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公开(公告)号：US11051427B2
公开(公告)日：2021-06-29
申请号：US16543120
申请日：2019-08-16
Applicant: Google LLC
Inventor： Soheil Farshchian , Emad Samadiani
IPC: F28F7/00 , H05K7/20 , F28D15/04 , H01L23/427
Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.
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公开(公告)号：US20210100136A1
公开(公告)日：2021-04-01
申请号：US17117674
申请日：2020-12-10
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Angela Chen , Soheil Farshchian , Winnie Leung , Michael Chi Kin Lau
Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
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公开(公告)号：US20210007249A1
公开(公告)日：2021-01-07
申请号：US17026978
申请日：2020-09-21
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Michael Chi Kin Lau , Bill Dailey , Angela Chen , Winnie Leung , Peter Pellerzi , Soheil Farshchian
Abstract: A data center system includes a frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, the plurality of bays arranged in a plurality of stacked layers of bays, the plurality of stacked layers including at least a first layer of bays and a second layer of bays positioned vertically above the first layer of bays; a plurality of server racks positioned in the bays of the first layer of bays, each of the server racks configured to support a plurality of data center server devices that define a particular amount of computing power; and a plurality of network switches positioned in the bays of the second layer of bays, each of the network switches communicably coupled to at least one of the data center server devices in the first layer of bays.
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公开(公告)号：US10888029B2
公开(公告)日：2021-01-05
申请号：US16150842
申请日：2018-10-03
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Angela Chen , Soheil Farshchian , Winnie Leung , Michael Chi Kin Lau
Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
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公开(公告)号：US10716234B1
公开(公告)日：2020-07-14
申请号：US16561751
申请日：2019-09-05
Applicant: Google LLC
Inventor： Kenneth Dale Shaul , Thomas R. Kowalski , Gary Joseph Hensley , Soheil Farshchian , Pascal Kam
Abstract: A server rack seismic restraint includes a rear restraint assembly configured to attach to a support surface that is operable to support a data center server rack. The rear restraint assembly includes at least one lateral member positioned to receive the server rack and restrain the server rack against lateral movement based on a force applied to the server rack; and an angled bracket positioned to receive the server rack and restrain the server rack against vertical movement based on the force applied to the server rack. The server rack seismic restraint also includes a front restraint assembly configured to attach to the support surface and engage the server rack to restrain the server rack against vertical movement based on the force applied to the server rack.
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Patent Agency Ranking
公开(公告)号：US20200015388A1
公开(公告)日：2020-01-09
申请号：US16575953
申请日：2019-09-19
Applicant: Google LLC
Inventor： Soheil Farshchian , Kenneth Dale Shaul
IPC: H05K7/20 , F28D15/02 , H01L23/473
Abstract: A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
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公开(公告)号：US10433461B2
公开(公告)日：2019-10-01
申请号：US15797996
申请日：2017-10-30
Applicant: Google LLC
Inventor： Soheil Farshchian , Emad Samadiani
IPC: F28D11/06 , F28G7/00 , H05K7/20 , F28D15/04 , H01L23/427
Abstract: A cooling system for an electronic circuit package is provided. The cooling system includes a heat transfer plate positioned in thermal contact with an electronic circuit package surface and forming the bottom surface of an evaporative region of the cooling system. The cooling system also includes a plurality of condensing tubes in fluid communication with, and extending away from, the evaporative region, such that the evaporative region and the condensing tubes together form a single, uninterrupted, sealed enclosure. The cooling system also includes a fluid within the sealed enclosure. The cooling system also includes a plurality of spacers filling gaps between the heat transfer plate and the condensing tubes, such that each spacer is configured as an independent component to allow the passage of fluid through the interior space of each spacer. The cooling system also includes a plurality of wicks, where each wick is positioned partially within a corresponding spacer to which it is fluidically coupled.
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公开(公告)号：US20190264699A1
公开(公告)日：2019-08-29
申请号：US16410670
申请日：2019-05-13
Applicant: Google LLC
Inventor： Kenneth Dale Shaul , Soheil Farshchian , Roy Michael Bannon , Angela Chen , Jonathan D. Beck
Abstract: Methods, systems, and apparatus, including a housing defining a top surface, a bottom surface, and first and second side surfaces. Also included is a first rail extending from the first side surface and a second rail extending from the second surface such that when the first and second rails are slidably engaged with a third surface. A blower device is included that is axially disposed between the top and bottom surface, wherein a first end of the housing defines a first plenum outlet, the top surface defines a plenum inlet, the bottom surface defines a second plenum outlet that is positioned on a second side of the blower device and that fluidly couples the first plenum chamber to the second plenum chamber. Further, the second plenum chamber is formed by the first and second rails, the bottom surface and the third surface has a third plenum outlet.
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公开(公告)号：US10349561B2
公开(公告)日：2019-07-09
申请号：US15208951
申请日：2016-07-13
Applicant: Google LLC
Inventor： Soheil Farshchian , Emad Samadiani
Abstract: A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.
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公开(公告)号：US10123461B2
公开(公告)日：2018-11-06
申请号：US15479740
申请日：2017-04-05
Applicant: Google LLC
Inventor： Jayson Michael Jochim , Angela Chen , Soheil Farshchian , Winnie Leung , Michael Chi Kin Lau
Abstract: A data center cooling system includes a server rack frame assembly that includes a plurality of bays defined along a lengthwise dimension of the frame assembly, each bay including a volume defined at least in part by a specified height that is orthogonal to the lengthwise dimension and a specified width that is parallel to the lengthwise dimension and sized to at least partially enclose at least one server rack configured to support a plurality of data center computing devices; and at least one cooling unit sized for a bay of the plurality of bays of the server rack frame assembly and configured to circulate a heated airflow from an open back side of the at least one server rack, cool the heated air, and circulate a cooling airflow through an open front side of the at least one server rack.
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