-
公开(公告)号：US20210219444A1
公开(公告)日：2021-07-15
申请号：US17213095
申请日：2021-03-25
Applicant: Hamilton Sundstrand Corporation
Inventor： Kenneth J. Trotman , Rachel Welsh
Abstract: A vent/drain cover for an electronics enclosure includes a cover body defining an axis and a surface with a first wall protruding from the surface in a direction and a second wall protruding from the surface in the same direction but displaced radially from the first wall. The first wall has a first channel formed therein that is defined by a portion of the first wall that does not extend as far from the surface as the balance of the first wall. The second wall has a second channel defined by a portion of the second wall that does not extend as far from the surface as the balance of the second wall, the first channel being circumferentially offset from the second channel. Electronics enclosures and methods of venting electronics assemblies are also described.
-
公开(公告)号：US20190124762A1
公开(公告)日：2019-04-25
申请号：US16224023
申请日：2018-12-18
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
IPC: H05K1/02 , H01L23/42 , H05K3/30 , H01L23/367 , H05K7/02
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
公开(公告)号：US10198391B2
公开(公告)日：2019-02-05
申请号：US14831169
申请日：2015-08-20
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
Abstract: An active input/output connector includes a first printed circuit board and a second printed circuit board enclosed within a housing. A first plug is in electronic communication with the first printed circuit board. A second plug is in electronic communication with the second printed circuit board. The first and second printed circuit boards are connected for communication of sensor signals from the first plug to the second plug.
-
公开(公告)号：US20180116048A1
公开(公告)日：2018-04-26
申请号：US15332659
申请日：2016-10-24
Applicant: Hamilton Sundstrand Corporation
Inventor： David Perley , Kenneth J. Trotman
CPC classification number: H05K1/0272 , H01L23/34 , H05K1/0203 , H05K1/0209 , H05K3/306 , H05K7/02 , H05K2201/06 , H05K2201/066 , H05K2201/10166 , H05K2203/17
Abstract: A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.
-
公开(公告)号：US20240074089A1
公开(公告)日：2024-02-29
申请号：US17821557
申请日：2022-08-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Kenneth J. Trotman
IPC: H05K7/20
CPC classification number: H05K7/20145
Abstract: An electronic assembly includes one or more electronic components and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. The cooling airflow outlet is downward facing toward the vertically bottom surface such that the cooling airflow flows out of the cooling airflow outlet a downward direction toward the vertically bottom surface.
-
Patent Agency Ranking
公开(公告)号：US20220418170A1
公开(公告)日：2022-12-29
申请号：US17360839
申请日：2021-06-28
Applicant: Hamilton Sundstrand Corporation
Inventor： Jason C. Duffy , Kenneth J. Trotman
Abstract: A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.
-
公开(公告)号：US20150000961A1
公开(公告)日：2015-01-01
申请号：US13932699
申请日：2013-07-01
Applicant: Hamilton Sundstrand Corporation
Inventor： Rachel Farner , Jay W. Kokas , Kenneth J. Trotman , Kerry R. Querns
IPC: H05K1/02
CPC classification number: H05K1/0209 , H05K1/0204 , H05K3/0061 , H05K2201/10416 , H05K2201/10553
Abstract: An apparatus includes a printed wiring board, a post that supports the printed wiring board, and a heat pipe on the printed wiring board with a first end positioned near an electronic component attached to the printed wiring board and a second end positioned near the post.
Abstract translation: 一种装置包括印刷线路板，支撑印刷线路板的柱和印刷线路板上的热管，第一端位于靠近印刷线路板的电子部件附近，第二端位于柱附近。
-
公开(公告)号：US20240377867A1
公开(公告)日：2024-11-14
申请号：US18316034
申请日：2023-05-11
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Kenneth J. Trotman
Abstract: Apparatus and associated methods relate to dividing single full-width card slot of an electronics enclosure into two reduced-width card slots. Such conversion is performed by interposing a card-slot dividing member between full-width slide members on opposite interior surfaces of a card cage of the electronics enclosure. The card-slot dividing member has first and second reduced-width slide members aligned directly opposite the full-width slide members on opposite interior surfaces of the card cage. Each of the first and second reduced-width slide members is configured to slidably guide a reduced-width Circuit Card Assembly (CCA) module into the reduced-width card slot cooperatively with a corresponding one of the full-width slide members. In some embodiments, the card-slot dividing member is further configured to operate as a heat exchanger, helping to cool any CCA modules within an interior cavity of the electronics enclosure.
-
公开(公告)号：US20240074090A1
公开(公告)日：2024-02-29
申请号：US17821566
申请日：2022-08-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Kenneth J. Trotman
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20209 , H05K7/206
Abstract: An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.
-
公开(公告)号：US20240074088A1
公开(公告)日：2024-02-29
申请号：US17821540
申请日：2022-08-23
Applicant: Hamilton Sundstrand Corporation
Inventor： Alexander Trotman , Kenneth J. Trotman
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20209 , H05K7/206
Abstract: An electronic assembly includes one or more electronic components and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. The cooling airflow inlet is downward facing toward the vertically bottom surface such that the cooling airflow flows into the cooling airflow inlet an upward direction toward the vertically top surface.
-
-
-
-
-
-
-
-
-
Search Results
27
records
(took 0.014 seconds)
