公开(公告)号：US20230246353A1

公开(公告)日：2023-08-03

申请号：US17587818

申请日：2022-01-28

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Paul Danna ,  Vincent W. Michna ,  Chi Kim Sides

IPC: H01R12/71 ,  H01R12/70 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01R12/716 ,  H01R12/707 ,  H01R43/0256 ,  H05K3/3405

Abstract: A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

公开(公告)号：US20230109810A1

公开(公告)日：2023-04-13

申请号：US17499393

申请日：2021-10-12

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David Scott Chialastri ,  Vincent W. Michna ,  Nilashis Dey ,  Yasir Jamal

IPC: G06F1/20 ,  G06F11/30

Abstract: A compute device may include one or more processors operable at variable performance levels depending upon power supplied from a compute device power supply. A baseboard management controller of the compute device may periodically calculate an adjustment value for the power supply to adjust the power delivered to the one or more processors. The adjustment value may be calculated as a function of a thermal margin between the temperature of the one or more processors over time and a thermal operating limit of the one or more processors.

公开(公告)号：US20230074993A1

公开(公告)日：2023-03-09

申请号：US17466762

申请日：2021-09-03

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Vincent W. Michna ,  Nilashis Dey

IPC: G06F1/26 ,  H05K7/14 ,  G06F1/18

Abstract: Example implementations relate to a power control system for controlling transmission of power from one or more power supply devices to one or more loads of a modular server enclosure. The power control system includes an electronic fuse and a threshold control unit. The electronic fuse is connected between one or more loads and the one or more power supply devices of the modular server enclosure. The threshold control unit is connected to the electronic fuse and to the one or more power supply devices. The threshold control circuit dynamically adjusts a threshold current for the electronic fuse based on a power supply capacity of the one or more power supply devices. The electronic fuse controls the transmission of the power from the one or more power supply devices to the one or more loads based on threshold current and a load current drawn by the one or more loads.

公开(公告)号：US10520530B2

公开(公告)日：2019-12-31

申请号：US15661612

申请日：2017-07-27

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Vincent W. Michna ,  Peter Hansen ,  Julie Victoria Tan

IPC: G06F11/30 ,  G01R19/25

Abstract: Examples disclosed herein relate to determining a power sense output based on a current sense line and a voltage sense line. A first stage circuit has a first voltage input of the current sense line of a server. The first stage circuit also has a feedback voltage input based on an output voltage of the first stage circuit and a variable resistance value based on the voltage sense line of the server. A second stage circuit is used to buffer the first output voltage to yield a second output voltage. A third stage circuit yields a power sense output based on a difference between the second output voltage and the first voltage input.