多个LED。 在本发明中，绝缘层被镀在蒸气室的表面上; 设置在绝缘层上的导电层与蒸气室电分离并具有第一电极和第二电极; 布置在绝缘层上的LED分别具有连接到第一电极的第一支脚和连接到第二电极的第二支脚; 因此，本发明具有优异的热传导和散热性能，能够延长LED的寿命。
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公开(公告)号：US20090223651A1
公开(公告)日：2009-09-10
申请号：US12170613
申请日：2008-07-10
IPC分类号： F28D15/00
CPC分类号： F28D15/0233 , F28F1/24 , G06F1/20 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A panel heat-dissipating device includes a heat-conducting base, a vapor chamber, and at least one fin assembly. The heat-conducting base has a heat-conducting surface for allowing the vapor chamber to be thermally connected thereon. The vapor chamber forms extending portions toward the lateral of the heat-conducting base. The extending portion of the vapor chamber toward the lateral of the heat-conducting base allows the fin assembly to be disposed thereon. The fin assembly and the heat-conducting base are located to the same side of the vapor chamber. Via this arrangement, the heat-dissipating device occupies less space in the height.
摘要翻译： 面板散热装置包括导热基座，蒸气室和至少一个翅片组件。 导热基座具有用于使蒸气室与其热连接的导热表面。 蒸气室向导热基体的侧面形成延伸部分。 蒸气室的延伸部分朝向导热底座的侧面允许翅片组件设置在其上。 翅片组件和导热基座位于蒸气室的同一侧。 通过这种布置，散热装置在高度上占据较少的空间。
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公开(公告)号：US20110297355A1
公开(公告)日：2011-12-08
申请号：US12795648
申请日：2010-06-07
IPC分类号： F28D15/04
CPC分类号： F28D15/0233 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.
摘要翻译： 用于电子发热元件的热传导的导热组件包括热管和蒸气室。 蒸气室具有与电子发热元件热接触的蒸发部分和位于远离蒸发部分并围绕热管缠绕的导热部分。 通过这种布置，可以大大提高蒸气室和热管之间的接触面积和导热效率，从而获得导热效率优异的导热组件。 通过散热翅片组件和风扇连接到热管，可以获得具有上述导热组件的散热装置，从而可以将蒸气室和热管的热量快速耗散到 外。
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公开(公告)号：US20110094723A1
公开(公告)日：2011-04-28
申请号：US12605804
申请日：2009-10-26
CPC分类号： H01L23/427 , F28D15/0233 , H01L2924/0002 , H01L2924/00
摘要： A combination of a fastener and a thermal-conducting member is mounted on an electronic heat-generating member. The fastener includes a plate provided with an opening for allowing the electronic heat-generating element to be disposed therein; posts connected to the plate and formed around the opening; and clamping arms extending from the plate opposite to the posts. The thermal-conducting member is disposed on the plate to span the opening. The clamping arms are bent to press in the thermal-conducting member, thereby forming on the surface of the thermal-conducting member with a plurality of positioning notches for allowing the clamping arms to be inserted therein. With this arrangement, the fastener can be combined with the thermal-conducting member tightly. Thus, the heat generated by the electronic heat-generating element can be continuously conducted to the outside, so that the temperature of the electronic heat-generating element can be kept in a normal range.
摘要翻译： 紧固件和导热构件的组合安装在电子发热构件上。 紧固件包括设置有允许电子发热元件设置在其中的开口的板; 连接到板上并形成在开口周围的柱; 以及从板对面延伸的夹持臂。 导热构件设置在板上以跨越开口。 夹持臂被弯曲以压在导热构件中，从而在导热构件的表面上形成多个用于允许夹持臂插入的定位凹口。 通过这种布置，紧固件可以与导热构件紧密结合。 因此，可以将电子发热元件产生的热量连续地传导到外部，使得电子发热元件的温度可以保持在正常范围内。
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公开(公告)号：US20120186798A1
公开(公告)日：2012-07-26
申请号：US13014231
申请日：2011-01-26
IPC分类号： F28F1/14
CPC分类号： F28F1/14 , F21K9/00 , F21V29/717 , F21V29/77 , F21V29/773 , F21V29/81 , F21V29/83 , F21V29/89 , F21Y2105/10 , F21Y2115/10 , F28D15/0233 , F28D15/0275 , F28F1/10
摘要： A cooling module for an LED lamp includes a thermostatic plate, a hollow column, and a plurality of cooling fins. The thermostatic plate has an evaporating segment and a pair of condensing segments extending from the evaporating segment. The outer surface of the hollow column has a pair of grooves corresponding to each other. The condensing segments of the thermostatic plate are buried in the grooves. The cooling fins surround and thermally contact the outer rim of the hollow column and the condensing segments.
摘要翻译： 一种用于LED灯的冷却模块包括恒温板，中空柱和多个散热片。 恒温板具有蒸发段和从蒸发段延伸的一对冷凝段。 中空柱的外表面具有彼此对应的一对槽。 恒温板的冷凝段被埋在凹槽中。 冷却片围绕并热接触空心柱的外缘和冷凝段。
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公开(公告)号：US08134834B2
公开(公告)日：2012-03-13
申请号：US12818341
申请日：2010-06-18
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.
摘要翻译： 用于存储器的夹式散热器包括两个导热模块，枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔，使得每个散热体串联安装，并且弹性元件被套在枢轴上，并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧，以提高组装和移除过程的便利性和完整性，以实现快速组装或去除效果并防止部件丢失。
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公开(公告)号：US20110232877A1
公开(公告)日：2011-09-29
申请号：US12729279
申请日：2010-03-23
IPC分类号： F28D15/04 , H01L23/427
CPC分类号： H01L23/427 , F28D15/0266 , F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A compact vapor chamber configured to thermally conduct heat of an electronic heat-generating element includes a flat sealed casing; a wick structure arranged on inner walls of the flat sealed casing; a working fluid filled inside the flat sealed casing; and an evaporating section formed on a portion of the vapor chamber. An outer surface of the flat sealed casing on the evaporating section has a recess for covering the electronic heat-generating element. The recess is brought into thermal contact with the electronic heat-generating element. With this arrangement, when the compact vapor chamber is brought into thermal contact the electronic heat-generating element for heat dissipation, the distance of the electronic heat-generating element protruding from the compact vapor chamber is reduced, thereby facilitating the compact design of an electronic product. Further, the present invention provides a heat-dissipating module having such a compact vapor chamber.
摘要翻译： 构造成热传导电子发热元件的小型蒸汽室包括平的密封外壳; 布置在平面密封壳体的内壁上的芯结构; 填充在平面密封壳体内的工作流体; 以及形成在所述蒸气室的一部分上的蒸发部。 蒸发部上的扁平密封壳体的外表面具有用于覆盖电子发热元件的凹部。 凹部与电子发热元件热接触。 通过这种布置，当紧凑的蒸气室与用于散热的电子发热元件热接触时，从紧凑的蒸气室突出的电子发热元件的距离减小，从而有助于电子的紧凑的设计 产品。 此外，本发明提供一种具有这种紧凑的蒸气室的散热模块。
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