中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.015 seconds)

    Electronic component cooling hood and heat pipe
    2.
    发明授权
    Electronic component cooling hood and heat pipe 有权
    电子部件冷却罩和热管

    公开(公告)号：US09013879B2

    公开(公告)日：2015-04-21

    申请号：US13693494

    申请日：2012-12-04

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Rachel Farner ,  Kenneth J. Trotman ,  Jay W. Kokas ,  Kerry R. Querns

    IPC: H05K7/20 ,  H01L23/473

    CPC classification number: H05K7/20336 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

    Abstract translation: 电子部件和冷却系统具有平面的印刷电路板。 电气部件安装在印刷电路板的平面的一侧。 罩子位于电子部件的外侧。 发动机罩上的脚部延伸到印刷电路板，并形成相对于电气部件远离一侧的内表面。 机架具有从电气部件连接到印刷线路板并且在印刷线路板的平坦表面的相对侧上的柱。 机箱延伸到远离印刷电路板的远端部分。 热管通常是细长的，并且位于罩的与电气部件相对的一侧。 热管延伸到机箱的远程部分，以将热量从罩传递到底盘。

    HOUSING WITH HEAT PIPES INTEGRATED INTO ENCLOSURE FINS
    3.
    发明申请
    HOUSING WITH HEAT PIPES INTEGRATED INTO ENCLOSURE FINS 审中-公开
    将热管集成在外壳内

    公开(公告)号：US20150000871A1

    公开(公告)日：2015-01-01

    申请号：US13932651

    申请日：2013-07-01

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Rachel Farner ,  Jay W. Kokas ,  Kenneth J. Trotman ,  Kerry R. Querns

    IPC: H05K7/20

    CPC classification number: H05K7/20681

    Abstract: A device with increased heat dissipation abilities for supporting printed wiring boards includes a chassis for holding printed wiring boards, a plurality of fins attached to the chassis, and a heat pipe in each of the plurality of fins that is capable of transferring heat from the chassis to the surrounding ambient by absorbing heat from the chassis at a first end of the heat pipe and releasing the heat into the ambient at a second end of the heat pipe.

    Abstract translation: 具有用于支撑印刷电路板的散热能力增强的装置包括用于保持印刷电路板的底盘，附接到底盘的多个散热片，以及能够从底盘传热的多个散热片中的每一个中的热管 通过在热管的第一端处从底架吸收热量并在热管的第二端处将热量释放到环境中来传递到周围环境。

    Electronic Component Cooling Hood and Heat Pipe
    4.
    发明申请
    Electronic Component Cooling Hood and Heat Pipe 有权
    电子部件冷却罩和热管

    公开(公告)号：US20140153191A1

    公开(公告)日：2014-06-05

    申请号：US13693494

    申请日：2012-12-04

    Applicant: HAMILTON SUNDSTRAND CORPORATION

    Inventor： Rachel Farner ,  Kenneth J. Trotman ,  Jay W. Kokas ,  Kerry R. Querns

    IPC: H05K7/20

    CPC classification number: H05K7/20336 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An electronic component and cooling system has a printed wiring board, which is planar. An electrical component is mounted on one side of the planar surface of the printed wiring board. A hood is positioned outwardly of the electronic component. Legs on the hood extend to the printed wiring board, and form an inner surface that is positioned away from the one side relative to the electrical component. A chassis has posts connected to the printed wiring board and on an opposed side of the planar surface of the printed wiring board from the electrical component. The chassis extends to a remote portion, beyond the printed wiring board. A heat pipe is generally elongate and positioned on an opposed side of the hood from the electrical component. The heat pipe extends to the remote portion of the chassis to transfer heat from the hood to the chassis.

    Abstract translation: 电子部件和冷却系统具有平面的印刷电路板。 电气部件安装在印刷电路板的平面的一侧。 罩子位于电子部件的外侧。 发动机罩上的脚部延伸到印刷电路板，并形成相对于电气部件远离一侧的内表面。 机架具有从电气部件连接到印刷线路板并且在印刷线路板的平坦表面的相对侧上的柱。 机箱延伸到远离印刷电路板的远端部分。 热管通常是细长的，并且位于罩的与电气部件相对的一侧。 热管延伸到机箱的远程部分，以将热量从罩传递到底盘。

    HEAT PIPE EMBEDDED HEAT SINK WITH INTEGRATED POSTS
    6.
    发明申请
    HEAT PIPE EMBEDDED HEAT SINK WITH INTEGRATED POSTS 审中-公开
    热管嵌入式散热器与集成位置

    公开(公告)号：US20170042017A1

    公开(公告)日：2017-02-09

    申请号：US13932671

    申请日：2013-07-01

    Applicant: Hamilton Sundstrand Corporation

    Inventor： Jay W. Kokas ,  Kenneth J. Trotman ,  Kerry R. Querns ,  Rachel Farner

    IPC: H05K1/02

    Abstract: An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts.

    Abstract translation: 一种装置包括散热器和支撑散热片的支柱，该散热片与散热片整体形成。 该装置还可以包括附接到散热器的顶侧的印刷线路板，电子部件附接到印刷线路板，多个柱集成到散热器的底侧并从散热器向外延伸，其中 散热器和多个柱体是单片形成的，并且一个热管附接到散热器的底侧，第一端靠近电子部件，第二端靠近多个柱之一。

Patent Agency Ranking