公开(公告)号：US20190166706A1

公开(公告)日：2019-05-30

申请号：US15823262

申请日：2017-11-27

Applicant: Hamilton Sundstrand Corporation

Inventor： Kenneth J. Trotman ,  Rachel Welsh

IPC: H05K5/02 ,  F16K24/04

Abstract: A vent/drain cover for an electronics enclosure includes a cover body defining an axis and a surface with a first wall protruding from the surface in a direction and a second wall protruding from the surface in the same direction but displaced radially from the first wall. The first wall has a first channel formed therein that is defined by a portion of the first wall that does not extend as far from the surface as the balance of the first wall. The second wall has a second channel defined by a portion of the second wall that does not extend as far from the surface as the balance of the second wall, the first channel being circumferentially offset from the second channel. Electronics enclosures and methods of venting electronics assemblies are also described.

公开(公告)号：US10264668B2

公开(公告)日：2019-04-16

申请号：US15332659

申请日：2016-10-24

Applicant: Hamilton Sundstrand Corporation

Inventor： David Perley ,  Kenneth J. Trotman

IPC: H05K1/02 ,  H05K3/30 ,  H05K7/02 ,  H01L23/34

Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

公开(公告)号：US20180235069A1

公开(公告)日：2018-08-16

申请号：US15381149

申请日：2016-12-16

Applicant: Hamilton Sundstrand Corporation

Inventor： Kenneth J. Trotman ,  Jason C. Duffy

IPC: H05K1/02 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20 ,  H05K3/30 ,  H01L23/367

CPC classification number: H05K1/0203 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/4006 ,  H01L23/42 ,  H01L23/433 ,  H05K3/303 ,  H05K7/20436

Abstract: A heat sink for use with a thermal pad includes a heat sink body to engage the thermal pad, and a plurality of relief holes formed within the heat sink body, wherein the plurality of relief holes receives a portion of the thermal pad to limit an applied heat sink pressure onto the component.

公开(公告)号：US20170176148A1

公开(公告)日：2017-06-22

申请号：US14970918

申请日：2015-12-16

Applicant: Hamilton Sundstrand Corporation

Inventor： David Perley ,  Kenneth J. Trotman

IPC: F41H5/02 ,  G06F1/16

CPC classification number: F41H5/023 ,  F41H5/00 ,  G06F1/1601 ,  G06F1/182

Abstract: An enclosure includes an enclosure body having an enclosure cavity, the enclosure body formed from a first material, and at least one ballistic tolerant plate disposed within the enclosure cavity to form a plurality of channel enclosures within the enclosure cavity, the at least one ballistic tolerant plate formed from a ballistic tolerant material.

公开(公告)号：US20170052921A1

公开(公告)日：2017-02-23

申请号：US14831169

申请日：2015-08-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Jason C. Duffy ,  Kenneth J. Trotman

IPC: G06F13/40 ,  H01R13/66

CPC classification number: G06F13/4081 ,  H01R12/73 ,  H01R13/5202 ,  H01R13/622 ,  H01R13/6658 ,  H01R13/6675 ,  H01R31/065 ,  H01R2201/26 ,  H03M1/00

Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.

Abstract translation: 有源输入/输出连接器包括封装在壳体内的第一印刷电路板和第二印刷电路板。 第一插头与第一印刷电路板电子通信。 第二插头与第二印刷电路板电子通信。 第一和第二印刷电路板被连接用于将传感器信号从第一插头传递到第二插头。

公开(公告)号：US20150000871A1

公开(公告)日：2015-01-01

申请号：US13932651

申请日：2013-07-01

Applicant: Hamilton Sundstrand Corporation

Inventor： Rachel Farner ,  Jay W. Kokas ,  Kenneth J. Trotman ,  Kerry R. Querns

IPC: H05K7/20

CPC classification number: H05K7/20681

Abstract: A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a heat pipe in each of the plurality of fins that is capable of transferring heat from the chassis to the surrounding ambient by absorbing heat from the chassis at a first end of the heat pipe and releasing the heat into the ambient at a second end of the heat pipe.

Abstract translation: 具有用于支撑印刷电路板的散热能力增强的装置包括用于保持印刷电路板的底盘，附接到底盘的多个散热片，以及能够从底盘传热的多个散热片中的每一个中的热管 通过在热管的第一端处从底架吸收热量并在热管的第二端处将热量释放到环境中来传递到周围环境。

公开(公告)号：US20140153191A1

公开(公告)日：2014-06-05

申请号：US13693494

申请日：2012-12-04

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Rachel Farner ,  Kenneth J. Trotman ,  Jay W. Kokas ,  Kerry R. Querns

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

Abstract translation: 电子部件和冷却系统具有平面的印刷电路板。 电气部件安装在印刷电路板的平面的一侧。 罩子位于电子部件的外侧。 发动机罩上的脚部延伸到印刷电路板，并形成相对于电气部件远离一侧的内表面。 机架具有从电气部件连接到印刷线路板并且在印刷线路板的平坦表面的相对侧上的柱。 机箱延伸到远离印刷电路板的远端部分。 热管通常是细长的，并且位于罩的与电气部件相对的一侧。 热管延伸到机箱的远程部分，以将热量从罩传递到底盘。